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    THERMALLY SHORTED BOLOMETER
    81.
    发明申请
    THERMALLY SHORTED BOLOMETER 审中-公开
    热压短筒

    公开(公告)号：WO2015059227A1

    公开(公告)日：2015-04-30

    申请号：PCT/EP2014/072758

    申请日：2014-10-23

    Applicant: ROBERT BOSCH GMBH

    Inventor： SAMARAO, Ashwin ,  ROCZNIK, Thomas ,  YAMA, Gary ,  KIM, Bongsang ,  FEYH, Ando ,  PURKL, Fabian ,  OBRIEN, Gary

    IPC: G01J5/02 ,  G01J5/20

    CPC classification number: B81B7/0019 ,  B81B7/02 ,  B81B2201/0207 ,  B81B2207/11 ,  G01J5/024 ,  G01J5/0245 ,  G01J5/0853 ,  G01J5/20 ,  G02F2201/083 ,  H01L2924/1461 ,  Y10T29/4913

    Abstract: In one embodiment, A MEMS sensor assembly includes a substrate, a first sensor supported by the substrate and including a first absorber spaced apart from the substrate, and a second sensor supported by the substrate and including (i) a second absorber spaced apart from the substrate, and (ii) at least one thermal shorting portion integrally formed with the second absorber and extending downwardly from the second absorber to the substrate thereby thermally shorting the second absorber to the substrate.

    Abstract translation: 在一个实施例中，MEMS传感器组件包括衬底，由衬底支撑并包括与衬底间隔开的第一吸收体的第一传感器和由衬底支撑的第二传感器，并且包括（i）与第二吸收体间隔开的第二吸收体 衬底，和（ii）与第二吸收体一体地形成并从第二吸收体向下延伸到衬底的至少一个热短路部分，从而将第二吸收体热短路到衬底。

    Cell phone having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
    87.
    发明授权
    Cell phone having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor 有权
    在半导体基板上具有单片集成多传感器装置的手机及其方法

    公开(公告)号：US09580302B2

    公开(公告)日：2017-02-28

    申请号：US14207433

    申请日：2014-03-12

    Applicant: Versana Micro Inc.

    Inventor： Bishnu Prasanna Gogoi

    IPC: B81B7/02 ,  H01L27/14 ,  H01L27/22 ,  H01L27/16 ,  H05K7/02 ,  H01L41/113

    CPC classification number: B81B7/02 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/09 ,  H01L27/14 ,  H01L27/16 ,  H01L27/22 ,  H01L41/1132 ,  H01L41/1138 ,  H01L2924/00 ,  H05K7/02

    Abstract: A cell phone is provided having multiple sensors configured to detect and measure different parameters of interest. The cell phone includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The cell phone couples a first parameter to be measured directly to the direct sensor. Conversely, the cell phone can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the cell phone by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.

    Abstract translation: 提供了具有多个传感器的蜂窝电话，该传感器被配置为检测和测量不同的感兴趣的参数。 手机包括至少一个单片集成多传感器（MIMS）装置。 MIMS器件包括形成在公共半导体衬底上的至少两种不同类型的传感器。 例如，MIMS装置可以包括间接传感器和直接传感器。 手机将要直接测量的第一个参数耦合到直接传感器。 相反，手机可以间接地将待测量的第二参数耦合到间接传感器。 可以通过将传感器堆叠到MIMS装置或耦合到MIMS装置的另一基板上而将其它传感器添加到手机。 这支持集成多个传感器，如麦克风，加速度计和温度传感器，以降低成本，复杂性，简化组装，同时提高性能。

    WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING
    88.
    发明申请
    WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING 有权
    WAFER LEVEL MEMS封装包括双密封圈

    公开(公告)号：US20160376146A1

    公开(公告)日：2016-12-29

    申请号：US14748482

    申请日：2015-06-24

    Applicant: Raytheon Company

    Inventor： Buu Q. Diep ,  Adam M. Kennedy ,  Thomas Allan Kocian ,  Mark Lamb

    IPC: B81C1/00 ,  B81B7/00

    CPC classification number: B81B7/0058 ,  B81B7/0041 ,  B81B2201/0207 ,  B81B2201/04 ,  B81C1/00269 ,  B81C1/00317 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019

    Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.

