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    CIRCUIT MODULE WITH THERMAL CASING SYSTEMS AND METHODS
    75.
    发明申请
    CIRCUIT MODULE WITH THERMAL CASING SYSTEMS AND METHODS 审中-公开
    具有热壳系统和方法的电路模块

    公开(公告)号：WO2006121487A2

    公开(公告)日：2006-11-16

    申请号：PCT/US2006/007004

    申请日：2006-02-28

    Applicant: STAKTEK GROUP L.P. ,  WEHRLY, James, Douglas, Jr. ,  WILDER, James ,  WOLFE, Mark ,  GOODWIN, Paul

    Inventor： WEHRLY, James, Douglas, Jr. ,  WILDER, James ,  WOLFE, Mark ,  GOODWIN, Paul

    IPC: G06F11/00

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

    Abstract translation: 灵活的电路装有沿主要侧面或两侧设置的集成电路（IC）。 触点沿柔性电路分布，以提供模块与应用环境之间的连接。 填充的柔性电路围绕刚性衬底的边缘设置，优选地由导热材料设计，并且一个或多个散热器布置成与模块的组成集成电路中的至少一些热接触。 可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。 在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

    HIGH CAPACITY THIN MODULE SYSTEM AND METHOD
    76.
    发明申请
    HIGH CAPACITY THIN MODULE SYSTEM AND METHOD 审中-公开
    高容量薄模块系统和方法

    公开(公告)号：WO2006121486A2

    公开(公告)日：2006-11-16

    申请号：PCT/US2006/006921

    申请日：2006-02-28

    Applicant: STAKTEK GROUP L.P. ,  WEHRLY, JR, James Douglas ,  WILDER, James ,  GOODWIN, Paul ,  WOLFE, Mark

    Inventor： WEHRLY, JR, James Douglas ,  WILDER, James ,  GOODWIN, Paul ,  WOLFE, Mark

    IPC: G06F11/00

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

    Abstract translation: 灵活的电路装有集成电路，沿其主要一侧或两侧布置。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，优选地由导热材料设计，并且包括当柔性电路产生时设置在较高热能装置（例如AMB）附近的高导热性芯或区域 底物。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

    CIRCUIT CONFIGURATION COMPRISING SEMI-CONDUCTOR COMPONENTS WHICH HAS DEVICES FOR MONITORING JUNCTION TEMPERATURE
    79.
    发明申请
    CIRCUIT CONFIGURATION COMPRISING SEMI-CONDUCTOR COMPONENTS WHICH HAS DEVICES FOR MONITORING JUNCTION TEMPERATURE 审中-公开
    半导体器件的装置完整的电路用于监测温度结

    公开(公告)号：WO98039803A2

    公开(公告)日：1998-09-11

    申请号：PCT/EP1998/001569

    申请日：1998-03-04

    IPC: G01K1/16 ,  G01K7/42 ,  H01L23/34 ,  H05K1/02 ,  H01L27/02

    CPC classification number: G01K1/16 ,  G01K7/42 ,  H01L23/34 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2203/163 ,  H01L2924/00

    Abstract: The invention relates to a circuit configuration comprising a supporting body (1) which supports a circuit board conductor configuration (7) and a (cased) semi-conductor component (4). Said semi-conductor component (4) is connected electrically to said circuit board conductor configuration via connector pins (5). The aim of the invention is to provide a device for monitoring the temperature of said semi-conductor component. According to the invention, a temperature sensor (6) should be provided on said supporting body, next to said semi-conductor component (4). An electrically conductive connection is formed between said temperature sensor (6) and one of the connector pins (5) of the semi-conductor component (4) by a specially shaped interconnecting circuit board conductor (8). Said supporting body also has significantly lower calorific conductability than said interconnecting circuit board conductor so that only slight thermal deviation occurs.

    Abstract translation: 本发明是基于在具有承载体（1），其携带有印刷导体结构的电路装置（7）和（a收纳）的半导体器件（4）。 的半导体器件（4）电连接到端子销（5）连接到导体轨道布置。 本发明的目的是提供一种手段，以半导体器件的温度监视。 根据本发明，在相邻的半导体装置的承载体包括温度传感器（6）适用。 所述温度传感器（6）通过（8）导电连接到端子销中的一个特殊形状的连接导体连接在所述半导体部件（5）（4）。 此外，该支承体具有比所述连接图案为大致更低的导热率，因此，只有一个小的热存储发生。

    INTEGRATED CIRCUIT DEVICE
    80.
    发明申请
    INTEGRATED CIRCUIT DEVICE 审中-公开
    集成电路设备

    公开(公告)号：WO1996001498A1

    公开(公告)日：1996-01-18

    申请号：PCT/JP1995001326

    申请日：1995-07-03

    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  YASUHO, Takeo ,  IWATA, Masao ,  KATSURAGAWA, Ryoichi ,  MATSUNAGA, Hayami ,  SUEHIRO, Yoshikazu ,  YOKOTA, Yasuhiko

    Inventor： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

    IPC: H01L25/10

    CPC classification number: H05K7/1092 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/056 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/09781 ,  H05K2201/10318 ,  H05K2201/1056 ,  H05K2201/10689 ,  H05K2201/2036 ,  H01L2924/00

    Abstract: An integrated circuit device which has an excellent heat radiating property and is used for such consumer products as electronic equipment, electric equipment, communication equipment, and measurement control equipment, etc. A power source (4) and a plurality of pin terminals (5) are mounted on a metal plate (1). A cache controller (10), a cache memory section (11), a data buffer (LSI) section (14), a (CPU) chip (8), and a connector (12) are mounted on a multiplayer circuit wiring board (7). The plate (1) mounted with the power source (4) is attached to the rear surface of the board (7) through the pin terminals (5). Therefore, an integrated circuit device such that the degree of integration is improved and heat radiating parts have excellent heat radiating properties is provided.

    Abstract translation: 电子设备，电气设备，通信设备，测量控制设备等消费类产品中使用具有优异的散热性能的集成电路器件。电源（4）和多个引脚端子（5） 安装在金属板（1）上。 高速缓存控制器（10），高速缓冲存储器部分（11），数据缓冲器（LSI）部分（14），（CPU）芯片（8）和连接器（12）安装在多人电路布线板 7）。 安装有电源（4）的板（1）通过销端子（5）附接到板（7）的后表面。 因此，提供了集成度提高并且具有优异的散热性的散热部件的集成电路装置。

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