Abstract:
PROBLEM TO BE SOLVED: To provide a nanocomponent and a method for manufacturing a nanocomponent, a nanomachine or the like using the same. SOLUTION: The method for manufacturing a nanocomponent is carried out, in particular, by printing a grid on a substrate by photolithography or electron beam lithography, spraying a nanoplate aqueous solution to the grid portion to position a nanoplate, vapor depositing a protective film to a certain thickness on the substrate and on the upper part of the nanoplate placed on the substrate, etching the nanoplate with the vapor deposited protective film by focused ion beam or electron beam lithography, and removing a residual protective film by using a stripping agent for the protective film. The method for manufacturing a nanomachine or a nanostructure is carried out by moving and assembling the above nanocomponents with a nanoprobe. The invention provides a method for inexpensively and relatively easily manufacturing a nanocomponent of excellent quality and a method for realizing a nanomachine or the like by coupling the above nanocomponents and biomolecules or the like. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a measuring instrument for gas flow velocity distribution for visually displaying spatial distribution of a gas flow velocity. SOLUTION: The measuring instrument is so structured that a thin wire is arranged one-dimensionally or two-dimensionally by applying a principle of CTA(Constant Temperature Anemometer) and Pirani gauge for determining a flow velocity by quantity of an electric current flowing in order to maintain a metal thin wire at a constant temperature, then the flow velocity is measured by scanning vertically to a direction of the flow velocity and sensing an electric change of the thin wire on a scanned surface, the flow velocity is collected, and the flow velocity distribution is detected and is visualized. Therefore, quantitative distribution measurement of the gas flow velocity can be conducted and the instrument can be applied to a semiconductor manufacturing process requiring gas injection of equal distribution.
Abstract:
PROBLEM TO BE SOLVED: To make the thickness constant through a simple process and thereby ensure the uniform fine texture and the linearity by specifying the solid content to form a slurry consisting of very weakly flocculated ceramic particles and further, removing large-size particles and lumps through centrifugal sedimentation to perform the centrifugal molding and sintering of the slurry. SOLUTION: Ceramic powder is dispersed in a liquid solvent and salt is added to form a slurry consisting of very weakly flocculated ceramic particles with about 5-20 vol.% solid content. Next, the slurry is made to sediment centrifugally so that large-size particles and particle lumps or impurities are removed. Further, this slurry is entered in a cylindrical mold to be centrifugally molded and a tube is formed in the mold. After that, the liquid solvent collected in the center of the mold is unloaded. The centrifugal molding and a stage associated therewith are repeated until the tube of desired thickness is formed. Finally, the tube is sintered. Thus it is possible to manufacture the ceramic tube which has uniform thickness and fine texture with ensured linearity, even when a special device is not used.
Abstract:
PURPOSE: A high-sensitive measuring method, a device for the same, a self-assembly monolayer used for the same in a process forming the self-assembly monolayer on a golden thin film using an infrared rays spectral device are provided to easily grow a self-assembly monolayer by forming a golden thin film less than 2 nano meter in both sides of a silicon. CONSTITUTION: A high-sensitive measuring method in a process forming the self-assembly monolayer on a golden thin film using an infrared rays spectral device is as follows. A silicon substrate in which golden thin film is formed in both surfaces is immersed in solution where organic molecules is melted so that a self-assembly monolayer is formed. The substrate where a monolayer is formed is taken out and installed in chamber where an infrared rays spectral device. Infrared ray is incident to one side end part of the silicon substrate where the monolayer is formed so that lights are successively reflected to both sides of the golden thin film. Lights projected by being reflected are incident to a detecting device by converting a progressive direction so that a light detection is performed.
Abstract:
PURPOSE: A cross section wet etching apparatus and method for protecting a superconducting metal circuit surface during the manufacture of a MEMS device using wet etching are provided to prevent damage to a superconductive metal of a MEMS substrate when depositing SiN on the MEMS substrate and to prevent direct exposure of a superconductive metal circuit on the MEMS device to an etching liquid. CONSTITUTION: A cross section wet etching apparatus for protecting a superconducting metal circuit surface comprises an etching protection plate(100) which is deposited with SiN or Si3N4 films on both sides thereof, a MEMS substrate(200) which is attached to one side of the etching protection plate to manufacture a device with a superconductive metal circuit, a first jig(300) which is attached to the other side of the MEMS substrate, and a second jig(400) which is coupled with the first jig by a fastening unit(310).
