Abstract:
PROBLEM TO BE SOLVED: To provide a display device for stably manufacturing a display unit by non-destructively confirming a feed state of a conductive adhesive on the halfway of a manufacturing process, and also to provide its manufacturing method. SOLUTION: An opening 21K is provided at a part corresponding to the arrangement region of a common pad 12 provided on one face of a light transmission substrate 10 out of black masks 21 provided on one face of a light transmission substrate 20. When the substrates 10 and 20 are stuck to each other, the common pad 12 surface can be observed over the substrate 20 through the opening 21K provided on the black masks 21. Thus, the feed state of a common agent 30 fed on the common pad 12 can be visually non-destructively confirmed on the halfway of the manufacturing process of the liquid crystal display device. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To prevent the drying of nozzles and reduce discarded resist. SOLUTION: This resist coating equipment 10 is provided with the nozzles 11 which are arranged at a plurality of parts of one line in a process and used for switching, and a resist tank 12 for storing resist to be supplied to the nozzles 11. A slit-shaped output port is formed in the nozzle 11. In the middle of connection piping 13 which connects the resist tank 12 and the nozzle 11, an opening and closing valve 14 for opening and closing the piping 13 is arranged. In the piping 13, a switching valve 15 for supplying rinse to the nozzle 11 is arranged between the resist tank 12 and the valve 14. The switching valve 15 is formed so as to switch a state that the valve 14 is interconnected with the resist tank 12 and interconnection between the valve 14 and a rinse tank 17 is cut, and a state that the valve 14 is interconnected with the rinse tank 17 and interconnection between the valve 14 and the resist tank 12 is cut. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a carrier box which has a simple structure, is superior in the internal airtight holding ability, which can be enlarged and lightened and which can transport a carrier at low cost by holding a state of high cleanliness. SOLUTION: The carrier box is formed to hold an inner part of a box body 2 to an airtight state with high cleanliness in a closed state of a door 4. The carrier box is transported between a plurality of clean rooms, disposed across a general environment with low cleanliness level, in a state where the carrier is stored. A magnet packing 20, having a packing rubber part 21 sealing a part between the box body 2 and the door 4 and having elasticity and a rubber magnet 22, is fitted to the door 4. The rubber magnet 22 is embedded in the packing rubber part 21. An iron plate 27 is disposed at a position facing the rubber magnet 22 in the box body 2. The packing rubber part 21 and the rubber magnet 22 are arranged so that they are overlapped in a vertical direction, with respect to the door 4. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To improve discoloration of a reflection film consisting of silver or an alloy containing silver and to enhance display quality. SOLUTION: In a manufacturing method for a liquid crystal display element 1 having a liquid crystal layer 16 between a pair of substrates 2 and 3 disposed opposite to each other and the reflection film 9 consisting of silver or the alloy containing silver and formed on one of the pair of substrates 2 and 3, after the reflection film is formed, the reflection film 9 is subjected to heat treatment and/or liquid chemical treatment with alkaline liquid chemical prior to the next stage. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To pass a carrier storing an article to be conveyed which is conveyed by a conveying vehicle or the like between a plurality of clean rooms provided with a public environment between them between inside and outside of the clean room while keeping the environment of the carrier with simple constitution. SOLUTION: The carrier 17 storing an article to be conveyed is conveyed between the clean rooms 11 through the public environment 12 using a carrier conveying container 18 provided with a sealable door 21. A pass box 13 is arranged at the border between the clean room 11 and the public environment 12. The carrier conveying container 18 is conveyed from the public environment 12 side into the pass box 13, and the carrier conveying container 18 is given air blow. Then, a door 14a of the pass box 13 on the clean room 11 side is opened, the carrier conveying container 18 is conveyed into the clean room 11, and the carrier 17 is taken out of the carrier conveying container 18 or stored into the carrier conveying container 18 within the clean room 11.
Abstract:
PROBLEM TO BE SOLVED: To improve the yield of a product by preventing defects in gate breakdown strength in a bottom gate type TFT. SOLUTION: The manufacturing method of a bottom gate type TFT 100A includes a step (1) of forming a gate electrode on a substrate, a step (2) of forming a gate insulating film on the gate electrode 2, a step (3) of forming a laminate made up of an protective insulating film 8 having a film thickness of 100 nm or smaller while an active-layer antecedent film (polysilicon film 7) and the protective insulating film 8 are laminated on the gate insulating film, a step (4) of implanting a dopant in an LDD region or in a source/drain region of the active-layer precursor film 8 through the protective insulating film 8, a step (5) of activating the implanted dopant and causing the other non-dopant part to be an active layer, a step (6) of modifying the quality of all or part of the protective insulating film 8, a step (7) of forming an interlayer insulating film on the modified protective insulating film 8, and a step (8) of forming a source/drain electrode on the interlayer insulating film.
