Abstract:
A memory system includes at least one memory device and a memory controller. The memory device includes a refresh request circuit which generates a refresh data signal which includes a refresh request signal according to each data retention time of a plurality of memory cells. The memory controller controls the memory device by scheduling an operation command about the operation of the memory device by including the refresh request signal.
Abstract:
PURPOSE: A semiconductor memory device storing memory characteristic information, a memory module including the same, a memory system, and an operation method of the semiconductor memory device are provided to reduce the impact of a weak cell or a weak page on a memory operation by managing the memory operation using the stored characteristic information. CONSTITUTION: A cell array includes multiple regions accessed by a first address. A non-volatile array (1110) stores group information in which each region is included for the multiple regions classified into two groups according to memory characteristics. The group information is successively stored in the non-volatile array according to a first address value of the regions.
Abstract:
PURPOSE: A data read circuit, a nonvolatile memory device including the same, and a method for reading data in the nonvolatile memory device are provided to improve the reliability of read data by using a plurality of reference voltages. CONSTITUTION: A cell array includes nonvolatile memory cells. A bit line is connected to the nonvolatile memory cell and transmits a data voltage(VSA). A sense amplifier circuit(1151) receives a data voltage through a first input unit and receives two reference voltages(VREFH,VREFL) through a second input unit. The sense amplifier circuit generates read data by differentially amplifying input signals inputted to the first and second input units in a data read operation.
Abstract:
PURPOSE: A semiconductor device including a vertical channel transistor and a manufacturing method thereof are provided to prevent a channel region from being floated by connecting channel regions of active pillars to a string body connection unit. CONSTITUTION: A plurality of active pillars(AP) include a top dopant region, a bottom dopant region, and a channel region(C). The channel region is arranged between the top dopant region and the bottom dopant region. A contact gate electrode(CG) is contacted with a word line extended in a first direction and is extended near the channel region. A bit line is extended in a second direction across the first direction and is contacted with the bottom dopant region. A string body connection unit(SB) connects the channel regions of adjacent active pillars.
Abstract:
PURPOSE: A memory device for managing hidden timing parameters is provided to secure timing parameter margin by hiding the timing parameters from a memory controller. CONSTITUTION: A memory device includes a plurality of banks in which a plurality of memory cells are arranged. Each bank includes two or more sub banks. In a sub bank interleave method to continuously operate the sub banks in one bank one by one, a continuous operation between sub banks is set at low active-to-low active time interval between different banks.
Abstract:
적층 구조의 반도체 메모리 장치가 개시된다. 적층 구조의 반도체 메모리 장치는 반도체 기판 및 반도체 기판 위에 역 쐐기 형태로 적층되고 서로 다른 리던던시 사이즈를 갖는 복수의 메모리 셀 어레이 층을 포함한다. 적층 구조의 반도체 메모리 장치의 리페어 방법은 층 리페어를 포함한다. 따라서, 반도체 메모리 장치는 층 간 수직 연결에 필요한 공간을 용이하게 확보할 수 있고, 사이즈가 작고 수율이 높다.
Abstract:
메모리 셀 어레이 층들과 독립적인 연결 층을 갖는 적층 구조의 반도체 메모리 장치가 개시된다. 반도체 메모리 장치는 기능 회로를 갖는 반도체 기판, 복수의 메모리 셀 어레이 층, 및 적어도 하나의 연결 층을 포함한다. 메모리 셀 어레이 층들은 상기 반도체 기판 위에 적층되어 있다. 연결층들은 상기 메모리 셀 어레이 층과 독립적으로 반도체 기판의 상부에 적층되어 있고, 메모리 셀 어레이 층들에 배열되어 있는 메모리 셀 선택 라인들을 기능 회로와 전기적으로 연결한다. 따라서, 반도체 메모리 장치는 적층 과정에서 높은 유연성을 갖는다.
Abstract:
오픈 비트 라인 구조를 가지는 반도체 메모리 장치의 메모리 코어 및 메모리 코어의 에지 서브 어레이의 테스트 방법이 개시되어 있다. 메모리 코어는 에지 서브 어레이, 센스 앰프, 및 복수의 스위치들을 구비한다. 에지 서브 어레이는 복수의 워드 라인, 복수의 비트 라인, 및 복수의 더미 비트 라인을 구비한다. 센스 앰프 회로는 더미 비트 라인들의 전압을 증폭하고, 복수의 스위치들은 복수의 칼럼 선택 신호에 응답하여 적어도 하나의 입력 데이터를 더미 비트 라인들에 전달한다. 따라서, 반도체 메모리 장치는 메모리 코어를 구성하는 에지 서브 어레이의 결함을 정확하게 테스트할 수 있다.
Abstract:
PURPOSE: A plate voltage generation circuit of a DRAM(Dynamic RAM) device is provided to generate different plate voltages respectively during a normal read/write operation and a burn-in test operation in a package state. CONSTITUTION: According to the DRAM device, a plate voltage generating circuit(400) generates a plate voltage(Vp) in response to an internal power supply voltage during a normal read/write operation. A unit generates the first plate voltage with one of the first level voltage and the second level voltage according to data stored in a cell capacitor during a burn-in test operation. A level detection circuit(200) generates the first detection signal(PDET) by detecting whether an external power supply voltage is lower or higher than a reference voltage(VREF). A burn-in mode detecting circuit(210) generates a pair of second detection signals indicating the burn-in test operation. A unit disables the plate voltage generating circuit during the normal read/write operation if the second detection signals indicate the burn-in test operation. And a unit enables the plate voltage generating circuit during the burn-in test operation if the second detection signals indicate the burn-in test operation.
Abstract:
PURPOSE: An output driver of driving an open drain type of output terminal is provided to realize a stable driving capability though the properties of transistors is degraded by PVT variation. CONSTITUTION: In an output driver(100) of driving an open drain type of an output terminal, the first and second data input parts(12,22) receive data responding to a clock signal and a delay clock signal. The first and second free drivers(14,24) are driven respectively depending on the outputs of the first and second data input parts. The first sub-driver(18) performs a pull-swing of the output level of the first free-driver responding to the first to third control signals and the output of the first data input part. The second sub-driver(28) performs a pull-swing of the output level of the second free-driver responding to the first to third control signals and the output of the second data input part. The first pull-down(16) transistor having an open drain type is connected to an output pad. The first pull-down transistor is controlled by the outputs of the first free-driver and the first sub-driver. The second pull-down transistor(26) having an open drain type is connected to the output pad. The second pull-down transistor is controlled by the outputs of the second free-driver and the second sub-driver.