公开(公告)号：WO2008055708A2

公开(公告)日：2008-05-15

申请号：PCT/EP2007/009854

申请日：2007-11-09

Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. ,  POLITYKO, Dmitry, David ,  WENZEL, Stephan ,  JUNG, Erik ,  HEFER, Jan ,  NIEDERMAYER, Michael ,  GUTTOWSKI, Stephan

Inventor： POLITYKO, Dmitry, David ,  WENZEL, Stephan ,  JUNG, Erik ,  HEFER, Jan ,  NIEDERMAYER, Michael ,  GUTTOWSKI, Stephan

IPC: H05K1/18 ,  H01L23/538

CPC classification number: H05K1/144 ,  H05K1/145 ,  H05K1/189 ,  H05K2201/042 ,  H05K2201/10454 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611

Abstract: Die vorliegende Erfindung betrifft eine mikroelektronische Baugruppe, umfassend mindestens zwei parallel übereinander angeordnete Schaltungsträgerlagen (1, 2, 3), die durch verschiedene Abschnitte eines zumindest bereichsweise flexiblen gefalteten Substrats gebildet und mit elektronischen Bauelementen bestückt sind, wobei die Schaltungsträgerlagen (1, 2, 3) durch mindestens ein oberflächenmontiertes Bauelement (4, 4'), das Bestandteil einer Schaltung auf zumindest einer der Schaltungsträgerlagen (1, 2, 3) ist, mechanisch miteinander verbunden sind. Die Erfindung betrifft ferner ein Verfahren zum Herstellen einer solchen mikroelektronischen Baugruppe.

Abstract translation: 本发明涉及一种微电子组件，包括至少两个平行的叠置的电路载体层（1，2，3），它们由一个至少部分柔性的折叠基板的不同部分上形成，并装有电子部件，其中所述电路载体层（1，2，3 ）通过在电路载体层（中的至少一个上形成的电路的一部分的至少一个表面安装装置（4，4“）1，2，3），是机械地相互连接。 本发明还涉及一种用于制造这种微电子器件的方法。

公开(公告)号：WO2005085891A1

公开(公告)日：2005-09-15

申请号：PCT/US2005/005946

申请日：2005-02-25

Applicant: HONEYWELL INTERNATIONAL INC. ,  WAN, Hong ,  BRATLAND, Tamara, K. ,  BEHLINGER, Michael, J. ,  JENSEN, Ronald, J.

Inventor： WAN, Hong ,  BRATLAND, Tamara, K. ,  BEHLINGER, Michael, J. ,  JENSEN, Ronald, J.

IPC: G01R33/02

CPC classification number: G01R33/0206 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/4903 ,  H01L2224/73265 ,  H05K1/181 ,  H05K2201/10151 ,  H05K2201/10454 ,  H05K2201/1053 ,  H05K2201/10537 ,  Y02P70/611 ,  Y10T29/49002 ,  H01L2924/00014

Abstract: Methods and apparatus for vertical die chip-on-board sensor packages are provided. Such vertical die chip-on-board sensor packages can cormprise a vertical sensor circuit component comprising a first face, a seond face, a bottom edge, a top edge, two side edges, input/output (I/O) pads and at least one sensitive direction wherein the I/O pads are arranged near the bottom edge. Such vertical die chip-on-board sensor packages can also comprise one or more horizontal sensor circuit components comprising a top face, a printed circuit board (PCB) mounting face, a vertical sensor circuit component interface edge, two or more other edges, and one or more sensitive directions wherein the vertical sensor circuit component interface edge supports the vertical sensor circuit component along the Z axis and conductively or non-conductively connects to the vertical sensor circuit component. The methods and apparatus provided include a multi-axis magnetometer for measuring the magnetic field intensity along three orthogonal axes comprising one or more magnetic field sensing circuit components mounted by their PCB mounting face to a PCB and a vertical magnetic sensor circuit component mounted to the PCB such that the vertical magnetic sensor circuit component is attached to and supported by the magnetic field sensing circuit component.

Abstract translation: 提供了用于垂直芯片片上传感器封装的方法和装置。 这种垂直芯片芯片上的传感器封装可以包括垂直传感器电路部件，包括第一面，表面，底部边缘，顶部边缘，两个侧边缘，输入/输出（I / O）焊盘和至少 一个敏感方向，其中I / O焊盘设置在底部边缘附近。 这种垂直芯片片上传感器封装还可以包括一个或多个水平传感器电路部件，其包括顶面，印刷电路板（PCB）安装面，垂直传感器电路部件接口边缘，两个或更多个其他边缘，以及 一个或多个敏感方向，其中垂直传感器电路部件接口边缘沿着Z轴支撑垂直传感器电路部件，并且导电地或非导电地连接到垂直传感器电路部件。 提供的方法和装置包括用于沿着三个正交轴测量磁场强度的多轴磁力计，包括一个或多个由其PCB安装面安装到PCB的磁场感测电路部件和安装到PCB的垂直磁传感器电路部件 使得垂直磁传感器电路部件附接到磁场感测电路部件并由其支持。

