-
81.METHOD OF MAKING A PRODUCT WITH A MICRO OR NANO SIZED STRUCTURE 有权
Title translation: 用于生产微米或纳米结构化的产品公开(公告)号:EP1341655B1
公开(公告)日:2008-10-15
申请号:EP01998434.3
申请日:2001-12-03
Applicant: Aquamarijn Holding BV
Inventor: VAN RIJN, Cornelis, Johannes, Maria , VOGELAAR, Laura , NIJDAM, Wietze , BARSEMA, Jonathan, Nathaniel , WESSLING, Matthias
CPC classification number: B01D67/0088 , A61F2/06 , A61F2002/044 , A61F2002/046 , A61L27/50 , A61L27/56 , B01D67/0009 , B01D67/0018 , B01D67/002 , B01D67/0069 , B01D67/0072 , B01D67/0093 , B01D69/00 , B01D69/02 , B01D69/08 , B01D69/12 , B01D71/02 , B01D71/64 , B01D71/68 , B01D2323/06 , B01D2323/08 , B01D2323/30 , B01D2325/022 , B01D2325/04 , B01J19/0093 , B01J2219/00783 , B01J2219/00824 , B01J2219/00833 , B01J2219/00835 , B01J2219/00844 , B01J2219/0086 , B01J2219/00864 , B01J2219/00907 , B01L3/0241 , B01L3/5085 , B01L2200/12 , B01L2300/0819 , B29C33/0033 , B29C41/08 , B29C41/38 , B29C67/02 , B29K2105/0073 , B29L2031/737 , B81B2201/10 , B81C99/008 , B81C2201/0115 , B81C2201/034 , G01N27/44704 , H01L31/18 , Y10T428/24
Abstract: Using phase separation technique perforated as well as non-perforated polymeric structures can be made with high aspect ratios (>5). By varying the phase separation process the properties (e.g. porous, non-porous, dense, open skin) of the moulded product can be tuned. Applications are described in the field of micro fluidics (e.g. micro arrays, electrophoretic boards), optics, polymeric solar cells, ball grid arrays, and tissue engineering.
-
82.
公开(公告)号:EP0831963B1
公开(公告)日:2003-10-22
申请号:EP96920377.7
申请日:1996-05-21
Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
Inventor: CHU, Wen-Hua , FERRARI, Mauro
CPC classification number: A61K9/0097 , A61K9/0024 , B01D39/1692 , B01D39/20 , B01D67/003 , B01D67/0034 , B01D67/0058 , B01D67/0062 , B01D67/0072 , B01D69/02 , B01D69/12 , B01D71/02 , B01D2325/04 , B01J13/02 , B81B3/007 , B81B2201/10 , B81C1/00087 , B81C2201/014 , C04B41/4582 , C23C16/01 , G03F7/00 , G03F7/0015
Abstract: Surface micromachining and bulk micromachining are employed for realizing a porous membrane (102A) with a bulk substrate (106) to form a particle filter (100). The filter (100) is sufficiently sturdy to allow for easy handling. It may be used as a diffusion barrier and under high pressures. A disclosed etching fabrication method is simple, reliable, and integrated-circuit compatible, and thus amenable to mass production. Electronic circuitry may be integrated on the surface of filter (100), as may be desired for several purposes, such as fluid characterization, capsule formation, or self-cleaning or charging of the surface of filter (100).
-
83.APPARATUS AND METHOD FOR FORMING A MEMBRANE WITH NANOMETER SCALE PORES 审中-公开
Title translation: 设备和方法用于生产薄膜在纳米范围内的孔公开(公告)号:EP1233927A1
公开(公告)日:2002-08-28
申请号:EP00980528.4
申请日:2000-11-17
Applicant: The Regents of the University of California
Inventor: HANSFORD, Derek , FERRARI, Mauro
CPC classification number: B81C1/00158 , B01D67/0058 , B01D67/0062 , B01D67/0072 , B01D69/02 , B01D71/02 , B01D71/022 , B01D2325/02 , B01D2325/04 , B01D2325/08 , B81B2201/06 , B81B2201/10 , B81C2201/0109 , B81C2201/014 , B81C2201/053
Abstract: A method of forming a membrane with nanometer scale pores includes forming a sacrificial etch stop layer on a substrate. A base layer is constructed on the sacrificial etch stop layer. Micrometer scale pores are formed within the base layer. A sacrificial base layer is built on the base layer. The sacrificial base layer is removed from selected regions of the base layer to define nanometer scale pores within the base layer. The resultant membrane has sub-fifty nanometer pores formed within it.
