公开(公告)号：WO2009094005A1

公开(公告)日：2009-07-30

申请号：PCT/US2008/011391

申请日：2008-10-02

Applicant: CONESYS, INC. ,  LANE, Bruce, Ray

Inventor： LANE, Bruce, Ray

IPC: H05K3/02

CPC classification number: H05K1/184 ,  H05K3/34 ,  H05K3/42 ,  H05K2201/09645 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10643

Abstract: A circuit board configuration and method of packaging an electronic component embedded into the circuit board in a manner that supports the electronic component thermally, electrically, and mechanically thereof, comprising a circuit board having a first surface and a circuit trace on the first surface; a recess or slot formed on the first surface defined by at least one sidewall that is oblique to the first surface of the circuit board; two or more plated surfaces on the at least one oblique sidewall and electrically connected to the circuit trace; and an electronic component having two or more electrical contact surfaces mounted to the two or more plated surfaces such that the electronic component is physically mounted to the oblique sidewall and in electrical communication with the circuit trace.

Abstract translation: 一种电路板结构和方法，其以以热，电和机械方式支撑所述电子部件的方式包装嵌入所述电路板的电子部件，所述电子部件包括在所述第一表面上具有第一表面和电路迹线的电路板; 在由所述电路板的第一表面倾斜的至少一个侧壁限定的所述第一表面上形成的凹部或槽; 在所述至少一个倾斜侧壁上的两个或更多个电镀表面并电连接到所述电路迹线; 以及电子部件，其具有安装到所述两个或更多个电镀表面的两个或更多个电接触表面，使得所述电子部件物理地安装到所述倾斜侧壁并与所述电路迹线电连通。

公开(公告)号：WO2009034008A2

公开(公告)日：2009-03-19

申请号：PCT/EP2008/061690

申请日：2008-09-04

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  WEIDNER, Karl ,  KASPAR, Michael

Inventor： WEIDNER, Karl ,  KASPAR, Michael

IPC: H01L33/44 ,  H01L33/62

CPC classification number: H05K3/326 ,  H01L23/3677 ,  H01L23/5389 ,  H01L23/60 ,  H01L24/24 ,  H01L24/25 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/72 ,  H01L24/82 ,  H01L24/86 ,  H01L24/90 ,  H01L24/97 ,  H01L25/072 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/82007 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/12041 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/19043 ,  H05K1/184 ,  H05K1/189 ,  H05K3/4084 ,  H05K2201/0397 ,  H05K2201/10643 ,  H05K2203/1469 ,  H01L2224/82

Abstract: Die vorliegende Erfindung betrifft ein Verfahren zur Serienherstellung einer Vielzahl von ankontaktierten elektronischen Bauelementen (7) insbesondere von Modulen und/oder Leistungsmodulen und/oder Leuchtdioden und/oder allgemein elektronisehen Leistungsbauelementen. Es ist Aufgabe ein kostengünstiges und einfaches Verfahren zur Serienherstellung von ankontaktierten elektronischen Bauelementen (7) in großer Stückzahl bereitzustellen. Die vorliegende Erfindung zeichnet sich dadurch aus, dass ein mit Bauelementen (7) bestücktes erstes Band und ein freiliegende Metallleiter (15) aufweisendes zweites Band derart überlagert werden, dass in dem beanspruchten Bandverfahren ein mechanisches und/oder elektrisches Ankontaktieren der jeweiligen Metallleiter (15) an die jeweilige Kontaktfläche (9) des jeweiligen elektronischen Bauelements (7) ausführbar ist. Beide Bänder können in Form von Rollen erzeugt sein. Die elektronischen Bauelemente (7) können nach dem Ankontaktieren vereinzelt oder ebenso als Einzelrolle geschaffen werden. Auf diese Weise ist ein besonders wirksames Herstellungsverfahren bereitstellbar. Das Verfahren eignet sich insbesondere für elektronische Leistungsbauelemente, die zusätzlich auf einfache Weise wärmeableitende Schichten (19) aufweisen können.

Abstract translation: 本发明涉及一种用于连续生产ankontaktierten电子部件（7）的处理，特别是模块和/或功率模块和/或发光二极管和/或通常elektronisehen功率组件。 它是大批量生产ankontaktierten电子元件（7）提供大量廉价且简单的方法的目的。 本发明的特征在于：一个与（7）放养第一频带和呈现第二频带中的暴露的金属导体（15）分量被叠加，使得在所要求保护的带处理中的各个金属导体的机械和/或电Ankontaktieren（15） 是在各电子部件（7）的相应的接触面（9）的可执行文件。 两个频段可以在卷的形式来制造。 电子部件（7）可以在Ankontaktieren后分离或者作为一个单一的辊子设置。 以这种方式，可以提供一种特别有效的制造工艺。 该方法特别适合于电子功率器件，其可以具有，除了容易散热层（19）。

公开(公告)号：WO01045172A1

公开(公告)日：2001-06-21

申请号：PCT/FR2000/003486

申请日：2000-12-12

IPC: H05K3/28 ,  H01L21/98 ,  H01L23/522 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/04 ,  H05K3/40 ,  H05K3/46 ,  H01L25/065