Abstract translation:目的:提供一种用于在使用湿蚀刻制造MEMS器件期间保护超导金属电路表面的横截面湿法蚀刻装置和方法,以防止在MEMS衬底上沉积SiN时对MEMS衬底的超导金属的损坏,并防止 将超导金属电路直接暴露在MEMS器件上至蚀刻液体。 构成:用于保护超导金属电路表面的横截面湿式蚀刻装置包括:蚀刻保护板(100),其两侧沉积有SiN或Si 3 N 4膜; MEMS基板(200),其连接到 蚀刻保护板以制造具有超导金属电路的器件,附接到MEMS衬底的另一侧的第一夹具(300)和通过紧固单元与第一夹具联接的第二夹具(400) 310)。
Abstract:
A method for evaluating bond between materials through imaging of time-of-flight secondary ion mass spectrometry(TOF-SIMS) is provided to evaluate the bond between organic, inorganic or bio material with nanoparticle and perform quantitative and qualitative analysis. A method for evaluating bond between materials using time-of-flight secondary ion mass spectrometry(TOF-SIMS) comprises: a step of forming the pattern of nanoparticle which is bonded with bio, organic or inorganic material on a substrate; a step of measuring the ion detection pattern of bond between nanoparticle and bond material on the substrate using the TOF-SIMS; and a step of comparing detection pattern of bio, organic or inorganic material and nanoparticle and determining the bond between bio, organic or inorganic material with nanoparticle.
Abstract:
본 발명은 나노와이어의 물성측정장치에 관한 것이다. 본 발명의 나노와이어의 물성측정장치는 나노와이어(10)의 일측 단부가 그리핑(gripping)되는 금속판(20); 나노와이어(10)의 타측 단부를 그리핑(gripping)하는 팁(30); 금속판(20) 또는 팁(30)을 이송시켜 나노와이어(10)를 인장시키는 매니퓰레이터; 금속판(20)과 상기 팁(30)이 어느 하나의 저항과 대체되어 연결되는 휘스톤 브리지 회로(40); 나노와이어(10)에 부착되어 인장 변형률을 측정하는 변형률 측정 게이지; 및 상기 휘스톤 브리지 회로(40)와 연결되어 나노와이어(10)의 저항, 전압 또는 전류의 변화를 측정하는 멀티미터(50); 를 포함하여 이루어진다. 본 발명의 반도체 나노와이어의 물성측정장치는, 나노와이어의 시편제작이 용이하며, 역학적 물성과 전기적 물성의 측정이 용이하고, 나노와이어의 기계적 및 전기적 물성 측정의 신뢰도를 향상시킬 수 있는 장점이 있다. 또한, 측정시에 필요한 제한적 조건에서도 쉽고 간단하게 나노와이어에 대해서 역학적 및 전기적 물성의 측정이 가능한 장점이 있다. 아울러, 시편에 전극을 형성하지 않고 전기적 물성 측정이 가능하므로 측정시간을 단축할 수 있는 장점이 있다. 나노와이어, 물성측정장치, 전자빔, 휘스톤 브리지
Abstract:
A method for manufacturing a nano gap electrode and a nano gap device manufactured by using the same are provided to manufacture uniform and reproductive nano gap electrodes by controlling the density and the reactive time of a reaction material. A method for manufacturing a nano gap electrode is characterized by dipping a substrate(1) having metal patterns(2) into a solution containing metal ions. And a reduced metal is grown on a surface of the metal pattern by a reducing agent included in the solution.
Abstract:
A device and a method for automatically measuring AC-DC(Alternating Current-Direct Current) current transfer difference of a TCC(Thermal Current Converter) are provided to prevent the leaking current generated due to stray capacity from flowing and to minimize influence of a drift of a current generator by measuring the output of two TCCs at the same time. A device(100) for automatically measuring AC-DC current transfer difference of a TCC is composed of a current generating unit(120) generating forward and reverse DC and AC current and supplying the generated current to a standard TCC(20) and a TCC(30) to be measured; a scan unit(140) changing the polarities of each output of the TCCs receiving the forward and reverse DC and AC current; a first voltmeter(150a) measuring the output of the standard TCC induced through the scan unit; a second voltmeter(150b) measuring the output of the TCC to be measured, induced through the scan unit; and a calculating unit computing a relative value of AC-DC current transfer difference of the TCC to be measured for the AC-DC current transfer difference of the standard TCC on the basis of a value measured by the first and second voltmeters if the forward and reverse DC and AC current is supplied. The standard TCC and the TCC to be measured are connected in series.