公开(公告)号：EP1670299A3

公开(公告)日：2006-08-09

申请号：EP05025697.3

申请日：2005-11-24

Applicant: DENSO CORPORATION

Inventor： Oonishi, Jun

IPC: H05K3/34

CPC classification number: H05K3/3426 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A surface-mounted electronic component (10) has an outer lead (12) extending from a package (11) for connection to a circuit pattern (21) on a printed circuit board (20) by using a connecting member (30). The outer lead (12) has a hole (12b) having an opening at least on a connecting member (30) facing side in a portion (12a) of the outer lead (12) for connecting the outer lead (12) to the circuit pattern (21).

Abstract translation: 表面安装型电子元件（10）具有通过使用连接构件（30）从用于连接到印刷电路板（20）上的电路图案（21）的封装（11）延伸的外引线（12）。 外引线（12）具有至少在外引线（12）的一部分（12a）中的面对侧的连接构件（30）上具有开口的孔（12b），用于将外引线（12）连接到电路 模式（21）。

公开(公告)号：EP1670299A2

公开(公告)日：2006-06-14

申请号：EP05025697.3

申请日：2005-11-24

Applicant: DENSO CORPORATION

Inventor： Oonishi, Jun

IPC: H05K3/34

CPC classification number: H05K3/3426 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A surface-mounted electronic component (10) has an outer lead (12) extending from a package (11) for connection to a circuit pattern (21) on a printed circuit board (20) by using a connecting member (30). The outer lead (12) has a hole (12b) having an opening at least on a connecting member (30) facing side in a portion (12a) of the outer lead (12) for connecting the outer lead (12) to the circuit pattern (21).

Abstract translation: 表面安装的电子部件（10）具有从用于连接到印刷电路板（20）上的电路图案（21）的封装（11）延伸的外引线（12），通过使用连接部件（30）。 外引线（12）具有至少在外引线（12）的部分（12a）中的连接构件（30）面向侧上具有开口的孔（12b），用于将外引线（12）连接到电路 图案（21）。

公开(公告)号：EP0940861A3

公开(公告)日：2000-04-05

申请号：EP99103171.7

申请日：1999-02-18

Applicant: E.G.O. Control Systems GmbH & Co. KG

Inventor： Gänsler, Walter

IPC: H01L33/00 ,  H05K3/30

CPC classification number: H05K3/306 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00

Abstract: Eine Leuchtdiode umfassend einen Anschlußpins (30) einbettenden Basiskörper (10) und einen daran anschließenden Leuchtkörper (20), wobei der Leuchtkörper (20) einen kleineren Durchmesser als der Basiskörper (10) aufweist, ist dadurch gekennzeichnet, daß die axiale Länge des Basiskörpers (l G ) größer ist als die axiale Länge des Leuchtkörpers (l L ).

Abstract translation: 一种发光二极管，包括一连接销（30）埋设在基体（10）和一个相邻的发光体（20），其中，所述发光体（20）具有比所述基体更小的直径（10）的特征在于，所述基体的轴向长度（ lG）大于灯丝的轴向长度（lL）。

公开(公告)号：EP0651471A3

公开(公告)日：1996-11-20

申请号：EP94306637.3

申请日：1994-09-09

Applicant: THE WHITAKER CORPORATION

Inventor： Korsunsky, Iosif ,  Harlan, Tod Martin ,  Shipe, Joanne Eileen

IPC: H01R23/70 ,  H01R23/68

CPC classification number: H05K7/12 ,  H01R12/58 ,  H01R13/648 ,  H01R13/6585 ,  H01R13/6594 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/10878

Abstract: An electrical connector (10) of the type having an array of signal contacts surface mountable to pads of a circuit board (20), with at least one ground bus (40) having a row of post sections (44,50,52) insertable into through holes (34) of the circuit board. At least two of the post sections (50,52) include protuberances (54,56) proximate free ends thereof adapted to bear against side walls of the respective through holes (34) upon insertion thereinto, for deflection of the shanks (62,64) of the post sections (50,52) in the opposite direction. The protuberances (54,56) of the at least two post sections (50,52) extend in opposed directions along the row of post sections (44,50,52), thus cooperating to act as a clamp of modest force to retain the connector (10) to the board (20) prior to contact soldering. The deflectable shank (62,64) preferably has a reduced cross-sectional area at root (66,68) facilitating deflection in the plastic region.