CPC classification number: H01L25/50 ,  H01L23/5222 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/184 ,  H05K1/185 ,  H05K3/045 ,  H05K3/403 ,  H05K2201/0715 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10643 ,  Y10T29/49146 ,  Y10T29/49165 ,  H01L2924/00

Abstract: The invention relates to a method and a device for interconnecting electronic components in three dimensions. In order to reduce the stray capacities between the connections and the shielding (304) of the device, metallized (42) grooves (40, 41) are cut into the block (3') of stacked circuits, the conductors (21) of said circuit being set back from the corresponding face (302) of the block. Said grooves cut into the connection conductors (21). The assembly is then coated with resin (303) and shielded by metallization (304). The invention is especially suitable for producing more compact three-dimensional electronic systems.

Abstract translation: 本发明涉及一种用于在三维中互连电子部件的方法和装置。 为了减小连接和装置的屏蔽（304）之间的杂散容量，将金属化的（42）槽（40,41）切割成堆叠电路的块（3'），所述的导体（21） 电路从块的相应面（302）回放。 所述槽切入连接导体（21）。 然后将该组件涂覆有树脂（303）并通过金属化（304）屏蔽。 本发明特别适用于生产更紧凑的三维电子系统。

公开(公告)号：WO99021238A1

公开(公告)日：1999-04-29

申请号：PCT/US1998/021781

申请日：1998-10-15

IPC: H01M2/10 ,  H01M2/20 ,  H01M6/42 ,  H02J7/00 ,  H04B1/38 ,  H05K3/32

CPC classification number: H01M2/1066 ,  H01M2/1044 ,  H01M2/204 ,  H01M6/42 ,  H02J7/0024 ,  H04B1/3883 ,  H05K3/321 ,  H05K2201/10037 ,  H05K2201/10515 ,  H05K2201/10643 ,  Y10T29/49108 ,  Y10T29/49114

Abstract: Thin profile battery circuits and constructions, and in particular button-type battery circuits and constructions and methods of forming the same are described. In one implementation, a substrate (16) is provided having an outer surface with a pair of spaced electrical contact pads (20, 22) thereon. At least two thin-profile batteries (24, 26) are conductively bonded (36) together in a stack having a lowermost battery and an uppermost battery. The batteries include respective positive and negative terminals. The lowermost battery has one of its positive or negative terminals adhesively bonded to one of the pair of electrical contact pads while the uppermost battery has one of its positive or negative terminals electrically connected to the other of the pair of electrical contact pads. The batteries can be provided into parallel or series electrical connections.

Abstract translation: 描述了薄型电池电路和结构，特别是钮扣式电池电路及其构造及其形成方法。 在一个实施方案中，提供了具有外表面的衬底（16），其上具有一对间隔开的电接触焊盘（20,22）。 至少两个薄型电池（24,26）在具有最低电池和最上面的电池的堆叠中导电地结合（36）在一起。 电池包括相应的正极和负极。 最下面的电池具有一个正极或负极端子，其粘合地粘合到一对电接触焊盘中的一个，而最上面的电池具有与该对电接触焊盘中的另一个电连接的正或负端子中的一个。 电池可以并联或串联电连接。

公开(公告)号：WO1994001876A1

公开(公告)日：1994-01-20

申请号：PCT/US1993006480

申请日：1993-07-08

Applicant: RAYCHEM CORPORATION

Inventor： RAYCHEM CORPORATION ,  GRAVES, Gregory, A. ,  ZHANG, Michael ,  CHANDLER, Daniel ,  CHANG, Chi-Ming ,  FANG, Shou-Mean

IPC: H01C01/14

CPC classification number: H01C7/005 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H05K1/184 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613

Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising: (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals.

Abstract translation: 一种电气装置，包括第一和第二层状电极和夹在它们之间的层状PTC电阻元件，该装置包括：（a）主要部分，其包括第一电极的主要部分，第二电极的主要部分和 电阻元件的主要部分; 和（b）第一连接腿，其远离主要部分延伸并且包括与第一电极的主要部分成一体的第一电极的第一腿部和电阻元件的第一腿部， 与电阻元件的主要部分。 这样的装置可以以各种方式固定到电路板，并且可弹性变形的端子。

公开(公告)号：JP5663433B2

公开(公告)日：2015-02-04

申请号：JP2011174596

申请日：2011-08-10

Applicant: タイコ・エレクトロニクス・コーポレイションTyco Electronics Corporation ,  タイコ・エレクトロニクス・コーポレイションTyco Electronics Corporation

Inventor： ダニエル・エイ・チャンドラー ,  マシュー・ピー・ガラ

IPC: H01C7/02 ,  H01C1/14 ,  H01C1/144 ,  H01M2/10 ,  H05K3/32

CPC classification number: H01C1/1406 ,  H01C1/144 ,  H01C7/02 ,  H05K3/328 ,  H05K2201/10492 ,  H05K2201/10643

