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    Circuit Board and Electronic Device
    81.
    发明公开
    Circuit Board and Electronic Device 审中-公开

    公开(公告)号：US20230345619A1

    公开(公告)日：2023-10-26

    申请号：US17799917

    申请日：2021-11-16

    Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

    Inventor： Qianlin PU ,  Fei LI ,  Zijian WANG ,  Xu LU

    IPC: H05K1/14 ,  H05K1/02

    CPC classification number: H05K1/0218 ,  H05K1/028 ,  H05K1/144 ,  H05K2201/043

    Abstract: A circuit board and an electronic device, the circuit board includes a first wiring board including a first substrate and a first wiring layer disposed on a first side surface of the first substrate, and the first wiring layer includes a first ground wiring; the circuit board further includes a first protective layer and a first electromagnetic interference shielding layer sequentially stacked on a side of the first wiring layer away from the first substrate; the first protective layer has a first opening exposing at least a portion of a first ground wiring, the first opening is filled with a first conductive material, height difference between a surface of the first conductive material and a surface of the first protective layer away from the first substrate ranges from 0 to 2 microns, and the first conductive material connects the first electromagnetic interference shielding layer to the first grounding wiring.

    MODULES AND CONNECTIONS FOR MODULES TO COUPLE TO A COMPUTING DEVICE
    84.
    发明申请
    MODULES AND CONNECTIONS FOR MODULES TO COUPLE TO A COMPUTING DEVICE 有权
    用于耦合到计算设备的模块的模块和连接

    公开(公告)号：US20150277503A1

    公开(公告)日：2015-10-01

    申请号：US14626723

    申请日：2015-02-19

    Applicant: Google, Inc.

    Inventor： Paul Eremenko ,  Ara Knaian ,  Seth Newburg ,  David Fishman

    IPC: G06F1/16 ,  H04M1/02 ,  H04W88/02

    CPC classification number: G06F1/1658 ,  G06F1/1684 ,  H04M1/0254 ,  H04M1/0274 ,  H04W88/02 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/044

    Abstract: Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.

    Abstract translation: 本文的示例包括用于耦合到计算设备的模块的模块和连接。 示例性模块包括壳体，其包括耦合到计算设备的端部，多个电容焊盘，每个电容焊盘包括用于实现数据传输的数据触点，功率接触焊盘以提供或接收电力，以及接地触点焊盘以耦合到地。 接地焊盘的尺寸大于电源接触焊盘，并且接地焊盘定位成比电源接触焊盘更接近配置成耦合到计算设备的壳体的端部。

    Thin multi-chip flex module
    87.
    发明授权
    Thin multi-chip flex module 有权
    薄多芯片柔性模块

    公开(公告)号：US07796399B2

    公开(公告)日：2010-09-14

    申请号：US12317892

    申请日：2008-12-30

    Applicant: James E. Clayton ,  Zakaryae Fathi

    Inventor： James E. Clayton ,  Zakaryae Fathi

    IPC: H05K1/18 ,  H05K7/20 ,  H01R12/24 ,  H01R43/02 ,  H04L12/50 ,  H01L23/34

    CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

    Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.

    Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 导电图案包括与衬底的一个边缘相邻的一系列电接触。 衬底被粘合到两个刚性框架上，每个相对表面上一个。 每个衬底在一个边缘上具有一系列在优选通过焊接的衬底上对准并电连接到衬底上的相应接触件的蓖耳。 当模块与低轮廓的针阵列接触时，这些哨座可以用作自对准机构，并且模块可以通过插座中的导轨固定在主板上的位置，该插座与垂直于雉鸡的边缘接合 模块的边缘。 模块还可以设置有保护性散热罩。

    Compact circuit carrier package
    88.
    发明授权
    Compact circuit carrier package 有权
    紧凑型电路载体封装

    公开(公告)号：US07754976B2

    公开(公告)日：2010-07-13

    申请号：US10122766

    申请日：2002-04-15

    Applicant: Ralf Greiner ,  Josef Maier ,  Kai Paintner ,  Richard Sinning

    Inventor： Ralf Greiner ,  Josef Maier ,  Kai Paintner ,  Richard Sinning

    IPC: H05K1/14

    CPC classification number: H05K3/4614 ,  H01L2224/48472 ,  H01L2924/19107 ,  H05K1/0272 ,  H05K1/0306 ,  H05K1/144 ,  H05K3/305 ,  H05K3/4629 ,  H05K2201/043 ,  H05K2201/096 ,  H05K2203/049

    Abstract: A circuit carrier assembly includes a plurality of substrates directly secured together by an electrically conductive securing substance. In one example, the securing substance is a conductive epoxy. In another example, the electrically conductive securing substance is solder. Still another example includes a combination of solder and conductive epoxy. A non-conductive epoxy provides further mechanical connection and thermal conductivity between the substrates while also electrically isolating selected portions of the substrates in one example. The electrically conductive securing substance not only mechanically secures the substrates together and provides thermal conductivity between the substrates, which increases the thermal capacitance of the assembly, but also establishes at least one electrically conductive path between the substrates.

    Abstract translation: 电路载体组件包括通过导电固定物质直接固定在一起的多个基底。 在一个实例中，固定物质是导电环氧树脂。 在另一示例中，导电固定物质是焊料。 另一个实例包括焊料和导电环氧树脂的组合。 非导电环氧树脂在基板之间提供进一步的机械连接和导热性，同时在一个实例中也电绝缘基板的选定部分。 导电固定物质不仅将基板机械地固定在一起并且在基板之间提供导热性，这增加了组件的热容，而且在基板之间建立了至少一个导电路径。

    Thin multi-chip flex module
    89.
    发明授权
    Thin multi-chip flex module 有权
    薄多芯片柔性模块

    公开(公告)号：US07724530B2

    公开(公告)日：2010-05-25

    申请号：US12317890

    申请日：2008-12-30

    Applicant: James E. Clayton ,  Zakaryae Fathi

    Inventor： James E. Clayton ,  Zakaryae Fathi

    IPC: H05K1/00 ,  H05K7/20

    CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

    Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

    Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 基板的一部分是柔性的并且分叉。 两个刚性构件纵向连接，一个位于衬底的两侧，并且分叉的自由端分别围绕这些构件反射并结合到它们上。 电极位于分叉处，使得它们在反射之后将向外和/或向下暴露。 模块还可以设置有保护性散热罩。 电极和刚性构件可以被配置为接合配合插座，或者它们可焊接到印刷电路板。

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