公开(公告)号：WO2005064228A2

公开(公告)日：2005-07-14

申请号：PCT/IB2004004120

申请日：2004-12-15

Applicant: MATSUSHITA ELECTRIC WORKS LTD ,  KAMBARA YASUSHI ,  MOTOYAMA AKIRA ,  NAKAJIMA MASAYUKI

Inventor： KAMBARA YASUSHI ,  MOTOYAMA AKIRA ,  NAKAJIMA MASAYUKI

IPC: F21V29/00 ,  F21V23/00 ,  F21Y103/00 ,  H01G2/06 ,  H01G4/18 ,  H01G4/228 ,  H05B41/282 ,  H05K1/18 ,  H05K3/34 ,  F21V

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/18 ,  H05B41/2827 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/062 ,  H05K2201/10909 ,  H05K2203/304

Abstract: A lighting device for a lamp device is provided. The lighting device includes a circuit board and film capacitors packaged on the circuit board by using leadless flow solders. Each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless. A diameter of the lead wires is 0.6~ (mm) or less, a cross-sectional area is 35mm or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130°C or less.

Abstract translation: 提供了一种用于灯装置的照明装置。 照明装置包括通过使用无铅流动焊料封装在电路板上的电路板和薄膜电容器。 每个薄膜电容器包括聚丙烯薄膜和导线，并且导线的材料的导热率低于铜的热导率，薄膜电容器的端子和内部材料是无引线的。 导线的直径为0.6〜（mm）以下，截面积为35mm 2以下，焊接工序中的薄膜电容器的引线端部的温度为130° C以下。

公开(公告)号：WO2002076166A1

公开(公告)日：2002-09-26

申请号：PCT/US2002/007904

申请日：2002-03-14

Applicant: AAVID THERMALLOY, LLC

Inventor： FISHER, Francis, Edward ,  BOWLES, Russell

IPC: H05K7/20

CPC classification number: H05K3/341 ,  H01L23/3672 ,  H01L23/40 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K3/3421 ,  H05K2201/066 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2201/2081 ,  H05K2203/0315 ,  Y02P70/613 ,  H01L2924/00

Abstract: A composite heat sink device (1) includes a heat sink body (2, 3) formed of aluminum, the body (2, 3) having a pair of coplanar surfaces (4), and a thermally conductive solderable element (5), for example of copper, mechanically fixed to each of the coplanar surfaces (4). Each of the solderable elements has a first surface which is contiguous with one of the coplanar surfaces, and a second surface which is soldered to a printed circuit board.

Abstract translation: 复合散热装置（1）包括由铝形成的散热体（2,3），所述主体（2,3）具有一对共面（4）和导热可焊接元件（5），用于 机械地固定在每个共面表面（4）上的铜的例子。 每个可焊接元件具有与一个共面表面邻接的第一表面和焊接到印刷电路板的第二表面。

公开(公告)号：WO00033096A1

公开(公告)日：2000-06-08

申请号：PCT/US1999/028746

申请日：1999-12-02

IPC: G01R31/26 ,  B23K20/00 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R33/76 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  G01R31/316

CPC classification number: B23K20/004 ,  B23K2201/40 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H01L2924/00

Abstract: A probe card is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer with resilient contact elements, such as springs. A probe card is designed to have terminals to mate with the contact elements on the wafer. In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer is prepared with contact posts on one side and terminals on the opposing side. An interposer with spring contacts connects a contact on the opposing side of the space transformer to a corresponding terminal on a probe card, which terminal is in turn connected to a terminal which is connectable to a test device such as a conventional tester.

Abstract translation: 提供了用于使电子部件与凸起的接触元件接触的探针卡。 特别地，本发明对于使半导体晶片与诸如弹簧的弹性接触元件接触是有用的。 探针卡被设计成具有与晶片上的接触元件配合的端子。 在优选实施例中，终端是帖子。 在优选实施例中，端子包括适于重复接触的接触材料。 在一个特别优选的实施例中，空间变压器被制备成具有一侧的接触柱和相对侧上的端子。 具有弹簧触点的插入件将空间变压器的相对侧上的触点连接到探针卡上的对应端子，该端子又连接到可连接到诸如常规测试器的测试装置的端子。

公开(公告)号：WO99030866A1

公开(公告)日：1999-06-24

申请号：PCT/JP1998/005565

申请日：1998-12-09

IPC: B23K1/00 ,  B23K35/00 ,  B23K35/26 ,  C22C13/02 ,  H01L23/50 ,  H05K3/34

CPC classification number: H05K1/181 ,  B23K1/0016 ,  B23K35/004 ,  B23K35/007 ,  B23K35/262 ,  B23K2201/40 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/532 ,  H01L24/29 ,  H01L2224/83101 ,  H01L2924/01322 ,  H01L2924/15747 ,  H05K3/3426 ,  H05K3/3463 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00

Abstract: A Pb-free solder-connected structure having a sufficiently large connection strength, featuring an interface that remains stable even after the passage of time, and maintaining sufficient wettability and resistance against whiskers, and an electronic device. Specifically, a Pb-free solder, characterized in that an Sn-Ag-Bi solder which is a representative Pb-free solder is connected to an electrode that has an Sn-Bi layer formed on the surface thereof. Bi concentration in the Sb-Bi layer is preferably 1 to 20 % by weight to obtain a sufficient degree of wettability. When a more reliable joint is required, the Cu layer is formed under the Sn-Bi layer to obtain a connection portion having a sufficiently large interfacial strength.

