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公开(公告)号:KR1020110033383A
公开(公告)日:2011-03-31
申请号:KR1020090090863
申请日:2009-09-25
Applicant: 전자부품연구원
CPC classification number: H03F1/0288 , H03F1/56 , H03F3/211 , H03F3/2176 , H03F3/602 , H03F2200/543
Abstract: PURPOSE: A class-F and inverse class-F doherty amplifier are provided to combine a doherty amplifier and a class F with a power amplifier, thereby obtaining maximum efficiency at a back-off spot. CONSTITUTION: An asymmetrical power distributer(100) asymmetrically distributes inputted RF signals to a main amplifier and at least one peaking amplifier respectively. An input matching unit(200) matches input impedance of the peaking amplifier and a main amplifier. An output matching unit(600) matches each output impedance of the main amplifier and the peaking amplifier. First and second 1/4 wavelength transmitting lines(700,800) are connected to an output terminal of the output matching unit.
Abstract translation: 目的:提供了一个F类和F类反向放大器,用于将功率放大器和F类功率放大器组合在一起,从而在退避点获得最大的效率。 构成:不对称功率分配器(100)将输入的RF信号不对称地分配到主放大器和至少一个峰值放大器。 输入匹配单元(200)匹配峰值放大器和主放大器的输入阻抗。 输出匹配单元(600)匹配主放大器和峰化放大器的每个输出阻抗。 第一和第二1/4波长传输线(700,800)连接到输出匹配单元的输出端。
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公开(公告)号:KR1020100137164A
公开(公告)日:2010-12-30
申请号:KR1020090055454
申请日:2009-06-22
Applicant: 전자부품연구원
CPC classification number: H03H7/12 , H03H7/0115 , H03H7/065 , H03H7/075 , H03H7/32
Abstract: PURPOSE: By using the parasitic capacitor formed between the wirings and earth plate the low-pass filter and their layout structure form the low-pass filter. CONSTITUTION: The first and the second inductor(L1, L2) are serially connected between the first and the second end(P1, P2). The first and the second capacitor are respectively parallely connected with the first and the second inductor. The first parasitic capacitor(C11) is in other words at least formed for the first step and the first GND for the connecting point between the first and the second inductor and the first GND for the second end and the first GND the middle in one place.
Abstract translation: 目的:通过使用布线和接地板之间形成的寄生电容,低通滤波器及其布局结构形成低通滤波器。 构成:第一和第二电感器(L1,L2)串联连接在第一和第二端(P1,P2)之间。 第一和第二电容器分别与第一和第二电感器并联连接。 换句话说,第一寄生电容器(C11)至少形成为第一级,第一GND用于第一和第二电感器之间的连接点,第一GND用于第二端,第一GND为一个中间 。
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公开(公告)号:KR1020100122258A
公开(公告)日:2010-11-22
申请号:KR1020090041209
申请日:2009-05-12
Applicant: 전자부품연구원
IPC: H01P1/205
CPC classification number: H01P1/205 , H01P1/2088 , H01P7/065 , H05K1/0221
Abstract: PURPOSE: The ultra-wideband construct of filter and printed circuit board including the same directly embodies the construct of filter in the printed circuit board used for the specific module. The chip filter purchasing cost and chip filter built-in cost are reduced. CONSTITUTION: In the lowest side(100) and top surface(700) of the PCB substrate, the front side ground metal pattern is formed. The resonator circuit pattern is formed in the second metal layer of the second dielectric layer(400) top. Capacitors for the matching property improvement are formed in the first metal layer of the first dielectric layer(200) top.
Abstract translation: 目的:过滤器和印刷电路板的超宽带结构包括相同的直接体现了用于特定模块的印刷电路板中的滤波器结构。 芯片滤波器采购成本和芯片滤波器内置成本降低。 构成:在PCB基板的最下面(100)和顶面(700)上,形成前侧接地金属图案。 谐振器电路图案形成在第二介电层(400)顶部的第二金属层中。 用于匹配性能改进的电容器形成在第一介电层(200)顶部的第一金属层中。
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公开(公告)号:KR1020090072100A
公开(公告)日:2009-07-02
申请号:KR1020070140098
申请日:2007-12-28
Applicant: 전자부품연구원
Abstract: A chip antenna for UWB(Ultra Wide Band) is provided to reduce an antenna size by performing a laminated type chip antenna using high dielectric constant material. A radiation device(100) has a multilayer structure. The radiation device comprises a top plate dielectric(101), a bottom plate dielectric(103), and a metal pattern(102). The metal pattern is interposed between the top plate dielectric and the bottom plate dielectric. A feed line(200) is connected to the radiation device. The feed line is formed into a micro strip shape. A dielectric substrate(500) is arranged between a top ground plane(301) and a bottom ground plane(302). A top via(401) for feeding connects the radiation device to the feed line. A bottom via(402) for feeding connects the feed line, the dielectric substrate, and a bottom ground plane. A dummy pad(600) attaches the radiation device to the dielectric substrate.