-
公开(公告)号:EP0831963A4
公开(公告)日:2000-01-05
申请号:EP96920377
申请日:1996-05-21
Applicant: UNIV CALIFORNIA
Inventor: CHU WEN-HUA , FERRARI MAURO
IPC: A61F2/02 , A61K9/00 , A61K9/50 , B01D39/16 , B01D39/20 , B01D67/00 , B01D69/02 , B01D69/10 , B01D69/12 , B01D71/02 , B01J13/00 , B01J13/02 , B81B1/00 , B81C1/00 , C04B41/45 , C23C16/01 , G03F7/00 , H01L21/205 , H01L21/302 , H01L21/306 , H01L21/3065 , H01L21/31
CPC classification number: A61K9/0097 , A61K9/0024 , B01D39/1692 , B01D39/20 , B01D67/003 , B01D67/0034 , B01D67/0058 , B01D67/0062 , B01D67/0072 , B01D69/02 , B01D69/12 , B01D71/02 , B01D2325/04 , B01J13/02 , B81B3/007 , B81B2201/10 , B81C1/00087 , B81C2201/014 , C04B41/4582 , C23C16/01 , G03F7/00 , G03F7/0015
-
公开(公告)号:KR101771064B1
公开(公告)日:2017-08-24
申请号:KR1020147036187
申请日:2013-06-28
Applicant: 인텔 아이피 코포레이션
CPC classification number: B81C1/00238 , B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/10 , B81B2207/012 , B81B2207/053 , B81B2207/07 , B81B2207/096 , B81C1/0023 , B81C2203/0792 , H01L2224/16225 , H01L2224/48091 , H01L2924/15311 , H01L2924/00014
Abstract: 실시예들에서, 패키지어셈블리는활성면및 비활성면을구비하는마이크로전자기계시스템(MEMS) 및주문형집적회로(ASIC)를포함할수 있다. 실시예들에서, MEMS는하나이상의인터커넥트를거쳐 ASIC에직접연결될수 있다. MEMS, ASIC, 및하나이상의인터커넥트는캐비티를정의하거나형성함으로써 MEMS의활성면일부가캐비티내에존재한다. 일부실시예들에서, 패키지어셈블리는복수의하나이상의인터커넥트를거쳐 ASIC에직접연결된복수의 MEMS를포함할수 있다. 다른실시예들이설명되고/되거나특허청구될수 있다.
Abstract translation: 在实施例中,封装组件可以包括具有有源表面和无源表面的微机电系统(MEMS)和专用集成电路(ASIC)。 在实施例中,MEMS可以经由一个或多个互连直接连接到ASIC。 MEMS,ASIC和一个或多个互连通过在空腔内限定或形成空腔来限定MEMS的一些有源表面。 在一些实施例中,封装组件可以包括经由多个一个或多个互连直接耦合到ASIC的多个MEMS。 其他实施例可以被描述和/或要求保护。
-
公开(公告)号:KR1020040093704A
公开(公告)日:2004-11-08
申请号:KR1020047012035
申请日:2003-02-12
Applicant: 오를리콘 서피스 솔루션스 아크티엔게젤샤프트, 페피콘
Inventor: 에드링거,요하네스 , 하이네-켐프켄스,클라우스 , 쥬게르,오쓰마르
CPC classification number: G02B1/118 , B01D21/0012 , B01D39/2051 , B01L3/502707 , B01L3/50273 , B01L3/502753 , B01L3/502761 , B01L3/502792 , B01L2200/0647 , B01L2200/0668 , B01L2200/141 , B01L2300/0681 , B01L2300/0816 , B01L2300/0825 , B01L2300/16 , B01L2400/0406 , B01L2400/0409 , B01L2400/086 , B81B1/002 , B81B2201/047 , B81B2201/10 , B81B2203/0338 , B81C1/00119 , C23C14/04 , C23C14/046 , G02B5/1809 , G02B5/1847 , G02B5/3058 , G02B5/3083 , G02B2006/12097 , Y10S428/913 , Y10T428/24612 , Y10T428/24942 , Y10T428/249953 , Y10T428/249961 , Y10T428/249975 , Y10T428/249977 , Y10T428/249979 , Y10T428/24998 , Y10T428/31678 , Y10T436/111666 , Y10T436/112499 , Y10T436/25375 , Y10T436/255
Abstract: 광학 컴포넌트 또는 분석적 플랫폼은 기판, 기판 상의 마이크로 구조 (3)의 배열 및 인접한 마이크로 구조들의 측벽에 의해 형성된 마이크로 채널 (15, 15')을 포함하고, 마이크로 채널의 폭은 기판으로부터의 거리의 함수로써 변화하고, 상기 폭은 하나 이상의 거리-간격 내에 있는 기판으로부터의 거리가 증가함에 따라서 연속적으로 감소한다. 그러한 컴포넌트 또는 그러한 플랫폼을 제조하는 방법에 있어서 표면 마이크로 구조들의 배열을 가진 기판은 코팅 메카니즘의 쉐도우잉 (shadowing) 효과들이 마이크로 구조들의 측벽들의 상부 폭의 적어도 일부를 좁아지게 하여 적어도 부분적으로 내장된 (embedded) 마이크로 채널을 형성하게 하는 방식으로 증기 처리 내에서 코팅된다.