公开(公告)号：WO02025731A1

公开(公告)日：2002-03-28

申请号：PCT/JP2001/008053

申请日：2001-09-17

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/373 ,  H01L23/40 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/0209 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/40 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10454 ,  H05K2201/10522 ,  H01L2924/00

Abstract: Electronic equipment, comprising a wiring substrate, an electronic part installed on the wiring substrate and having a radiating part on the surface thereof, and an insulating radiating plate thermally connected to the electronic part, wherein the radiating part is directly connected to the radiating plate with thermally conductive adhesive agent, and the radiating plate is a ceramic plate having at least one land for electronic part connection or a resin plate including a high thermally conductive material, whereby, because the insulating radiating plate is directly connected to the electronic part emitting heat, a conventional insulating plate need not be installed between the radiating plate and the electronic part, and the radiating effect of the electronic part of the electronic equipment can be increased.

Abstract translation: 电子设备，包括布线基板，安装在布线基板上并在其表面上具有辐射部分的电子部件，以及与电子部件热连接的绝缘散热板，其中，辐射部分与辐射板直接连接， 导热性粘合剂，散热板是具有至少一个用于电子部件连接的焊盘或包括高导热性材料的树脂板的陶瓷板，由于绝缘散热板直接连接到发热的电子部件， 不需要在散热板和电子部件之间安装传统的绝缘板，并且可以增加电子设备的电子部件的散热效果。

公开(公告)号：EP3241411A1

公开(公告)日：2017-11-08

申请号：EP15798383.4

申请日：2015-11-18

Applicant: Thales

Inventor： GREMILLET, Patrick ,  LEDAIN, Bernard

IPC: H05K1/02

CPC classification number: H01L23/60 ,  H01L23/053 ,  H01L23/3114 ,  H01L23/3677 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49833 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/0999 ,  H05K2201/10454 ,  Y02P70/613 ,  H01L2224/45099

Abstract: The invention relates to a housing that can encapsulate at least one component (2), forming a closed cavity of the Faraday cage type, and having side walls (4) that rest on a base (3) and on top of which an end plate (5) is mounted, characterised in that at least one of said side walls comprises outer electrical connection elements that are electrically connected inside said cavity, said outer connection elements being able to interconnect to an outer circuit (6) such that said side wall faces said outer circuit (6) when said outer connection elements are interconnected to said circuit.

公开(公告)号：EP2947973A1

公开(公告)日：2015-11-25

申请号：EP15168562.5

申请日：2015-05-21

Applicant: Nichia Corporation

Inventor： Nakabayashi, Takuya ,  Hori, Akira

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K1/111 ,  G02B6/0066 ,  G02B6/0073 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10454 ,  H05K2203/048 ,  Y02P70/611

Abstract: A mounting structure for a semiconductor device includes a semiconductor device including an external connection terminal (3) disposed at each of both ends in a longitudinal direction; and a mounting substrate (51) for mounting the semiconductor device thereon. The external connection terminal (3) has a metal region on a mounting surface for mounting the semiconductor device on the mounting substrate (51); a device-side mounting insulating region (34) is defined by the metal region; the mounting substrate (51) has on a mounting surface side thereof a land pattern (52) made of an electrically conductive material on an insulating region, to connect the external connection terminal (3); and the land pattern (52) is formed in a shape surrounding an end portion of the semiconductor device, and the land pattern (52) includes a land-side insulating region (54) that is an insulating region extending along the device-side mounting insulating region (34).

Abstract translation: 半导体器件的安装结构包括半导体器件，其包括设置在纵向两端的每一端的外部连接端子（3） 以及用于在其上安装半导体器件的安装基板（51）。 外部连接端子（3）在安装表面上具有用于将半导体器件安装在安装基板（51）上的金属区域; 由金属区域限定器件侧安装绝缘区域（34）; 安装基板（51）在其安装表面侧具有在绝缘区域上由导电材料制成的焊盘图案（52），以连接外部连接端子（3）; 并且所述焊盘图案（52）形成为围绕所述半导体器件的端部的形状，并且所述焊盘图案（52）包括：焊盘侧绝缘区域（54），其是沿着所述器件侧安装 绝缘区域（34）。

公开(公告)号：EP2517232A2

公开(公告)日：2012-10-31

申请号：EP10844170.0

申请日：2010-12-07

Applicant: Intel Corporation ,  Mohammed, Edris M.

Inventor： AU, Hinmeng

IPC: H01L21/60 ,  H01L23/48

CPC classification number: H05K1/181 ,  H05K3/403 ,  H05K2201/10454 ,  Y02P70/611 ,  Y10T29/49124

Abstract: Embodiments are directed to an apparatus and fabrication method to form pad arrays on the edge of a substrate wafer substrate. Embodiments of the invention make it possible for surface mount devices to be bonded vertically (i.e. on their side) using standard semiconductor assembly processes.

