Manufacturing method and integrated piezoresistive pressure sensor having a diaphragm of polycristalline semiconductor material
    81.
    发明公开
    Manufacturing method and integrated piezoresistive pressure sensor having a diaphragm of polycristalline semiconductor material 失效
    制造方法以及具有多晶半导体材料构成的隔膜集成压阻式压力传感器

    公开(公告)号:EP0890998A1

    公开(公告)日:1999-01-13

    申请号:EP97830339.4

    申请日:1997-07-07

    CPC classification number: G01L9/0042 G01L9/0054

    Abstract: The pressure sensor comprises a semiconductor material single crystal substrate (21); a semiconductor material layer (28) on the substrate (21); an air gap (55) arranged between the substrate (21) and the semiconductor material layer (28); and at least an opening (53) extending between the lower outer surface (52) of the substrate (21) and the air gap (55). The semiconductor material layer (28) is formed by a polycrystalline region (29) forming a diaphragm over the air gap (55) and by a monocrystalline region (30) elsewhere. Piezoresistive elements (46) extend over the semiconductor material layer (28), insulated therefrom by a dielectric layer (45), at a lateral delimitation edge of the diaphragm (29) and are connected one another so as to form a Wheatstone bridge the unbalancing whereof allows the pressure exerted onto the sensor to be measured.

    Abstract translation: 该压力传感器包括半导体材料的单晶基板(21); 半导体材料层(28)在基板(21); 在基板(21)和所述半导体材料层(28)之间设置空气间隙(55); 并且在开口(53)的(21)的下部外表面(52)之间延伸与所述气隙(55)至少基材。 半导体材料层(28)由上方形成空气间隙(55)的隔膜的多晶区域(29)和由一个单晶区域(30)的其他地方形成。 压阻元件(46)上延伸的半导体材料层(28),在隔膜(29)的横向定界边缘由介电层(45)由绝缘那里和相互连接,从而形成惠斯登电桥的不平衡 允许WHEREOF施加到传感器上的压力进行测量。

    Integrated inkjet print head and manufacturing process thereof
    83.
    发明公开
    Integrated inkjet print head and manufacturing process thereof 失效
    Integrierter Tintenstrahldruckkopf und sein Herstellungsverfahren

    公开(公告)号:EP0887186A1

    公开(公告)日:1998-12-30

    申请号:EP97830321.2

    申请日:1997-06-27

    Abstract: The inkjet print head comprises an ink drop emission mini-gun (30) and a drop emission sensor (4) integrated in a chip of semiconductor material. The mini-gun is formed by an ink chamber (21) and a nozzle (23) in communication with the ink chamber and the drop emission sensor includes a resistive element (4) arranged in a position adjacent to the ink chamber (21). The resistance of the resistive element (4) depends on the pressure exerted thereon, so that when the mini-gun emits an ink drop, it is subjected to a recoil movement which causes a change of pressure and hence of resistance in the resistive element; this change in resistance may be detected through a suitable circuitry (29) to identify whether and when a drop of ink has been emitted.

    Abstract translation: 喷墨打印头包括集成在半导体材料芯片中的墨滴发射微型枪(30)和液滴发射传感器(4)。 微型枪由与墨水室连通的墨水室(21)和喷嘴(23)形成,并且液滴发射传感器包括布置在与墨水室(21)相邻的位置的电阻元件(4)。 电阻元件(4)的电阻取决于施加在其上的压力,使得当微型枪发射墨滴时,其受到反冲运动,其导致电阻元件中的压力变化,从而导致电阻的变化; 可以通过合适的电路(29)来检测电阻的这种变化,以识别是否以及何时已经发射一滴墨水。

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