公开(公告)号：JP2004155957A

公开(公告)日：2004-06-03

申请号：JP2002324225

申请日：2002-11-07

Applicant: Three M Innovative Properties Co ,  スリーエム イノベイティブ プロパティズ カンパニー

Inventor： YAMAGUCHI HIROAKI ,  AKIYAMA RYOTA

IPC: C09J7/00 ,  C09J9/02 ,  C09J11/00 ,  C09J201/00 ,  H01B1/00 ,  H01B1/20 ,  H01B1/22 ,  H01B5/16 ,  H01R4/04 ,  H05K3/32

CPC classification number: H05K3/323 ,  C09J9/02 ,  H01B1/22 ,  H01R4/04 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0272

Abstract: PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive keeping sufficient conductivity among circuits without lowering adhesive strength.
SOLUTION: In this anisotropic conductive adhesive or film containing an adhesive component and conductive particles, at least two kinds of particles having different hardness and nearly the same particle diameter are used as the conductive particle.
COPYRIGHT: (C)2004,JPO

公开(公告)号：EP2397524A1

公开(公告)日：2011-12-21

申请号：EP10741312.2

申请日：2010-02-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： ONOUE, Tomoaki ,  HIRAYAMA, Masaaki ,  ABURATANI, Yoshiki

IPC: C08L101/12 ,  C08K3/04 ,  C08K7/18 ,  C08K9/02 ,  C09J5/00 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01R11/01

CPC classification number: H05K3/321 ,  H01R4/00 ,  H01R4/04 ,  H01R4/58 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0323 ,  Y10T428/25

Abstract: To provide a conductive resin composition with which high conduction reliability can be ensured, a method for manufacturing, using the composition, an electronic component having high bonding reliability, a bonding method and a bonding structure by which objects to be bonded can be bonded to each other with certainty, and a highly reliable electronic component having the bonding structure.
A conductive resin composition which includes (a) a curable resin and (b) hard spherical carbon formed by coating the surface of a spherical base carbon particle with fine carbon particles and/or hard spherical carbon formed by coating the surface of a spherical base carbon particle with pitch-derived fine carbon pieces, is used.
The conductive resin composition is suppled to a space between areas of at least two works respectively having the areas to be electrically connected to each other, and the conductive resin composition is cured while applying a pressure between the areas.

Abstract translation: 为了提供具有高导通可靠性的导电性树脂组合物，可以确保，对于制造方法，使用该组合物的电子部件具有高接合可靠性，粘合方法以及通过哪些对象待结合可以键合到每个的接合结构 其他与确定性，以及具有该接合结构的高度可靠的电子部件。 的导电性树脂组合物，其包括（a）可固化的树脂和（b）硬质球形碳由球状碳颗粒的表面与由球状碳的表面涂层而形成细碳颗粒和/或硬质球形碳涂敷形成 粒子用沥青衍生的碳细片，被使用。 导电性树脂组合物suppled到一个空间中的至少两个工程分别具有的区域的区域之间，以电连接到海誓山盟，并同时施加的区域之间的压力的导电性树脂组合物固化。

公开(公告)号：EP1002844A3

公开(公告)日：2000-10-11

申请号：EP99119499.4

申请日：1999-10-01

Applicant: Beiersdorf Aktiengesellschaft

Inventor： Pfaff, Ronald, Dr.

IPC: C09J7/00 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H01R13/03 ,  H05K3/32

CPC classification number: H01L24/83 ,  C09J7/10 ,  H01B1/22 ,  H01L24/28 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19043 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0329 ,  H05K2201/2036 ,  Y10T428/2813 ,  Y10T428/2817 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2887 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2996 ,  H01L2924/00

Abstract: Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstoffolie, enthaltend i) ein thermoplastisches Polymer mit einem Anteil von zumindest 30 Gew.-% ii) ein oder mehrere klebrigmachende Harze mit einem Anteil von 5 bis 50 Gew.-% und/oder iii) Epoxidharze mit Härtern, gegebenenfalls auch Beschleunigern, mit einem Anteil von 5 bis 40 Gew.-%, iv) metallisierte Partikel mit einem Anteil von 0,1 bis 40 Gew.-%, v) nur schwer oder nicht verformbare Spacerpartikel mit einem Anteil von 1 bis 10 Gew-%, die bei der Verklebungstemperatur der Klebstoffolie nicht schmelzen.

公开(公告)号：EP0421709A1

公开(公告)日：1991-04-10

申请号：EP90310734.0

申请日：1990-10-01

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Emori, Kenji, c/o Sumitomo 3M Ltd. ,  Ishii, Shigeyoshi, c/o Sumitomo 3M Ltd.

