公开(公告)号：JP2006139284A

公开(公告)日：2006-06-01

申请号：JP2005325737

申请日：2005-11-10

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： SUWA MITSUFUMI ,  IWAZAWA HARUO ,  KAJITA TORU ,  IWANAGA SHINICHIRO

IPC: G03F7/004 ,  G03F7/039 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition for manufacture of a semiconductor device excellent in transparency, dry etching resistance and uniformity in film thickness. SOLUTION: The radiation sensitive resin composition comprises (A) an acid cleavable group-containing resin selected from the group consisting of a resin (AI) having an alicyclic skeleton represented by formula (1) and a resin (AII) having a structure obtained by substituting the hydrogen atoms of carboxyl groups in a carboxyl-containing alkali-soluble resin by a group having an alicyclic skeleton and an acid cleavable group, (B) a radiation-sensitive acid generator and (C) a solvent comprising a mixture of a linear ketone and an alkyl 2-hydroxypropionate. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种用于制造透明性，耐干蚀刻性和膜厚均匀性优异的半导体器件的辐射敏感性树脂组合物。 解决方案：辐射敏感性树脂组合物包含（A）选自含有可螯合基团的树脂，其由具有式（1）表示的脂环骨架的树脂（AI）和具有式 通过用具有脂环骨架和酸可分解基团的基团代替含羧基的碱溶性树脂中的羧基的氢原子获得的结构，（B）辐射敏感性酸产生剂和（C）包含混合物的溶剂 的直链酮和2-羟基丙酸烷基酯。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2006077231A

公开(公告)日：2006-03-23

申请号：JP2005168015

申请日：2005-06-08

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： ICHINOHE DAIGO ,  YONEKURA ISAMU ,  NISHIO HISAHIRO ,  KAJITA TORU

IPC: C08F8/30 ,  C08F290/04 ,  C08G59/50 ,  G02F1/1339 ,  G09F9/30

Abstract: PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin composition which can acquire a sufficient spacer configuration even in the exposure of not more than 1,200 J/m 2 with high sensitivity and high resolution and also can form a spacer for a liquid crystal display element excellent in elastic recovery, rubbing resistance, adhesiveness with a transparent substrate, heat resistance, or the like. SOLUTION: The radiation sensitive resin composition comprises: a polymer which is obtained by reacting an isocyanate compound expressed by formula (1) (in formula (1), R 1 represents hydrogen atom or methyl group and R 2 represents an alkylene group) with a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, (a2) an epoxy group-containing unsaturated compound, (a3) a hydroxyl group-containing unsaturated compound, and (a4) another unsaturated compound; a polymerizable unsaturated compound; and a radiation sensitive polymerization initiator. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了获得即使在不高于1,200J / m 2 SP / 2以上的高灵敏度和高分辨率的曝光下即可获得足够的间隔物构型的辐射敏感性树脂组合物， 可以形成用于液晶显示元件的间隔物，其具有优异的弹性恢复性，耐摩擦性，与透明基材的粘合性，耐热性等。 解决方案：辐射敏感性树脂组合物包含：通过式（1）表示的异氰酸酯化合物（式（1）表示的R SP表示氢原子或甲基 （a1）不饱和羧酸和/或不饱和羧酸酐的共聚物，（a2）含环氧基的不饱和化合物，（a3）a， 含羟基的不饱和化合物和（a4）另一种不饱和化合物; 可聚合不饱和化合物; 和辐射敏感聚合引发剂。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005018087A