Abstract translation: 提供了一种用于UWB(超宽带)的芯片天线,通过使用高介电常数材料执行层叠型芯片天线来减小天线尺寸。 辐射装置(100)具有多层结构。 辐射装置包括顶板电介质(101),底板电介质(103)和金属图案(102)。 金属图案插入在顶板电介质和底板电介质之间。 馈线(200)连接到辐射装置。 供给线形成为微带状。 电介质基板(500)设置在顶部接地平面(301)和底部接地平面(302)之间。 用于进给的顶部通孔(401)将辐射装置连接到进料管线。 用于进给的底部通孔(402)连接馈电线,电介质基底和底部接地平面。 虚拟焊盘(600)将辐射装置附接到电介质基板。
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公开(公告)号:KR100781055B1
公开(公告)日:2007-11-30
申请号:KR1020060132607
申请日:2006-12-22
Applicant: 전자부품연구원
Abstract: A front end module is provided to minimize a mobile communication terminal by patterning a capacitor and a strip line on a dielectric sheet and mounting a transmitting SAW filter, a power amplifier, a power detector, the capacitor, a resistor, and a duplexer as component elements to reduce an area of a circuit board occupied in the mobile communication terminal. A frond end module includes a first-layer dielectric sheet, a second-layer dielectric sheet, third-layer and fourth-layer dielectric sheets, fifth-layer and seventh-layer dielectric sheets, a sixth-layer dielectric sheet, and an eighth-layer dielectric sheet. Components of duplexer(130) including a transmitting SAW filter(100), a power amplifier(110), a power detector(120), a capacitor, a resistor(124), a transmitting filter(132), and a receiving filter(136) are mounted on the first-layer dielectric sheet. A plurality of connection patterns for electrically connecting the first-layer dielectric sheet is formed on the second-layer dielectric sheet. A pattern of the capacitor is formed on the third-layer and fourth-layer dielectric sheets. A ground pattern is formed on the fifth-layer and seventh-layer dielectric sheets. A pattern of a strip line is formed on the sixth-layer dielectric sheet. Plural terminal patterns to be electrically connected with external components are formed on the eighth-layer dielectric sheet.
Abstract translation: 提供前端模块以通过在电介质片上形成电容器和带状线并使安装传输SAW滤波器,功率放大器,功率检测器,电容器,电阻器和双工器的组件来最小化移动通信终端,作为组件 元件,以减少在移动通信终端中占用的电路板的面积。 第一层电介质片,第二层电介质片,第三层和第四层电介质片,第五层和第七层电介质片,第六层电介质片和第八层电介质片, 层介电片。 包括发射SAW滤波器(100),功率放大器(110),功率检测器(120),电容器,电阻器(124),发射滤波器(132)和接收滤波器 136)安装在第一层电介质片上。 在第二层电介质片上形成用于电连接第一层电介质片的多个连接图案。 电容器的图案形成在第三层和第四层电介质片上。 在第五层和第七层电介质层上形成接地图案。 带状线的图案形成在第六层电介质片上。 在第八层电介质片上形成与外部部件电连接的多个端子图案。
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公开(公告)号:KR1020070044880A
公开(公告)日:2007-05-02
申请号:KR1020050101115
申请日:2005-10-26
Applicant: 전자부품연구원
Abstract: 본 발명은 서로 다른 3개의 주파수 대역을 갖는 입출력 신호를 효과적으로 분리할 수 있는 트리플렉서에 관한 것이다.
