Abstract:
PROBLEM TO BE SOLVED: To improve the yield of a product by preventing defects in gate breakdown strength in a bottom gate type TFT. SOLUTION: The manufacturing method of a bottom gate type TFT 100A includes a step (1) of forming a gate electrode on a substrate, a step (2) of forming a gate insulating film on the gate electrode 2, a step (3) of forming a laminate made up of an protective insulating film 8 having a film thickness of 100 nm or smaller while an active-layer antecedent film (polysilicon film 7) and the protective insulating film 8 are laminated on the gate insulating film, a step (4) of implanting a dopant in an LDD region or in a source/drain region of the active-layer precursor film 8 through the protective insulating film 8, a step (5) of activating the implanted dopant and causing the other non-dopant part to be an active layer, a step (6) of modifying the quality of all or part of the protective insulating film 8, a step (7) of forming an interlayer insulating film on the modified protective insulating film 8, and a step (8) of forming a source/drain electrode on the interlayer insulating film.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device in which electrostatic discharge damage of a thin film transistor can be suppressed and reliability is enhanced, and to provide its manufacturing process. SOLUTION: In the semiconductor device having a circuit formed of a plurality of thin film transistors 100, a gate interconnect line 22 connected commonly with a plurality of thin film transistors 100 is divided and the divided gate interconnect lines 22 are connected electrically through a connection interconnect line 29 arranged on an upper layer of the gate interconnect line 22. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring structure which prevents a crack in an inter-layer insulating layer made of SOG. SOLUTION: The wiring structure comprises a substrate insulating layer 20, a wiring layer 21 formed on the substrate insulating layer 20, and the SOG inter-layer insulating layer 23 formed on the substrate insulating layer 20 and the wiring layer 21. When the height of the top face of the inter-layer insulating layer 23 from the top face of the substrate insulating layer 20 is H 1 (m) and the same from the top face of the wiring layer 21 is H 2 (m), the wiring structure satisfies the following inequalities: H 1 -6 m, and H 2 ≥4×10 -7 m. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To effectively avoid a decrease in quality of a display image resulting from a subpixel having small areas in a multibit memory type display device by applying the present invention to a liquid crystal display device that, for example, has each pixel formed of a plurality of subpixels and represents gradations by driving the plurality of subpixels. SOLUTION: Regarding subpixels 32AA and 32AB with small areas at parts 43A to 43E for display, the parts 43A and 43B for display are formed in a nearly square shape. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To improve the reliability of a liquid crystal display by reducing parasitic capacitance and preventing a liquid crystal from sticking to an electrode. SOLUTION: The liquid crystal display and a method for manufacturing the same comprise the steps of: sticking a counter substrate 15 and a substrate 1 of the driving side to each other via a sealing agent; and sealing a liquid crystal onto a region inside the position of the sealing agent. In the region on which the liquid crystal is sealed, an insulating material (a protective film 8) with a dielectric constant lower than that of the liquid crystal is provided on an electrode 5S other than a pixel driving electrode (a pixel electrode 10) with a height nearly equal to a gap depth into which the liquid crystal is sealed. An organic material may also be used as the insulating material. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a display device for simultaneously suppressing OFF current characteristics of a field effect transistor used for a switching circuit for driving pixels and improving ON current characteristics and improving an image quality by improving performance of the switching circuit. SOLUTION: In the switching circuit including one field effect transistor or a plurality of field effect transistors connected in series electrically, at least partial width of a semiconductor layer 15 serving as a channel of at least one field effect transistor is changed continuously in the direction of channel length. For example, width of a part at a source side of the semiconductor layer 15 in the channel section is decreased linearly from W 50 to W 51 and width of other parts is fixed to W 51 . COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To connect an IC or a semiconductor chip with a high reliability. SOLUTION: An electrode part 20 to which the metal electrode (bump) of an IC circuit will be connected from an upper part is formed on the glass substrate 11 of a liquid crystal display device. The electrode part 20 is constituted by opening an inter-layer insulating film 23 in a part corresponding to metal wiring 22 and forming a land-like electrode pad 25 in this opened part. In the present invention, the plane shape of the electrode pad 25 is made smaller than the opened part of the inter-layer insulating film 23. Thus the flatness of the peripheral surface of the electrode 20 is improved. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To effectively avoid deterioration in the quality of a displayed image caused by a sub-pixel of a small area in a display device employing a multibit memory system by applying the display device to a liquid crystal display, for example, having a pixel composed of a plurality of sub-pixels and employing a system of representing a grayscale level by driving the plurality of sub-pixels. SOLUTION: In sub-pixels 32AA, 32AB which are small in areas of regions 43A to 43E to be displayed, the regions 43A, 43B to be displayed are formed into approximately square shapes. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a display apparatus wherein parasitic capacitance formed between a driving side substrate and a counter side substrate is reduced, waveform distortion or delay of signals caused by the parasitic capacitance is eliminated, and load on an external driving IC can be reduced, and to provide its manufacturing method. SOLUTION: When the display apparatus has a wiring structure wherein signal lines 33 (33R, 33G, 33B, 33P) are wired in an area on a glass substrate 41 (driving side substrate) opposing to a second glass substrate (counter side substrate) 42, a recessed part 45 is formed on an oxide film 43 on the glass substrate 41 and the signal lines 33 are wired in the recessed part 45. Thus, the distance between a transparent electrode 44 and the signal lines 33 is increased, and the parasitic capacitance generated between the transparent electrode 44 and the signal lines 33 is reduced. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that complication of layout is increased due to increase of the number of wirings and opening ratio of a pixel is reduced when a pixel electrode of a unit pixel is divided into more sub pixel electrodes for improving deviation of a center of gravity of sub pixel electrodes or complicated layout of the sub pixel electrodes is adopted, in an active matrix type liquid crystal display wherein gradation is expressed by an area gradation method. SOLUTION: In the active matrix type liquid crystal display wherein gradation is expressed by the area gradation method, layouts each having a plurality of sub pixel electrodes 31 to 35 are made upside-down for every one unit pixel e.g. in the horizontal direction, so that the layouts each having the plurality of sub pixel electrodes 31 to 35 are made different between unit pixels adjacent to each other in the horizontal direction, and the layouts each having the plurality of sub pixel electrodes 31 to 35 are made irregular between the adjacent unit pixels. COPYRIGHT: (C)2006,JPO&NCIPI