Abstract:
According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; The length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.
Abstract:
A method for forming a uniform and dense carbon nanotube-dispersed film irrespective of the characteristics of the carbon nanotube-dispersed liquid and the type of substrate, and a method for manufacturing a semiconductor device having excellent electrical characteristics with less variation in characteristics are provided. The method for forming the carbon nanotube-dispersed film includes steps of coating a substrate (110) with a carbon nanotube-dispersed liquid containing carbon nanotubes (1101) dispersed in a solvent, cooling droplets (102) of the carbon nanotube-dispersed liquid to increase the viscosity of the solvent, evaporating the solvent to uniformly precipitate the carbon nanotubes (1101) and form a carbon nanotube coating film (1012), forming, on the carbon nanotube coating film (1012), a coating film of a carbon nanotube-dispersed liquid (1013) with higher carbon nanotube concentration, and evaporating the solvent from the coating film of carbon nanotube-dispersed liquid (1013) to form a film having dispersed carbon nanotubes (1022).
Abstract:
A via transmission line for a multilayer printed circuit board (PCB) in which a wave guiding channel is formed by a signal via or a number of signal vias, an assembly of ground vias surrounding the signal via or corresponding number of coupled signal vias, a set of ground plates from conductor layers of the multilayer PCB, and a clearance hole. In this via transmission line, the signal via, or the number of signal vias forms an inner conductive boundary, ground vias and ground plates from conductor layers of the multilayer PCB form an outer conductive boundary, and the clearance hole provides both isolation of the inner conductive boundary from the outer conductive boundary and high-performance broadband operation of the via transmission line by means of the predeterminded clearance hole cross-sectional shape and dimensions where the cross-sectional shape of the clearance hole is defined by the arrangement of ground vias in the outer conductive boundary and dimensions of the clearance hole are determined according to a method to minimize frequency-dependent return losses caused by specific corrugations of the outer conductive boundary formed by ground plates in the wave guiding channel of the via transmission line.
Abstract:
The present invention is related to the field of uncooled infrared (IR) or terahertz (THz) bolometers, and especially to low-cost bolometers and their fabrication processes. The device is composed of a photodefinable substrate which enables to suspend a bolometer structure on a diaphragm layer using wet etching technology with a good thermal isolation.
Abstract:
According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; The length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations.
Abstract:
PURPOSE:To obtain a transporting device for transporting crushed ice continuously to a fish tank by providing a crushed ice discharger having vanes rotatable in a horizontal plane to a storage tank. CONSTITUTION:A tank 30 for storing crushed ice temporarily is made cylindrical. Consequently, bridging phenomenon of crushed ice occurs scarcely on the bottom wall 46 of the storage tank. A discharger 45 is arranged at the bottom wall 46 side of the storage tank 30 in order to scrape crushed ice stored on the bottom wall 46 and feed positively to discharge ports 50, 51. Consequently, bridging phenomenon of crushed ice does not occur on the bottom wall 46 of the storage tank. Crushed ice fed to the discharge ports 50, 51 is further fed to crushed ice pressure feed pipes 64, 64 by means of rotary valves 52, 53 then carried to a specific fish tank by means of compressed air. Since bridging phenomenon does not occur on the bottom wall 46 of the storage tank, negative pressure is produced in the storage tank 30 when crushed ice is carried in thus moving the crushed ice smoothly from the storage tank 30 to the rotary valves 52, 53.