公开(公告)号：US20180324944A1

公开(公告)日：2018-11-08

申请号：US15589153

申请日：2017-05-08

Applicant: International Business Machines Corporation

Inventor： Bruce J. Chamberlin ,  Scott B. King ,  Joseph Kuczynski ,  David J. Russell

IPC: H05K1/02 ,  H05K3/28 ,  H05K1/18

CPC classification number: H05K1/0201 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10575 ,  H05K2203/175 ,  H05K2203/176

Abstract: An apparatus is configured with a component having a coating comprising a material in a first phase (e.g., solid and/or liquid phase) with a transition temperature. The component is mechanically and/or electrically attached to a substrate. Exposure of the coating to a temperature that meets or exceeds the transition temperature causes the material to undergo a phase change. The phase change of the material alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment, thereby mitigating damage to the substrate and/or component.

公开(公告)号：US20160334279A1

公开(公告)日：2016-11-17

申请号：US14714005

申请日：2015-05-15

Applicant: Google Inc.

Inventor： Adam Mittleman ,  Ian Charles Smith ,  Daniel Adam Warren ,  William Raeming Dong ,  Jeff Wheeler

IPC: G01J5/06 ,  G01J5/00 ,  G01J5/10 ,  H05K1/02

CPC classification number: G01J5/06 ,  G01J5/0014 ,  G01J5/0205 ,  G01J5/04 ,  G01J5/10 ,  G08B13/189 ,  G08B13/191 ,  H05K1/0201 ,  H05K1/0298 ,  H05K2201/09063 ,  H05K2201/093 ,  H05K2201/09363 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/10575 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayered circuit board having a metal-free region vertically extending through at least a portion of a conductive layer, which lies generally parallel to a horizontal plane, vertically spaced from an outer surface. Heat-emitting and heat-sensitive components are mounted on the outer surface. The heat-emitting component is vertically and laterally spaced from the metal-free region, whereas the heat-sensitive component is vertically spaced and laterally aligned within the metal-free region such that the metal-free region is a thermal barrier that shields heat-sensitive component from radial heat flowing from the heat-emitting component.

Abstract translation: 一种多层电路板，其具有垂直延伸穿过导电层的至少一部分的无金属区域，该导电层大致平行于与外表面垂直间隔的水平平面。 发热和热敏元件安装在外表面上。 发热部件与无金属区域垂直和横向间隔开，而热敏部件在无金属区域内垂直间隔开并横向对准，使得无金属区域是屏蔽热 - 来自发热部件的径向热的敏感部件。

公开(公告)号：US09161449B2

公开(公告)日：2015-10-13

申请号：US14066163

申请日：2013-10-29

Applicant: LARVIEW TECHNOLOGIES CORP.

Inventor： Shin-Dar Jan

IPC: H01L31/0232 ,  H01L31/0203 ,  H05K1/18

CPC classification number: H05K1/18 ,  H05K1/0274 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10575 ,  Y02P70/611

Abstract: An image sensor module is provided. The image sensor module includes a circuit board, a flat material, an image sensing chip, a holder and a covering plate. The flat material disposed on an assembling surface of the circuit board has a supporting surface and a bottom surface opposite thereto. The image sensing chip with its base surface facing to the supporting surface is configured on the supporting surface. The holder is disposed on the flat material, and the bottom plane of the holder faces to the supporting surface. The supporting surface is used to make the base surface parallel to the bottom plane. The covering plate is arranged on the holder to seal the image sensing chip.

Abstract translation: 提供图像传感器模块。 图像传感器模块包括电路板，扁平材料，图像感测芯片，保持器和覆盖板。 设置在电路板的组装表面上的扁平材料具有支撑表面和与其相对的底表面。 其基面朝向支撑表面的图像感测芯片被配置在支撑表面上。 保持器设置在平坦材料上，并且保持器的底面面向支撑表面。 支撑面用于使底面平行于底面。 覆盖板布置在保持器上以密封图像感测芯片。

公开(公告)号：US08631569B2

公开(公告)日：2014-01-21

申请号：US10572953

申请日：2004-09-20

Applicant: Dietmer Birgel ,  Karl-Peter Hauptvogel ,  Paul Burger ,  Andreas Bensch ,  Herbert Harder ,  Andreas Kiefer ,  Klaus Peter Weinhold

Inventor： Dietmer Birgel ,  Karl-Peter Hauptvogel ,  Paul Burger ,  Andreas Bensch ,  Herbert Harder ,  Andreas Kiefer ,  Klaus Peter Weinhold

IPC: H01K3/10

CPC classification number: H05K13/0465 ,  H05K1/036 ,  H05K1/119 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10575 ,  H05K2201/1059 ,  H05K2203/1476 ,  Y10T29/49165

Abstract: In order to secure wired components of large mass or non-uniform mass distribution safely on a circuit board, without the components needing, as currently usual, to be glued onto the circuit board or held on the circuit board with snap-in holders, integrated into a connection bore for receiving a connection wire, or pin, of an electronic component a holding mechanism for secured holding of the connection wire, or pin. The holding mechanism represents a narrowing in the connection bore to a diameter smaller than that of the connection wire, or pin. The holding mechanism can be implemented, for example, by a connection bore embodied in the form of a bore drilled from one side of the circuit board, not completely through the circuit board. In such case, edge remains as a narrowing, which securely seizes the connection pin of the relevant component and holds the component fixed to the circuit board.