IPC: H01B1/22 ,  H05K3/32 ,  C09J7/00

CPC classification number: H05K3/323 ,  C08L2666/54 ,  C09J7/10 ,  C09J201/00 ,  H01B1/22 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/023 ,  H05K2201/0266

Abstract: Anisotropically electroconductive adhesive films comprising coagulated nickel electroconductive particles, primary particles having an average particle size of 0.02 - 2.0 µm, the amount of particles in the film being 0.5% - 10.0% by volume. The films are useful for effecting electrical connector of fine multiple pin terminals.

Abstract translation: 包含凝固的镍导电颗粒的各向异性导电粘合剂膜，平均粒度为0.02-2.0μm的一次颗粒，膜中的颗粒的量为0.5体积％至10.0体积％。 这些薄膜可用于实现精细多针端子的电连接器。

公开(公告)号：EP0413614A2

公开(公告)日：1991-02-20

申请号：EP90309108.0

申请日：1990-08-20

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Mase, Akira

IPC: H01R4/04 ,  H05K3/36 ,  G02F1/1339 ,  H01R9/09

CPC classification number: H01R12/62 ,  H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0108 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/2036

Abstract: A method of making electrical connections between electrode arrangements (3a, 3b) formed on first and second substrates (1, 2) is described which is particularly advantageous for making connections in liquid crystal displays. The first substrate (1) is placed over the second substrate (2) with the respective electrodes (3a, 3b) in registry and with a UV-light-curable adhesive (4) therebetween. The UV-light-curable adhesive carries first and second kinds of particles (5, 6) dispersed therein. The first and second substrates (1, 2) are pressed against each other and exposed to UV light in order to harden the adhesive (4). The first kind of particles (5) are electrically conductive particles and preferably are resiliently deformable and function to establish current paths between the electrodes of the first and second substrates, and the second kind of particles (6) are smaller than the first and function to prevent the first kind of particles from being destroyed by excessive deformation.

Abstract translation: 描述了形成在第一和第二基板（1,2）上的电极布置（3a，3b）之间的电连接的方法，其特别有利于在液晶显示器中进行连接。 将第一基板（1）放置在第二基板（2）上，其中相应的电极（3a，3b）对准，并且其间具有UV光可固化的粘合剂（4）。 紫外光固化型粘合剂携带分散在其中的第一种和第二种颗粒（5,6）。 第一和第二基板（1,2）彼此压靠并暴露于UV光以使粘合剂（4）硬化。 第一种颗粒（5）是导电颗粒，并且优选地是可弹性变形的，并且用于在第一和第二基板的电极之间建立电流路径，并且第二种颗粒（6）小于第一和第二颗粒 防止第一种颗粒被过度变形所破坏。

公开(公告)号：EP0260141A3

公开(公告)日：1989-07-26

申请号：EP87308019.6

申请日：1987-09-10

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Takeno, Shozo ,  Kakegawa, Masayuki ,  Adachi, Yoshimasa

IPC: G02F1/133

CPC classification number: G02F1/13452 ,  H05K1/117 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/023 ,  H05K2201/0266 ,  H05K2201/094 ,  H05K2201/09663

Abstract: A liquid crystal apparatus in which an anisotropic conductive layer (122) made of organic resin (120) containing several electrical conductive particles (121) having a substantially identical particle sizes is disposed between lead electrodes of a liquid crystal device (112) and the lead electrodes of a drive circuit board (114-117), thermocompression bonding being applied to make a simple substance of the electrical conductive particles (121) in direct contact with the both lead electrodes to allow both lead electrodes to be electrically connected with each other. Further, at least one of the lead electrodes of a common electrode (106) in the liquid crystal device (112) and the lead electrodes of the circuit board (114-117) corresponding to the lead electrode of the common electrode (106) are spaced, and the pitches and widths of the lead electrodes belonging to at least one of the liquid crystal device (112) and the circuit board (114-117) are in the range of ± 30% around their respective averaged values.

公开(公告)号：EP0265212A1

公开(公告)日：1988-04-27

申请号：EP87309226.6

申请日：1987-10-19

Applicant: JAPAN SYNTHETIC RUBBER CO., LTD.