Abstract translation: 一种具有足够大的连接强度的无铅焊料连接结构，其特征在于即使在经过时间后也保持稳定的界面，并且保持足够的润湿性和对晶须的抵抗性以及电子设备。 具体地说，一种无铅焊料，其特征在于，作为代表性的无铅焊料的Sn-Ag-Bi焊料与在其表面形成有Sn-Bi层的电极连接。 Sb-Bi层中的Bi浓度优选为1〜20重量％，以获得足够的润湿性。 当需要更可靠的接头时，Cu层形成在Sn-Bi层下面，以获得具有足够大的界面强度的连接部分。

公开(公告)号：WO1997046350A1

公开(公告)日：1997-12-11

申请号：PCT/JP1997001969

申请日：1997-06-06

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  SAKAI, Yoshinori ,  SUETSUGU, Kenichiro ,  YAMAGUCHI, Atsushi

Inventor： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

IPC: B23K35/26

CPC classification number: B23K35/262 ,  B23K2101/36 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/10909

Abstract: A solder for electronic part bonding electrodes, not containing lead and having a fine structure and excellent heat resisting fatigue characteristics is provided. A solder for electronic part bonding electrodes, the main constituent components of which are Sn, Ag and Cu, characterized in that the weight ratio of these components is 92-97 wt.% of Sn, 3.0-6.0 wt.% of Ag and 0.1-2.0 wt.% of Cu. A small amount of Ag is added to solder which contains Sn as a main component, whereby an alloy having a fine alloy structure, capable of minimizing structure variation and having excellent heat resisting fatigue characteristics can be obtained. When a small amount of Cu is added, an intermetallic compound is formed, and the bond strength of the alloy is improved.

Abstract translation: 提供了不含铅并且具有优良结构和优异的耐热疲劳特性的电子部件接合电极用焊料。 一种用于电子部件接合电极的焊料，其主要组成成分是Sn，Ag和Cu，其特征在于这些组分的重量比为Sn的92-97重量％，Ag的3.0-6.0重量％和0.1 -2.0重量％的Cu。 将少量的Ag添加到含有Sn作为主要成分的焊料中，从而可以获得能够最小化结构变化并且具有优异的耐热疲劳特性的具有精细合金结构的合金。 当添加少量Cu时，形成金属间化合物，并且提高合金的结合强度。

公开(公告)号：WO1990008616A1

公开(公告)日：1990-08-09

申请号：PCT/US1990000097

申请日：1990-01-09

Applicant: MOTOROLA, INC.

Inventor： MOTOROLA, INC. ,  CHASON, Marc, Kenneth ,  ONYSTOK, Michael, John ,  BELLIN, Nathan, Paul

IPC: B23K01/20

CPC classification number: H05K3/3426 ,  B23K1/20 ,  H01L2924/00013 ,  H05K3/3494 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  H05K2203/107 ,  Y02P70/613 ,  H01L2224/29099

Abstract: An electrical joint using spheroidal tipped leads (42) improves the strength of a connection regardless of the material used to bond the connections. Axial leads of a component are formed into spheroids using an appropriate heat source to melt a small portion of the lead tip. Melting a portion of the lead alloys the lead with any non-wettable solder mask rendering a wettable spheroid. Surface tension in the molten metal forms the spheroid. The spheroid increases the area to which solder (40) or other bonding agent adheres to solder mask remaining on the lead decrease solder wicking further up the lead. Reduced solder wicking retains the compliance of the lead. Controlled melting of the lead maintains planarity for multileaded components.

公开(公告)号：WO8809599A3

公开(公告)日：1988-12-29

申请号：PCT/US8801668

申请日：1988-05-16

Applicant: CRAY RESEARCH INC

Inventor： CRAY SEYMOUR R ,  KRAJEWSKY NICHOLAS J

IPC: H01L21/48 ,  H01L21/60 ,  H01L21/607 ,  H01L23/50 ,  H01R12/52 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36 ,  H01R9/09

CPC classification number: H01L24/11 ,  H01L21/4853 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/78301 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/14 ,  H01R12/523 ,  H05K3/308 ,  H05K3/328 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  Y10T29/49135 ,  Y10T29/4914 ,  Y10T29/49153 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/48

Abstract: A method and apparatus for interconnecting electronic circuits (104) using nearly pure soft annealed gold mechanically compressed within through-plated holes (111). The invention has its application in attaching integrated circuit dice (104) directly to circuit boards (110) by ball bonding gold wires (101) to the bonding pads (105) of the integrated circuit dice (104) in a substantially perpendicular relationship to the surfaces of the dice (104) and inserting the gold leads (101) into through-plated holes (111) of circuit boards (110) which provide an electrical and a mechanical connection once the leads (101) are compressed within the through-plated holes (111). The present invention also finds its application in the interconnection of sandwiched circuit board assemblies (200) where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards (212, 214, 216, 217, 219, 221) and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards (212, 214, 216, 217, 219, 221).