Abstract translation: 为了在电路板上安全地将大质量或不均匀质量分布的有线部件安全地固定在电路板上，而不需要像现在常用的组件一样被胶合到电路板上或者用卡入式保持器固定在电路板上，集成 进入用于接收电子部件的连接线或销的连接孔，用于固定地保持连接线或销的保持机构。 保持机构表示连接孔的直径小于连接线或销的直径。 保持机构可以例如通过以电路板的一侧钻出的孔的形式而不是完全通过电路板实现的连接孔来实现。 在这种情况下，边缘保持为狭窄，其牢固地抓住相关部件的连接销并将固定在电路板上的部件保持在一起。

公开(公告)号：US20120282787A1

公开(公告)日：2012-11-08

申请号：US13460599

申请日：2012-04-30

Applicant: Jay Stanke

Inventor： Jay Stanke

IPC: H01R12/71

CPC classification number: H05K3/3421 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/147 ,  H05K3/32 ,  H05K2201/049 ,  H05K2201/0979 ,  H05K2201/1031 ,  H05K2201/10477 ,  H05K2201/10575 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A printed board assembly includes a printed board, an electrical component, a first interconnect that electrically connects the component to the printed board, and a second interconnect that electrically connects the first interconnect to the printed board. In some examples, the second interconnect extends between the first interconnect and the same electrical contact on the printed board to which the first interconnect is electrically connected. The first and second interconnects provide an at least partially redundant electrical pathway between the component and the printed board.

Abstract translation: 印刷电路板组件包括印刷电路板，电气部件，将组件电连接到印刷电路板的第一互连以及将第一互连电连接到印刷电路板的第二互连。 在一些示例中，第二互连在第一互连和第一互连电连接到的印刷电路板上的相同电触点之间延伸。 第一和第二互连件在部件和印刷电路板之间提供至少部分冗余的电路径。

公开(公告)号：US07868339B2

公开(公告)日：2011-01-11

申请号：US11985946

申请日：2007-11-19

Applicant: Harald Stoyan ,  Markus Hofmann ,  Alexander Wilm ,  Michael Sailer ,  Rainer Huber ,  Monika Rose

Inventor： Harald Stoyan ,  Markus Hofmann ,  Alexander Wilm ,  Michael Sailer ,  Rainer Huber ,  Monika Rose

IPC: H01L33/00

CPC classification number: H05K3/305 ,  F21V19/0035 ,  F21V19/004 ,  F21V19/0055 ,  F21Y2115/10 ,  H05K3/303 ,  H05K3/325 ,  H05K2201/10106 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10575 ,  H05K2201/10598 ,  H05K2201/2036 ,  Y02P70/613

Abstract: An illumination device comprising a connection carrier (1), at least one light-emitting diode (10), an electrically insulating layer (3) and a fixing device (4) is specified. The connection carrier (1) has a first main area (1a) and a second main area (1b) remote from the first main area. The light-emitting diode (10) is fixed on the first main area (1a) of the connection carrier (1). The electrically insulating layer (3) is fitted to the second main area (1b) of the connection carrier (1) and projects laterally beyond the second main area (1b) of the connection carrier (1). The fixing device (4) is suitable for fixing the illumination device to a mounting area (2a) of a carrier (2), wherein the electrically insulating layer (3) is arranged between the second main area (1b) of the connection carrier (1) and the mounting area (2a) of the carrier (2). Furthermore, the fixing device (4) presses the connection carrier (1) against the mounting area (2a). The pressure exerted in this way is used to effect a fixing of the insulating layer (3) between the second main area (1b) of the connection carrier (1) and the mounting area (2a). The fixing device (4) is connected to an optical element (8), which optically influences the light generated by the light-emitting diode (10) during operation.

Abstract translation: 规定了包括连接载体（1），至少一个发光二极管（10），电绝缘层（3）和固定装置（4）的照明装置。 连接托架（1）具有远离第一主区域的第一主区域（1a）和第二主区域（1b）。 发光二极管（10）固定在连接载体（1）的第一主区域（1a）上。 电绝缘层（3）装配到连接载体（1）的第二主区域（1b），并横向延伸超过连接载体（1）的第二主区域（1b）。 固定装置（4）适于将照明装置固定到载体（2）的安装区域（2a）上，其中电绝缘层（3）布置在连接载体的第二主区域（1b） 1）和载体（2）的安装区域（2a）。 此外，固定装置（4）将连接托架（1）压靠在安装区域（2a）上。 以这种方式施加的压力用于实现绝缘层（3）在连接载体（1）的第二主区域（1b）和安装区域（2a）之间的固定。 固定装置（4）连接到光学元件（8），其在操作期间光学地影响由发光二极管（10）产生的光。