    Abstract translation: 微机电系统（MEMS）封装包括在第一对外边缘之间延伸以限定长度的基板和限定宽度的第二对外边缘。 密封环组件设置在基板上，并且包括至少一个密封环，其形成与至少一个MEMS装置相邻的第一边界点和邻近至少一个外边缘的第二边界点。 封装还包括在密封环组件上的窗口盖，以限定包含至少一个MEMS器件的密封间隙。 密封圈组件在第二边界点将窗口盖固定到基底，使得窗口盖进入密封间隙的偏转减小。

    CMOS-MEMS-CMOS PLATFORM
    89.
    发明申请
    CMOS-MEMS-CMOS PLATFORM 有权
    CMOS-MEMS-CMOS平台

    公开(公告)号：US20160362293A1

    公开(公告)日：2016-12-15

    申请号：US14738745

    申请日：2015-06-12

    Applicant: InvenSense, Inc.

    Inventor： Peter SMEYS ,  Martin LIM

    IPC: B81B7/00

    CPC classification number: B81B7/007 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0278 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/00238 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: A sensor chip combining a substrate comprising at least one CMOS circuit, a MEMS substrate and another substrate comprising at least one CMOS circuit in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first substrate with a first surface and a second surface comprising at least one CMOS circuit; a MEMS substrate with a first surface and a second surface; and a second substrate comprising at least one CMOS circuit. Where the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate. The second surface of the MEMS substrate is attached to the second substrate. The first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached and provided with electrical inter-connects.

    Abstract translation: 公开了一种传感器芯片，其组合包括至少一个CMOS电路，MEMS基板和包括垂直堆叠的一个封装中的至少一个CMOS电路的另一基板的基板。 所述封装包括传感器芯片，还包括具有第一表面的第一基板和包括至少一个CMOS电路的第二表面; 具有第一表面和第二表面的MEMS衬底; 以及包括至少一个CMOS电路的第二衬底。 其中第一衬底的第一表面附接到封装衬底，并且第一衬底的第二表面附接到MEMS衬底的第一表面。 MEMS基板的第二表面附接到第二基板。 第一基板，MEMS基板，第二基板和封装基板机械地连接并设置有电连接。

    MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SUBSTRATE AND METHOD THEREFOR
    90.
    发明申请
    MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SUBSTRATE AND METHOD THEREFOR 审中-公开
    半导体基板上的单片集成多传感器器件及其方法

    公开(公告)号：US20160167953A1

    公开(公告)日：2016-06-16

    申请号：US15049339

    申请日：2016-02-22

    Applicant: Versana Micro Inc

    Inventor： BISHNU PRASANNA GOGOI

    IPC: B81B7/02

    CPC classification number: B81B7/02 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/09 ,  H01L27/14 ,  H01L27/16 ,  H01L27/22 ,  H01L41/1132 ,  H01L41/1138 ,  H01L2924/00 ,  H05K7/02

    Abstract: A monolithically integrated multi-sensor (MIMS) is disclosed. A MIMs integrated circuit comprises a plurality of sensors. For example, the integrated circuit can comprise three or more sensors where each sensor measures a different parameter. The three or more sensors can share one or more layers to form each sensor structure. In one embodiment, the three or more sensors can comprise MEMs sensor structures. Examples of the sensors that can be formed on a MIMs integrated circuit are an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, and a biological sensor.

    Abstract translation: 公开了一种单片集成多传感器（MIMS）。 MIM集成电路包括多个传感器。 例如，集成电路可以包括三个或更多个传感器，其中每个传感器测量不同的参数。 三个或更多个传感器可以共享一个或多个层以形成每个传感器结构。 在一个实施例中，三个或更多个传感器可以包括MEM传感器结构。 可以形成在MIM集成电路上的传感器的示例是惯性传感器，压力传感器，触觉传感器，湿度传感器，温度传感器，麦克风，力传感器，负载传感器，磁传感器， 流量传感器，光传感器，电场传感器，电阻抗传感器，电偶皮响应传感器，化学传感器，气体传感器，液体传感器，固体传感器和生物传感器。

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