-
公开(公告)号:TW201515189A
公开(公告)日:2015-04-16
申请号:TW103120535
申请日:2014-06-13
Applicant: 英特爾IP公司 , INTEL IP CORPORATION
Inventor: 歐弗納 吉拉德 , OFNER, GERALD , 梅耶爾 特羅斯登 , MEYER, THORSTEN , 曼科普夫 倫哈德 , MAHNKOPF, REINHARD , 吉瑟勒 克里斯坦 , GEISSLER, CHRISTIAN , 奧古斯汀 安卓斯 , AUGUSTIN, ANDREAS
IPC: H01L25/18
CPC classification number: B81C1/00238 , B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/10 , B81B2207/012 , B81B2207/053 , B81B2207/07 , B81B2207/096 , B81C1/0023 , B81C2203/0792 , H01L2224/16225 , H01L2224/48091 , H01L2924/15311 , H01L2924/00014
Abstract: 在實施例中,一種封裝總成可包括一特殊應用積體電路(ASIC)及一微機電系統(MEMS),該微機電系統具有一作用側及一非作用側。在實施例中,該MEMS可藉由一或多個互連件直接耦接至該ASIC。該MEMS、該ASIC及該一或多個互連件可界定或形成一空腔,使得該MEMS之該作用部分處於該空腔內。在一些實施例中,該封裝總成可包括多個MEMS,該等多個MEMS藉由一或多個互連件中之多個直接耦接至該ASIC。本案可描述且/或主張其他實施例。
Abstract in simplified Chinese: 在实施例中,一种封装总成可包括一特殊应用集成电路(ASIC)及一微机电系统(MEMS),该微机电系统具有一作用侧及一非作用侧。在实施例中,该MEMS可借由一或多个互连件直接耦接至该ASIC。该MEMS、该ASIC及该一或多个互连件可界定或形成一空腔,使得该MEMS之该作用部分处于该空腔内。在一些实施例中,该封装总成可包括多个MEMS,该等多个MEMS借由一或多个互连件中之多个直接耦接至该ASIC。本案可描述且/或主张其他实施例。
-
88.光構件,分析平台,用於從流體中過濾出給定尺寸大小的粒子之方法,以及用於產生一列嵌入微通道之方法 COMPONENT COMPRISING SUBMICRON HOLLOW SPACES 失效
Simplified title: 光构件,分析平台,用于从流体中过滤出给定尺寸大小的粒子之方法,以及用于产生一列嵌入微信道之方法 COMPONENT COMPRISING SUBMICRON HOLLOW SPACES公开(公告)号:TW200304551A
公开(公告)日:2003-10-01
申请号:TW092102873
申请日:2003-02-12
Applicant: 恩艾克西斯巴爾斯股份有限公司 UNAXIS BALZERS LIMITED
CPC classification number: G02B1/118 , B01D21/0012 , B01D39/2051 , B01L3/502707 , B01L3/50273 , B01L3/502753 , B01L3/502761 , B01L3/502792 , B01L2200/0647 , B01L2200/0668 , B01L2200/141 , B01L2300/0681 , B01L2300/0816 , B01L2300/0825 , B01L2300/16 , B01L2400/0406 , B01L2400/0409 , B01L2400/086 , B81B1/002 , B81B2201/047 , B81B2201/10 , B81B2203/0338 , B81C1/00119 , C23C14/04 , C23C14/046 , G02B5/1809 , G02B5/1847 , G02B5/3058 , G02B5/3083 , G02B2006/12097 , Y10S428/913 , Y10T428/24612 , Y10T428/24942 , Y10T428/249953 , Y10T428/249961 , Y10T428/249975 , Y10T428/249977 , Y10T428/249979 , Y10T428/24998 , Y10T428/31678 , Y10T436/111666 , Y10T436/112499 , Y10T436/25375 , Y10T436/255
Abstract: 一種光構件或分析平臺包括:一基板;一微結構陣列,形成於該基板上;以及微通道,由各相鄰微結構之側壁形成,各微通道的寬度會隨著與該基板之距離的函數而改變,該寬度會隨著量自該基板落在至少一個距離-間隔內之距離的增加而連續地減小。一種用於製造這種構件或這種平臺的方法,係在氣相處理法中使基板塗覆有由各表面微結構所構成的陣列,其方式是使塗覆機構的陰影效應至少局部地縮減了各微結構側壁之上邊部位的寬度,因此形成了至少呈局部嵌入的微通道。