公开(公告)号：JP5395360B2

公开(公告)日：2014-01-22

申请号：JP2008042621

申请日：2008-02-25

Applicant: 新光電気工業株式会社

Inventor： 修 井上

IPC: H05K3/46 ,  B23K26/00 ,  B23K26/382 ,  B23K26/40 ,  B23K101/42 ,  H05K3/00

CPC classification number: H01L23/5389 ,  H01L23/49822 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92144 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/0035 ,  H05K3/06 ,  H05K3/061 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2201/10674 ,  H05K2203/1152 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599

Abstract: In a method of manufacturing an electronic component built-in substrate of the present invention, a mounted body including a first insulating layer, a stopper metal layer formed under the first insulating layer of a portion corresponding to a component mounting region and a second insulating layer formed on a lower surface of the first insulating layer and covering the stopper metal layer is prepared, and a concave portion is obtained by penetration-processing a portion of the first insulating layer, which corresponds to the component mounting region to form an opening portion, while using the stopper metal layer as a stopper. Also, the stopper metal layer in the concave portion is removed, then an electronic component is mounted on the concave portion, and then a third insulating layer is formed on the electronic component.

公开(公告)号：JP2007227913A

公开(公告)日：2007-09-06

申请号：JP2007033620

申请日：2007-02-14

Applicant: Samsung Electro Mech Co Ltd ,  三星電機株式会社

Inventor： LIM SEONG-TAEK ,  CHUNG YUL KYO

IPC: H01L23/12 ,  H01G4/40

CPC classification number: H05K1/0231 ,  H01L2924/15311 ,  H05K1/162 ,  H05K1/185 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2201/10734 ,  Y02P70/611

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer substrate having decoupling function exerting an excellent decoupling function at low frequency and high frequency bands. SOLUTION: The invention comprises a substrate body 100 mounting an IC component 200 connected with power/ground terminal portions on the upper surface of a multilayer substrate, a power line portion L10 formed on a power dielectric layer and connected with power terminal portions T10, T11, and T12 and the IC component 200, a ground line portion L20 formed on a ground dielectric layer and connected with the ground terminal portion and the IC component 200, a multilayer type chip capacitor mounted on the upper surface of the substrate body 100 and connected between the power terminal portions T10, T11, and T12 on the upper surface of the substrate body 100 and the ground terminal portions T20, T21, and T22, and a thin film capacitor built in the interior of the substrate body 100 and connected between the power line portion L10 and the ground line portion L20. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供具有在低频和高频带上具有优异的去耦功能的去耦功能的多层基板。 解决方案：本发明包括：在多层基板的上表面上安装与电源/接地端子部分连接的IC部件200的基板本体100，形成在电力电介质层上并与电力端子部分连接的电力线部分L10 T10，T11和T12以及IC元件200，形成在接地电介质层上并与接地端子部分和IC元件200连接的接地线部分L20，安装在基板主体的上表面上的多层型芯片电容器 100并且连接在基板主体100的上表面上的电源端子部分T10，T11和T12以及接地端子部分T20，T21和T22之间，以及内置在基板主体100内部的薄膜电容器， 连接在电力线部分L10和接地线部分L20之间。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2004241924A

公开(公告)日：2004-08-26

申请号：JP2003027498

申请日：2003-02-04

Applicant: Sumitomo Electric Ind Ltd ,  住友電気工業株式会社

Inventor： KATSUYAMA TOMOKAZU

IPC: H01P1/00 ,  H01L23/66 ,  H01P1/04 ,  H01P1/20 ,  H01P3/08 ,  H01P5/02 ,  H03H7/38 ,  H05K1/02

CPC classification number: H01P1/047 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6627 ,  H01L2223/665 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1903 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01P1/2007 ,  H05K1/0219 ,  H05K1/0231 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To reduce the deterioration, loss, and reflection of a high-frequency signal in an AC coupling circuit. SOLUTION: An AC coupling circuit for coupling a circuit element joined with one signal line 41a with a circuit element joined with the other signal line 41b by AC coupling is equipped with a die cap 44 which has one terminal connected by being mounted on the signal line 41a and also has the other terminal connected to the signal line 41b by a wire 45 and a chip capacitor 43 which is connected between the signal line 41a and the other terminal. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP3460652B2

公开(公告)日：2003-10-27

申请号：JP35538899

申请日：1999-12-15

Applicant: 日本電気株式会社

Inventor： 秀樹 関

IPC: H01G4/252 ,  H01C1/148 ,  H01G2/24 ,  H01G9/00 ,  H01G9/004 ,  H01G9/008 ,  H01G9/012 ,  H01G9/15 ,  H01L23/485 ,  H05K3/34

CPC classification number: H01G9/012 ,  H01C1/148 ,  H01G9/15 ,  H01L24/02 ,  H01L33/20 ,  H01L33/38 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/3442 ,  H05K2201/10643 ,  H05K2203/168 ,  Y02P70/613 ,  H01L2924/00