Inventor： Kasai, Kiyoshi ,  Watanabe, Masaji ,  Hattori, Masayuki ,  Tadenuma, Hiroshi ,  Miyamoto, Masahiro

IPC: H01B5/14 ,  H01B5/16 ,  H01B1/22 ,  H01R4/04 ,  C09J7/00

CPC classification number: H01B1/22 ,  C09J201/00 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01R4/04 ,  H05K1/181 ,  H05K3/323 ,  H05K3/361 ,  H05K13/0469 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0266

Abstract: Electroconductive particles having substantially uniform particle diameters, which are obtained by forming a thin metal layer on the surface of each of fine polymer particles having such a narrow particle diameter distribution that at least 80% by weight of the polymer particles have particle diameters falling within a range of 0.9Sn to 1.1Sn wherein Sn is defined as the number average particle diameter of the polymer particles, as well as an electroconductive adhesive consisting essentially of (a) said electroconductive particles and (b) an electrically insulating adhesive material. Use of this electroconductive adhesive makes it possible to obtain good, anisotropic, electric connection.

Abstract translation: 导电颗粒具有基本上均匀的粒径，其通过在具有如此窄的粒径分布的每种聚合物微粒的表面上形成薄金属层而获得，使得至少80重量％的聚合物颗粒的粒径落入 范围为0.9Sn至1.1Sn，其中Sn定义为聚合物颗粒的数均粒径，以及基本上由（a）所述导电颗粒和（b）电绝缘粘合剂材料组成的导电粘合剂。 使用这种导电粘合剂可以获得良好的各向异性电连接。

公开(公告)号：JPWO2014112540A1

公开(公告)日：2017-01-19

申请号：JP2014504101

申请日：2014-01-16

Applicant: 積水化学工業株式会社

Inventor： 石澤　英亮 ,  英亮 石澤 ,  敬士 久保田 ,  敬士 久保田

IPC: C08L63/00 ,  C08K3/08 ,  C08K5/18 ,  C08K5/3445

CPC classification number: H01B1/22 ,  C08G59/40 ,  C08K5/17 ,  C09J9/02 ,  H05K1/11 ,  H05K2201/023

Abstract: 速やかに硬化させることができ、更に保存安定性を高めることができる電子部品用硬化性組成物を提供する。本発明に係る電子部品用硬化性組成物は、エポキシ化合物と、アニオン硬化剤と、フラックスと、上記アニオン硬化剤を除く塩基性化合物とを含む。

Abstract translation: 它可以迅速固化以提供一种电子部件的可固化组合物，它可进一步提高贮存稳定性。 根据本发明的电子组件可固化组合物包括环氧化合物，阴离子固化剂和熔剂，而比阴离子固化剂以外的碱性化合物。

公开(公告)号：JP2005191541A

公开(公告)日：2005-07-14

申请号：JP2004305519

申请日：2004-10-20

Applicant: Seiko Epson Corp ,  セイコーエプソン株式会社

Inventor： IMAI HIDEO

IPC: H01L21/00 ,  H01L21/28 ,  H01L21/60 ,  H01L23/02 ,  H01L23/12 ,  H01L23/48 ,  H01L23/498 ,  H01L29/40 ,  H01R11/01 ,  H05K3/32

CPC classification number: H01L24/12 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/323 ,  H05K2201/023 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device, a semiconductor chip, a manufacturing method of the semiconductor device, and an electronic apparatus all of which is to realize high reliability capable of ensuring a good electrical connection state at a low cost. SOLUTION: In a semiconductor device, a semiconductor chip comprises a bump 40 which has a first conductive layer 13 and a second conductive layer 15 mounted on the first conductive layer 13, and the bump is mounted on a land 21 that is laid on a wiring substrate 20 in a such state that insulating materials in which conductive particles 30 are dispersed is sandwiched in between the bump and the land. The second conductive layer 15 is formed with copper, and the thickness of which is determined as to ensure electrical connection in such a manner that the conductive particles 30 bite into the second conductive layer 15. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供半导体器件，半导体芯片，半导体器件的制造方法和电子设备，所有这些都是实现高可靠性，能够以低成本确保良好的电连接状态 。 解决方案：在半导体器件中，半导体芯片包括具有安装在第一导电层13上的第一导电层13和第二导电层15的凸块40，并且凸块安装在放置的焊盘21上 在布线基板20上，其中分散有导电粒子30的绝缘材料被夹在凸块和焊盘之间。 第二导电层15由铜形成，其厚度确定为确保导电粒子30咬入第二导电层15中的电连接。（C）2005，JPO＆NCIPI

公开(公告)号：JP3642239B2

公开(公告)日：2005-04-27

申请号：JP28559099

申请日：1999-10-06

Applicant: セイコーエプソン株式会社

Inventor： 永至 村松

IPC: G09F9/00 ,  G02F1/13 ,  G02F1/1345 ,  H05K1/02 ,  H05K3/32 ,  H05K3/36

CPC classification number: G02F1/13452 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/0269 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0108 ,  H05K2201/023 ,  H01L2924/00