公开(公告)日：2005-01-20

申请号：JP2004235743

申请日：2004-08-13

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： IWAZAWA HARUO ,  KAJITA TORU ,  IWANAGA SHINICHIRO

IPC: G03F7/039 ,  G03F7/004 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition as a chemically amplified resist, which is, in particular, excellent in resolution for a contact hole as well as excellent in transparency for radiation, dry etching durability, pattern profile, sensitivity, resolution or the like. SOLUTION: The radiation-sensitive resin composition contains: (A) a resin having an alicyclic skeleton only in the main chain; (B) a compound having ≤1,000 molecular weight and expressed by general formula (1); and (C) a radiation-sensitive acid generating agent. At least one of the component (A) and the component (B) contains an acid-cleaving group. In formula (1), each of R 1 and R 2 represents a hydrogen atom or an acid-cleaving group, Z represents a group having a cyclic hydrocarbon structure with total 7 to 25 carbon atoms constituting the ring, a represents an integer 0 to 6, and b represents an integer 1 to 6. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供作为化学增幅抗蚀剂的辐射敏感性树脂组合物，特别是对于接触孔的分辨率优异，以及辐射透明度优异，干蚀刻耐久性，图案图 ，灵敏度，分辨率等。 解决方案：辐射敏感性树脂组合物包含：（A）仅在主链中具有脂环骨架的树脂; （B）具有1000分子量并由通式（1）表示的化合物; 和（C）辐射敏感性酸产生剂。 组分（A）和组分（B）中的至少一种含有酸裂解基团。 在式（1）中，R SP 1和R SP 2中的每一个代表氢原子或酸切割基团，Z代表具有总共7个环状烃结构的基团 至25个碳原子，a表示0〜6的整数，b表示1〜6的整数。（C）2005，JPO＆NCIPI

公开(公告)号：JP2003173026A

公开(公告)日：2003-06-20

申请号：JP2002009054

申请日：2002-01-17

Applicant: JSR CORP

Inventor： NISHIMURA YUKIO ,  YAMAMOTO MASASHI ,  KATAOKA ATSUKO ,  KAJITA TORU

IPC: G03F7/039 ,  C08F220/18 ,  C08F220/28 ,  G03F7/004 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to radiation and excellent in basic physical properties as a resist such as sensitivity, resolution, dry etching resistance and pattern shape. SOLUTION: The radiation-sensitive resin composition comprises (A) a resin comprising a copolymer of (meth)acrylic esters having lactone-containing heterocyclic structures typified by compounds of formula (1) and acid-dissociable group-containing (meth)acrylic esters typified by t-tubyl (meth)acrylate, 2- methyl-2-adamantyl (meth)acrylate and 2-norbornyl-2-n-propyl (meth)acrylate and (B) a radiation-sensitive acid generator typified by 1-(3,5-dimethyl-4- hydroxyphenyl)tetrahydrothiophenium nonafluoro-n-butanesulfonate and 1-(4-n- butoxy-1-naphtyl)tetrahydrothiophenium perfluoro-n-octanesulfonate. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2002311590A

公开(公告)日：2002-10-23

申请号：JP2001113462

申请日：2001-04-12

Applicant: JSR CORP

Inventor： YAMAMOTO MASASHI ,  ISHIDA EIKO ,  ISHII HIROYUKI ,  KAJITA TORU

IPC: G03F7/039 ,  C08F220/18 ,  G03F7/004 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition for forming a fine line pattern particularly even when the space width of a line-and-space pattern is wide and excellent also in transparency, sensitivity and resolution to radiation. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble resin containing repeating units derived from a compound obtained by substituting a group of formula (1), (2) or (3) (where R , R and R are each H or lower alkyl; X is methylene, -O- or -S-; and (a) is 1-5) for the hydrogen atom of a carboxyl group in (meth)acrylic acid and repeating units derived from 2-methyl-2-adamantyl (meth)acrylate or the like and exhibiting alkali solubility under the action of an acid, (B) a radiation sensitive acid generator and (C) a polycyclic compound having a functional group such as a t-butoxycarbonyl group.

公开(公告)号：JP2002244295A

公开(公告)日：2002-08-30

申请号：JP2001039066

申请日：2001-02-15

Applicant: JSR CORP

Inventor： KATAOKA ATSUKO ,  YAMAMOTO SHIGEHIRO ,  NISHIMURA YUKIO ,  KAJITA TORU

IPC: G03F7/039 ,  C08K5/00 ,  C08L101/02 ,  G03F7/38

Abstract: PROBLEM TO BE SOLVED: To provide a solution of a radiation sensitive resin composition having a controlled low water content, not causing the hydrolysis of a carboxylic anhydride structure in the resin and excellent in long-term shelf stability and to provide a method for improving the shelf stability of a solution of a radiation sensitive resin composition containing a resin having a carboxylic anhydride structure. SOLUTION: The solution of a radiation sensitive resin composition contains (A) an acid dissociable group-containing resin having a carboxylic anhydride structure and made alkali-soluble when the acid dissociable group is dissociated and (B) a radiation sensitive acid generating agent and has