Abstract:
PROBLEM TO BE SOLVED: To rationalize a manufacturing process, without deteriorating the characteristics of a bottom gate thin-film transistor. SOLUTION: For manufacturing a thin-film transistor, a gate electrode forming process for forming a gate electrode on an insulating substrate 70 is executed. A continuous film-forming process for supplying the insulating substrate 70, where the gate electrode is formed to the reaction room 12 of a film forming device, forming a gate oxide film with a chemical vapor phase growing method, and forming a semiconductor thin film by overlapping it on the gate oxide in the same reaction room 12 is executed. Then, an implanting process for selectively implanting impurities to the semiconductor thin film and forming a source area and a drain region is executed. In the continuous film-forming process, first reaction gas containing an oxygen element is introduced to the reaction room, the gate oxide film is stacked by chemical vapor phase growing, the reaction room 12 is vacuum-sucked, first reaction gas is exhausted, second reaction gas which does not contain the oxygen element is made to flow into the reaction room 12, the remainder of first reaction gas is diluted, and the semiconductor thin film is stacked with chemical vapor phase growing by using second reaction gas.
Abstract:
PROBLEM TO BE SOLVED: To provide a laser crystallization device for a semiconductor thin film which controls crystal orientation. SOLUTION: Related to a laser crystallization device, a semiconductor thin film 4 formed on a substrate 0 is irradiated with laser beam 50 while applied with a magnetic field 25, so that the semiconductor thin film 4 is melted once and crystallized in a cooling process. The laser crystallization device comprises a stage 31 on which the substrate 0 to be processed is placed, a vessel 30 where the stage 31 is housed, a laser light source 51 for generating the laser beam 50, an optical system for guiding the laser beam 50 to the substrate 0 placed on the stage 31, and a magnetic field generating device which applied the unidirectional magnetic field 25 to the entire vessel 30 where the stage 31 and at least a part of the optical system are housed. Here, the semiconductor thin film 4 is irradiated with the laser light 50 for melting once, and the crystal orientation of crystal particles contained in the semiconductor thin film 4 is aligned under the action of unidirectional magnetic field in a cooling process. A unidirectional electric field may be acted instead of magnetic field.
Abstract:
PROBLEM TO BE SOLVED: To remove an unnecessary section while suppressing that a panel main body and a pad section are damaged, even when width of the unnecessary section to be removed from a glass substrate becomes about 1 mm. SOLUTION: An unnecessary section removing device 10 comprises; an installing section 11 capable of installing a display panel 40; and an adhesive tape supply means 12 for supplying an adhesive tape 13 so that an adhesive face may contact a facing part of the unnecessary section 45 of the display panel 40 in the state that the display panel 40 is installed on the install section 11. In a state that the adhesive tape 13 is stuck at least in a facing part of an arranging area of a temporary joint of the unnecessary section 45 of the display panel 40 installed on the install section 11, the display panel 40 is relatively moved so that the display panel 40 may be separated from the adhesive supply means 12 and thereby, the unnecessary section 45 is removed from the display panel 40 while suppressing contacting to an edge face of a second substrate 42. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a scribing apparatus in which the hindrance of rotation of a blade caused by the accumulation of chips or the shortening of the life of the blade or the like are prevented. SOLUTION: The blade 8 is pressed onto the surface of a glass plate G at a prescribed pressing force by controlling the protrusion amount of a cylinder shaft 15 by selecting air pressure to an air cylinder 14, and air is blown in the blade 8 advancing direction side to the center of the blade 8 from air blowing port 22 of a holder 7 through an air supplying tube 11 and an internal air blow passage 12, and at the same time, air is blown toward a line connecting the rotation center of the blade 8 and the contact point of the blade 8 and the glass plate G from the advancing direction side of the blade 8 though an external air blow tube 17. Under such conditions, the glass plate G is cut by horizontally moving the head main body 2. COPYRIGHT: (C)2005,JPO&NCIPI