본 발명에 따른 프리플렉서는, 트리플 밴드 안테나를 통해 수신되는 제1 내지 제3 주파수 대역의 신호 중 제1 및 제2 주파수 대역의 신호를 분리하는 다이플렉서와, 제3 주파수 대역의 신호를 통과시키는 필터와, 트리플 밴드 안테나와 다이플렉서 사이에 접속되어, 스위칭 제어신호에 따라 트리플 밴드 안테나 및 다이플렉서를 접속시키는 제1 스위치 및 트리플 밴드 안테나 및 제1 스위치의 접속점과 필터 사이에 접속되어, 스위칭 제어신호에 따라 트리플 밴드 안테나와 필터를 접속시키는 제2 스위치를 포함하여 이루어진다. 이에 의해, 본 발명에 따르면 상대 대역의 주파수 특성에 영향을 미치는 것을 방지할 수 있음은 물론 삽입손실 특성을 우수하게 할 수 있다.
트리플렉서, CDMA, GPS, PCS, 다이플렉서, BPF-
公开(公告)号:KR102038602B1
公开(公告)日:2019-10-31
申请号:KR1020170089745
申请日:2017-07-14
Applicant: 전자부품연구원
IPC: H01L23/367 , H01L23/28 , H01L23/538 , H01L25/065 , H01L25/07
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公开(公告)号:KR1020170119953A
公开(公告)日:2017-10-30
申请号:KR1020160048300
申请日:2016-04-20
Applicant: 전자부품연구원
IPC: H01L23/367 , H01L23/373 , H01L23/433 , H01L23/48 , H01L23/043 , H01L23/31
CPC classification number: H01L23/3675 , H01L21/52 , H01L21/56 , H01L21/568 , H01L23/13 , H01L23/142 , H01L23/367 , H01L23/3735 , H01L23/3736 , H01L23/485 , H01L23/5389 , H01L2224/04105 , H01L2224/19 , H01L23/043 , H01L23/31 , H01L23/4334 , H01L23/481
Abstract: 본발명은적어도하나이상의수용홀을포함하며, 금속재질로형성되는베이스기판, 상기수용홀에실장되는적어도하나이상의반도체칩 및상기수용홀의내측면과상기반도체칩 사이의이격공간에형성되는방열부재를포함하는반도체패키지를제공한다.
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公开(公告)号:KR101589587B1
公开(公告)日:2016-01-28
申请号:KR1020130161709
申请日:2013-12-23
Applicant: 전자부품연구원 , 전북대학교산학협력단
IPC: H03H7/46
Abstract: 본발명은 T형이중대역정합회로및 그설계방법에관한것으로서, 본발명의 T형이중대역정합회로는일단이입력단에직렬연결되고, 제1 인덕터와제1 커패시터가병렬연결된형태이며, 제1 저지대역에공진주파수를갖는제1 LC 공진부, 상기제1 LC 공진부의타단으로부터분로를형성하여입력단과병렬연결되고, 제2 인덕터와제2 커패시터가직렬연결된형태이며, 제2 저지대역에공진주파수를갖는제2 LC 공진부, 및상기제1 LC 공진부의타단과출력단사이에위치하여상기제1 LC 공진부와직렬연결되고, 제3 인덕터와제3 커패시터가병렬연결된형태이며, 제3 저지대역에공진주파수를갖는제3 LC 공진부를포함하며, 이를통해단일의 T형회로를이용하여이중의통과대역을가지는회로를제공할수 있고, 필요에따라설정된세 개의저지대역에서불필요한고조파및 혼변조성분들이제거된다.
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公开(公告)号:KR101589583B1
公开(公告)日:2016-01-28
申请号:KR1020140002200
申请日:2014-01-08
Applicant: 전자부품연구원
Abstract: 본발명은입력되는전력을증폭시켜출력시키는전류모드클래스-S 구조의이동통신용전력송신기에관한것으로, 출력전력을향상시킬수 있는 Class-S 전력증폭기를제공하는데 있다. 본발명에따른 Class-S 전력증폭기는대역통과델타-시그마변조기으로부터출력되는디지털신호에대한동 위상디지털신호와역 위상디지털신호를 1차증폭하는드라이버와, 드라이버로부터출력되는 1차증폭된동 위상디지털신호와역 위상디지털신호를 2차증폭시키는버퍼증폭부를구비하는드라이버증폭부, 드라이버증폭부로부터출력되는 2차증폭된동 위상디지털신호와역 위상디지털신호를 3차증폭시키는 SMPA, SMPA로부터출력되는 3차증폭된동 위상디지털신호와역 위상디지털신호를 Single-ended 형태로출력하는매칭부를포함한다.
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