公开(公告)号：JP2002202604A

公开(公告)日：2002-07-19

申请号：JP2000401302

申请日：2000-12-28

Applicant: JSR CORP

Inventor： NISHIMURA YUKIO ,  NAGAI TOMOKI ,  ISHII HIROYUKI ,  YAMAMOTO MASASHI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08F20/56 ,  C08F32/08 ,  C08F220/18 ,  C08L33/04 ,  C08L33/26 ,  C08L45/00 ,  G03F7/033 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation, excellent in sensitivity, resolution and pattern shape and less liable to a change in line width due to the increase and decrease of space width as a chemical amplification type resist sensitive particularly to far UV typified by ArF excimer laser beam (193 nm wavelength). SOLUTION: The radiation sensitive resin composition contains (A1) a resin containing norbornene repeating units each having a (substituted) carboxylic acid amide group typified by an N,N-dimethylnorbornene-5-carboxylic acid amide or an N,N-dimethyltetracyclo[4.4.0.12,5.17,10]dodeca-3-ene-8-carboxylic acid amide or (A2) a resin containing (substituted) (meth)acrylamide repeating units typified by N,N-dimethyl(meth)acrylamide and (B) a radiation sensitive acid generating agent.

公开(公告)号：JP2001255656A

公开(公告)日：2001-09-21

申请号：JP2001031808

申请日：2001-02-08

Applicant: JSR CORP

Inventor： KAJITA TORU ,  OTA TOSHIYUKI ,  ISAMOTO YOSHITSUGU ,  MIURA TAKAO

IPC: G03F7/038 ,  C08K5/00 ,  C08L101/06 ,  G03F7/004 ,  G03F7/008 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition which can be advantageously used as a resist for the production of an integrated circuit supposed to be made minuter in future by making the composition adaptable to any radiation, e.g. X-rays such as synchrotron radiation or charged corpuscular radiation such as electron beams besides far UV such as excimer laser light. SOLUTION: The radiation sensitive resin composition contains a polymer having repeating units of formula (1) and a radiation sensitive crosslinker or a radiation sensitive acid generating agent and an acid crosslinker.

公开(公告)号：JP2001209181A

公开(公告)日：2001-08-03

申请号：JP2000277966

申请日：2000-09-13

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  MURATA KIYOSHI ,  ISHII HIROYUKI ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08F220/18 ,  C08F222/06 ,  C08F232/00 ,  C08K5/00 ,  C08L45/00 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having superior dry etching resistance and high transparency to radiation, excellent in basic physical properties as a resist such as sensitivity, resolution and pattern shape, excellent also in shelf stability as a composition and retaining satisfactory adhesiveness to a substrate. SOLUTION: The radiation sensitive resin composition contains (A) a resin having repeating units derived from a derivative substituted by an oxygen- containing polar group (e.g. a hydroxyl or hydroxymethyl group) or a nitrogen- containing polar group (e.g. a cyano group), e.g. bicyclo[2.2.1]hept-2-ene or tetracyclo[4.4.0.12,5.17,10]dodec-3-ene, repeating units derived from maleic anhydride and repeating units derived from an acid dissociable ester derivative of (meth)acrylic acid typified by formula 1, 2 or 3 and (B) a radiation sensitive acid generating gent.

公开(公告)号：JP2001188346A

公开(公告)日：2001-07-10

申请号：JP2000089903

申请日：2000-03-28

Applicant: JSR CORP

Inventor： DOUKI KATSUJI ,  IWAZAWA HARUO ,  SOYANO AKIMASA ,  KAJITA TORU ,  SHIMOKAWA TSUTOMU

IPC: G03F7/039 ,  C08F20/28 ,  C08F32/02 ,  C08F32/08 ,  C08K5/00 ,  C08L101/06 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation as a chemical amplification type resist, excellent in basic physical properties as a resist such as dry etching resistance, sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid-dissociable group-containing resin having a skeleton of formula 1 preferably as a group of formula 2-1 or 2-2 and convertible to an alkali-soluble resin when the acid-dissociable group is dissociated and (B) a radiation sensitive acid generating agent. The component A is typified by a copolymer comprising repeating units of formula 3.