Abstract in simplified Chinese: 一种光构件或分析平台包括:一基板;一微结构数组,形成于该基板上;以及微信道,由各相邻微结构之侧壁形成,各微信道的宽度会随着与该基板之距离的函数而改变,该宽度会随着量自该基板落在至少一个距离-间隔内之距离的增加而连续地减小。一种用于制造这种构件或这种平台的方法,系在气相处理法中使基板涂覆有由各表面微结构所构成的数组,其方式是使涂覆机构的阴影效应至少局部地缩减了各微结构侧壁之上边部位的宽度,因此形成了至少呈局部嵌入的微信道。
-
公开(公告)号:TWI585944B
公开(公告)日:2017-06-01
申请号:TW103120535
申请日:2014-06-13
Applicant: 英特爾IP公司 , INTEL IP CORPORATION
Inventor: 歐弗納 吉拉德 , OFNER, GERALD , 梅耶爾 特羅斯登 , MEYER, THORSTEN , 曼科普夫 倫哈德 , MAHNKOPF, REINHARD , 吉瑟勒 克里斯坦 , GEISSLER, CHRISTIAN , 奧古斯汀 安卓斯 , AUGUSTIN, ANDREAS
IPC: H01L25/18
CPC classification number: B81C1/00238 , B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/10 , B81B2207/012 , B81B2207/053 , B81B2207/07 , B81B2207/096 , B81C1/0023 , B81C2203/0792 , H01L2224/16225 , H01L2224/48091 , H01L2924/15311 , H01L2924/00014
-
90.光構件、分析平台、用於從流體中過濾出給定尺寸大小的粒子之方法、以及用於產生一列嵌入微通道之方法 COMPONENT COMPRISING SUBMICRON HOLLOW SPACES 失效
Simplified title: 光构件、分析平台、用于从流体中过滤出给定尺寸大小的粒子之方法、以及用于产生一列嵌入微信道之方法 COMPONENT COMPRISING SUBMICRON HOLLOW SPACES公开(公告)号:TWI266899B
公开(公告)日:2006-11-21
申请号:TW092102873
申请日:2003-02-12
Applicant: 恩艾克西斯巴爾斯股份有限公司 UNAXIS BALZERS LIMITED
Inventor: 强尼艾林格 JOHANNES EDLINGER , 克勞斯海尼坎普肯斯 CLAUS HEINE-KEMPKENS , 歐斯馬入格
CPC classification number: G02B1/118 , B01D21/0012 , B01D39/2051 , B01L3/502707 , B01L3/50273 , B01L3/502753 , B01L3/502761 , B01L3/502792 , B01L2200/0647 , B01L2200/0668 , B01L2200/141 , B01L2300/0681 , B01L2300/0816 , B01L2300/0825 , B01L2300/16 , B01L2400/0406 , B01L2400/0409 , B01L2400/086 , B81B1/002 , B81B2201/047 , B81B2201/10 , B81B2203/0338 , B81C1/00119 , C23C14/04 , C23C14/046 , G02B5/1809 , G02B5/1847 , G02B5/3058 , G02B5/3083 , G02B2006/12097 , Y10S428/913 , Y10T428/24612 , Y10T428/24942 , Y10T428/249953 , Y10T428/249961 , Y10T428/249975 , Y10T428/249977 , Y10T428/249979 , Y10T428/24998 , Y10T428/31678 , Y10T436/111666 , Y10T436/112499 , Y10T436/25375 , Y10T436/255
Abstract: 一種光構件或分析平臺包括:一基板;一微結構陣列,形成於該基板上;以及微通道,由各相鄰微結構之側壁形成,各微通道的寬度會隨著與該基板之距離的函數而改變,該寬度會隨著量自該基板落在至少一個距離-間隔內之距離的增加而連續地減小。一種用於製造這種構件或這種平臺的方法,係在氣相處理法中使基板塗覆有由各表面微結構所構成的陣列,其方式是使塗覆機構的陰影效應至少局部地縮減了各微結構側壁之上邊部位的寬度,因此形成了至少呈局部嵌入的微通道。
Abstract in simplified Chinese: 一种光构件或分析平台包括:一基板;一微结构数组,形成于该基板上;以及微信道,由各相邻微结构之侧壁形成,各微信道的宽度会随着与该基板之距离的函数而改变,该宽度会随着量自该基板落在至少一个距离-间隔内之距离的增加而连续地减小。一种用于制造这种构件或这种平台的方法,系在气相处理法中使基板涂覆有由各表面微结构所构成的数组,其方式是使涂覆机构的阴影效应至少局部地缩减了各微结构侧壁之上边部位的宽度,因此形成了至少呈局部嵌入的微信道。
-
-
-
-
-
-
-
-
-