公开(公告)号：EP1620863B1

公开(公告)日：2012-03-07

申请号：EP04750897.3

申请日：2004-04-30

Applicant: TYCO Electronics Corporation

Inventor： BECKER, Paul, N. ,  MANIRAJ, Sirikhit ,  PINEDA, Martin, ,  VRANICAR, Anthony ,  YANKELLO, Francis, M. ,  WASILEWSKI, Frank

IPC: H05K3/34 ,  H01C1/144 ,  H01C1/14 ,  H01C1/016

CPC classification number: H01C1/016 ,  H01C1/1406 ,  H01C1/144 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10643 ,  Y02P70/613

Abstract: A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5, 7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion, The first attachment portion may contain a slot (49) and a solid hinge portion (51). When the device is mounted on a substrate by means of a mounting component (41) extending from the first terminal, the first flexible portion allows contraction and expansion of the conductive polymer despite the rigid attachment of the mounting component onto the substrate.

公开(公告)号：EP1698033A4

公开(公告)日：2010-07-21

申请号：EP04817915

申请日：2004-12-22

Applicant: X2Y ATTENUATORS LLC

Inventor： ANTHONY DAVID ,  ANTHONY ANTHONY ,  ANTHONY WILLIAM M ,  MUCCIOLI JAMES ,  NEIFELD RICHARD A

IPC: H02H9/00 ,  H05K1/02

CPC classification number: H01G4/35 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01P1/203 ,  H05K1/0233 ,  H05K2201/09254 ,  H05K2201/0969 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2201/1006 ,  H05K2201/10454 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

公开(公告)号：EP1718984A1

公开(公告)日：2006-11-08

申请号：EP05723703.4

申请日：2005-02-25

Applicant: Honeywell International Inc.

Inventor： WAN, Hong ,  BRATLAND, Tamara, K. ,  BEHLINGER, Michael, J. ,  JENSEN, Ronald, J.

IPC: G01R33/02

CPC classification number: G01R33/0206 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/4903 ,  H01L2224/73265 ,  H05K1/181 ,  H05K2201/10151 ,  H05K2201/10454 ,  H05K2201/1053 ,  H05K2201/10537 ,  Y02P70/611 ,  Y10T29/49002 ,  H01L2924/00014

Abstract: Methods and apparatus for vertical chip-on-board sensor packages can comprise a vertical sensor circuit component comprising a first face, a second face, a bottom edge, a top edge, two side edges, input/output (I/O) pads and at least one sensitive direction wherein the I/O pads are arranged near the bottom edge. Such vertical die chip-on-board sensor packages can also comprise one or more horizontal sensor circuit components comprising a top face, a printed circuit board (PCB) mounting face, a vertical sensor circuit component interface edge, two or more other edges, and one or more sensitive directions wherein the vertical sensor circuit component interface edge supports the vertical sensor circuit component along the Z axis and conductively or non-conductively connects to the vertical sensor circuit component. The methods and apparatus provided include a multi-axis magnetometer for measuring the magnetic field intensity along three orthogonal axes comprising one or more magnetic field sensing circuit components mounted by their PCB mounting face to a PCB and a vertical magnetic sensor circuit component mounted to the PCB such that the vertical magnetic sensor circuit component is attached to and supported by the magnetic field sensing circuit component.

Abstract translation: 用于垂直芯片对板传感器封装的方法和装置可以包括垂直传感器电路部件，其包括第一面，第二面，底部边缘，顶部边缘，两个侧边缘，输入/输出（I / O）焊盘和 至少一个敏感方向，其中I / O焊盘设置在底部边缘附近。 这种垂直芯片片上传感器封装还可以包括一个或多个水平传感器电路部件，其包括顶面，印刷电路板（PCB）安装面，垂直传感器电路部件接口边缘，两个或更多个其他边缘，以及 一个或多个敏感方向，其中垂直传感器电路部件接口边缘沿着Z轴支撑垂直传感器电路部件，并且导电或非导电地连接到垂直传感器电路部件。 提供的方法和装置包括用于沿着三个正交轴测量磁场强度的多轴磁力计，包括一个或多个由其PCB安装面安装到PCB的磁场感测电路部件和安装到PCB的垂直磁传感器电路部件 使得垂直磁传感器电路部件附接到磁场感测电路部件并由其支持。

公开(公告)号：EP1253636A8

公开(公告)日：2003-03-12

申请号：EP01967704.6

申请日：2001-09-17

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： SEGI, Hiroshi ,  TANIGUCHI, Toshiyuki ,  MURAKAMI, Takaharu

IPC: H01L23/40

CPC classification number: H05K1/0209 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/40 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10454 ,  H05K2201/10522 ,  H01L2924/00

Abstract: Electronic equipment comprising a wiring board, electronic component mounted on the wiring board and having a heat dissipation portion on the surface thereof, and an insulating heat dissipation plate thermally connected to the electronic component, wherein the heat dissipation portion is directly connected to the heat dissipation plate with heat conductive bonding materials. The heat dissipation plate is a ceramic plate having at least one land for connecting electronic component or a resin plate containing highly heat conductive material. By directly connecting the insulating heat dissipation plate to electronic component generating heat, an insulating plate between the heat dissipation plate and the electronic component used in a conventional method becomes not required. Consequently, it is possible to enhance a heat dissipation effect of electronic component in electronic equipment.