Abstract translation: 一种使用几乎纯粹的软退火金在互穿电镀孔内机械压缩的互连电子电路的方法和装置。 本发明的应用是将集成电路小片直接连接到电路板，方法是将金线球焊到集成电路小片的焊盘上，使其与小片表面基本垂直，并将金导线插入到 一旦引线在贯通的镀孔内被压缩，电路板提供电连接和机械连接。 本发明还发现其应用于夹层电路板组件的互连，其中软金引线被插入电路板的轴向对齐的通孔电镀孔中并且被压缩，使得保持引线在通孔电镀孔内压缩和弯曲 ，在电路板之间形成电连接。

公开(公告)号：WO2013164230A1

公开(公告)日：2013-11-07

申请号：PCT/EP2013/058470

申请日：2013-04-24

Applicant: ROBERT BOSCH GMBH

Inventor： GUYENOT, Michael ,  RATCHEV, Roumen ,  FIX, Andreas

IPC: H05K3/32 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/321 ,  H05K3/3447 ,  H05K2201/10909

Abstract: Die Erfindung bezieht sich auf ein Verfahren zur Herstellung einer elektrischen Durchkontaktierung zwischen einem oder mehreren elektrischen oder elektronischen Bauelementen (10) und einer Leiterplatte (16). Zunächst erfolgt ein teil- oder vollflächiges Aufbringen einer leitfähigen Polymerschicht (42) auf Lötspitzen (46) von Anschlussdrähten (12). Mindestens ein elektrisches oder elektronisches Bauelement wird mit der Leiterplatte (16) im THT-Verfahren gefügt. Es wird mindestens eine Lötverbindung zwischen der Leiterplatte (16) und Anschlussdrähten (12) des mindestens einen elektrischen oder elektronischen Bauelementes (10) durch Selektivlötung oder eine Lotwelle (28) erzeugt.

Abstract translation: 本发明涉及一种用于通过接触一个或多个电气或电子元件（10）和印刷电路板（16）之间产生电的方法。 首先，在引线的焊头（46）（12）的导电性高分子层（42）的局部或全区域的应用程序。 至少一个电气或电子组件被接合到在THT方法的电路板（16）。 它创建通过选择性焊接或焊波（28）的至少一个电气或电子元件（10）的电路板（16）和键合线（12）之间的至少一个焊接连接。

公开(公告)号：WO2012156021A1

公开(公告)日：2012-11-22

申请号：PCT/EP2012/001733

申请日：2012-04-21

Applicant: Enayati GmbH & Co. KG Oberflächen- und Anlagentechnik ,  DREIßIGACKER, Uwe

Inventor： DREIßIGACKER, Uwe

IPC: C25D3/60 ,  C25D5/08 ,  C25D7/00 ,  H05K3/30 ,  H01R12/58 ,  H01R4/58 ,  H01R13/03 ,  H01R13/17 ,  H01R12/70

CPC classification number: C25D3/60 ,  C25D5/08 ,  C25D7/00 ,  H01R12/585 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/1059 ,  H05K2201/10909

Abstract: Es wird ein Einpresspin (10) mit einem Grundkörper und einer den Grundkörper zumindest abschnittsweise bedeckenden Beschichtung beschrieben. Um einen Einpresspin mit einer bleifreien Beschichtung zur Verfügung zu stellen, welche ein Whiskerwachstum vermeidet oder weitgehend minimiert, besteht die Beschichtung zu 30 bis 72 Massenprozent aus Silber und/oder Kupfer und/oder Bismut (Legierungsmetalle), Rest Zinn und Verunreinigungen.

Abstract translation: 据描述的至少一个压入销（10）具有在覆盖涂层部的基体和基体上。 以提供压入销与无铅涂料，其避免晶须或基本上最小化，该涂层为30至72％的银和/或铜和/或铋（合金金属），其余为锡和杂质的质量。

公开(公告)号：WO2007081605A3

公开(公告)日：2008-10-30

申请号：PCT/US2006060880

申请日：2006-11-14

Applicant: NEW WAY TECHNOLOGIES & LICENSI ,  DEUTSCH JOEL ALLEN

Inventor： DEUTSCH JOEL ALLEN

IPC: H01L21/302 ,  B08B6/00 ,  H01B13/00

CPC classification number: H05K3/3426 ,  H05K3/26 ,  H05K3/3463 ,  H05K2201/10909 ,  Y02P70/613

Abstract: A method for removing an undesirable material from an electronic or electrical component and introducing a desirable material in place of the undesirable material. The method can include the replacement of a leaded material found on the component with a no-lead material to meet governmental directives including those of the European Union.

Abstract translation: 从电子或电气部件移除不需要的材料并引入所需材料代替不需要的材料的方法。 该方法可以包括使用无铅材料替代部件上发现的含铅材料，以符合包括欧盟在内的政府指令。