公开(公告)号：EP0487866B1

公开(公告)日：1994-12-14

申请号：EP91117026.4

申请日：1991-10-07

Applicant: MOLEX INCORPORATED

Inventor： Bertho, Dominique ,  Donnelly, Richard ,  Kirby, Patrick

IPC: H01R23/70

CPC classification number: H01R12/58 ,  H01R12/83 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/10878

公开(公告)号：US09936589B2

公开(公告)日：2018-04-03

申请号：US15055859

申请日：2016-02-29

Applicant: Presidio Components. Inc.

Inventor： Hung Van Trinh

IPC: B23K31/02 ,  H05K3/34 ,  H01G2/06 ,  B23K1/00 ,  B23K35/26 ,  C22C13/00

CPC classification number: H05K3/3426 ,  B23K1/0016 ,  B23K35/262 ,  C22C13/00 ,  H01G2/06 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/38 ,  H01L23/495 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/498 ,  H01L23/562 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/10787 ,  H05K2203/047 ,  H05K2203/1173 ,  H05K2203/1377 ,  Y02P70/613

Abstract: An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.

公开(公告)号：US09831575B2

公开(公告)日：2017-11-28

申请号：US15409689

申请日：2017-01-19

Applicant: Lear Corporation

Inventor： Bert W. Eakins ,  George E. Fox

IPC: H05K1/11 ,  H01R12/70 ,  H01R4/02

CPC classification number: H01R12/707 ,  H01R4/02 ,  H01R4/028 ,  H01R12/585 ,  H01R43/205 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/097 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K2201/2072 ,  H05K2203/047 ,  H05K2203/1572

Abstract: A circuit board assembly may include a circuit board, a first electrical terminal, and a layer of solder paste. The circuit board may include a minimum thickness, a first side, and a second side opposite the first side. The first electrical terminal may include a solder tab. The layer of solder paste may be disposed on the first side of the circuit board. The solder tab of the first electrical terminal may extend into the first side of the circuit board but not beyond the second side of the circuit board.

公开(公告)号：US09775242B2

公开(公告)日：2017-09-26

申请号：US15005589

申请日：2016-01-25

Applicant: Intel Corporation

Inventor： Tsung-Yu Chen ,  Rebecca Shia

IPC: H01L23/488 ,  H01L21/60 ,  H05K1/11 ,  H01L23/48 ,  H05K3/10 ,  H01L21/48 ,  H05K5/00 ,  H01R13/04 ,  H01L23/498 ,  H05K3/40 ,  H01L23/373 ,  H05K3/34

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/4885 ,  H01L23/373 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01R13/04 ,  H05K3/103 ,  H05K3/3426 ,  H05K3/4015 ,  H05K5/0069 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10787 ,  H05K2201/10795 ,  H05K2201/1081 ,  H05K2203/1178 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

公开(公告)号：US09728869B2

公开(公告)日：2017-08-08

申请号：US15124519

申请日：2015-02-25

Applicant: Sumitomo Wiring Systems, Ltd

Inventor： Hideki Goto

IPC: H01R12/00 ,  H01R12/58 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01R12/58 ,  H05K1/115 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10303 ,  H05K2201/10787 ,  H05K2201/1081 ,  H05K2201/10818

Abstract: The present invention provides a printed substrate having a novel structure in which substrate terminals can be fixed to the printed substrate without needing a base, and the substrate terminals can be press-fitted into through-holes without applying pressing force to printed wiring and a plating layer in the through-holes, and also provides a printed substrate with terminals that uses this printed substrate. A printed substrate includes through-holes into which the first end portions of substrate terminals are to be inserted. The through-holes each include press-fitting regions into which the first end portion of a substrate terminal is to be press-fitted, and conduction regions arranged so as to oppose the outer circumferential surfaces of the first end portion of the substrate terminal via gaps in directions perpendicular to the axis. Printed wiring is connected to the conduction regions, and a plating layer is adhered to the conduction regions.

公开(公告)号：US08902603B2

公开(公告)日：2014-12-02

申请号：US13210329

申请日：2011-08-15

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K7/00 ,  H05K3/32 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部位置上，并且每个这样的电子部件通过覆盖并与其接触的夹具保持就位 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。