公开(公告)号：US20090102048A1

公开(公告)日：2009-04-23

申请号：US12256153

申请日：2008-10-22

Applicant: Eiji Hori

Inventor： Eiji Hori

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H05K3/321 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/10175 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/16111 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81897 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/3841 ,  H05K2201/09472 ,  H05K2201/10575 ,  H05K2201/10674 ,  H01L2924/00014

Abstract: Electronic device has substrate having at least one pad, electronic component having bump connected with pad of substrate electrically and mounting on substrate by flip chip bonding, conductive resin electrically connecting pad with bump, and insulation sheet disposed between substrate and electronic component. Substrate has recess on surface opposite to electronic component. Pad is formed on recess bottom. Conductive resin is provided on pad and in recess. Sheet has through hole corresponding to each bump. Opening area of through hole is smaller than that of recess. Bump is inserted into through hole, in contact with inner wall of through hole, electrically connected with pad via conductive resin, without direct contact with pad.

Abstract translation: 电子器件具有至少一个焊盘的电子部件，电子部件具有电连接的衬底的焊盘，并通过倒装焊接安装在衬底上，导电树脂电连接焊盘与凸起，以及设置在衬底和电子部件之间的绝缘片。 基板在与电子元件相对的表面上具有凹槽。 垫在凹槽底部形成。 导电树脂设置在垫和凹槽中。 板具有对应于每个凸块的通孔。 通孔的开口面积小于凹槽的开口面积。 凸块插入通孔，与通孔的内壁接触，通过导电树脂与焊盘电连接，不与焊盘直接接触。

公开(公告)号：US20080257585A1

公开(公告)日：2008-10-23

申请号：US11795276

申请日：2006-01-16

Applicant: Robert Morse

Inventor： Robert Morse

IPC: H05K1/00 ,  H05K1/03

CPC classification number: C25D11/04 ,  C25D11/026 ,  H01L2924/0002 ,  H05K1/053 ,  H05K1/095 ,  H05K3/06 ,  H05K3/108 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4664 ,  H05K3/4685 ,  H05K2201/017 ,  H05K2201/10166 ,  H05K2201/10575 ,  H05K2203/0315 ,  H05K2203/095 ,  H05K2203/121 ,  H01L2924/00

Abstract: An electrical power substrate comprises a metallic body at least one surface of the body having a coating generated by plasma electrolytic oxidation (PEO). The coating includes a dense hard layer adjacent the said surface of the metallic body, and a porous outer layer. Electrically conductive elements are attached to the said coating.

Abstract translation: 电力基板包括金属体，主体的至少一个表面具有由等离子体电解氧化（PEO）产生的涂层。 涂层包括邻近金属体的所述表面的致密硬质层和多孔外层。 导电元件附着在所述涂层上。

公开(公告)号：US20080003892A1

公开(公告)日：2008-01-03

申请号：US11818639

申请日：2007-06-15

Applicant: Reinhard Fassel ,  Thomas Goettel ,  Harald Hejna

Inventor： Reinhard Fassel ,  Thomas Goettel ,  Harald Hejna

IPC: H01R13/42

CPC classification number: H05K3/306 ,  H01R12/58 ,  H05K2201/10189 ,  H05K2201/10575 ,  H05K2201/1059

Abstract: A printed circuit board having a plurality of press-fit sockets for accommodating press-fit pins, which are insertable from the direction of a broadside of the printed circuit board with press-fit into through holes of the press-fit sockets. The method includes applying, on a section of the broadside of the printed circuit board, of an insulating protective layer, which has passage holes for the press-fit pins situated above the through holes of the press-fit sockets.

Abstract translation: 一种印刷电路板，具有用于容纳压配合销的多个压配合插座，其可以从压配合的印刷电路板的宽边方向插入到压入插座的通孔中。 该方法包括在印刷电路板的宽侧的一部分上施加绝缘保护层，绝缘保护层具有位于压配合插座的通孔上方的压配合销的通孔。

公开(公告)号：US20050274787A1

公开(公告)日：2005-12-15

申请号：US10865103

申请日：2004-06-10

Applicant: Walter Parsadayan ,  Hagop Sakadjian

Inventor： Walter Parsadayan ,  Hagop Sakadjian

IPC: B42D15/00 ,  G06F17/00 ,  G06K19/00 ,  G09B19/00 ,  G09B29/00 ,  G09F7/00 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02 ,  H05K7/00

CPC classification number: G06K19/0775 ,  H05K1/0266 ,  H05K1/18 ,  H05K2201/055 ,  H05K2201/09936 ,  H05K2201/10575

Abstract: Information regarding electrical components and their use is provided with a foldable information sheet having instructions thereon. The sheet has apertures which fit over the electrical components and information is printed on the sheet in proximity to the electrical component or components to which it applies. A portion of the information sheet may be adhered to a planar surface on which the components are mounted and non-adhered portions of the information sheet may be folded over the components.

Abstract translation: 关于电气部件及其使用的信息被提供有具有指令的可折叠信息表。 纸张具有适合于电气部件的孔，并且信息被印刷在靠近其所应用的电气部件或组件的片材上。 信息表的一部分可以附着在其上安装有部件的平面上，并且信息表的非粘附部分可以在部件上折叠。