Abstract:
PURPOSE: A semiconductor device and a manufacturing method thereof are provided to secure an even step coverage property by using a self-assembled monolayer. CONSTITUTION: A barrier layer (120) comprises a Mercapto Propyl Tri Methoxy Silane (MPTMS). The barrier layer comprises a monomolecular film. The MPTMS is formed on a substructure (110). A conductive layer (130) is formed on the barrier layer. The conductive layer comprises a copper.
Abstract:
PURPOSE: A manufacturing method of a mold, the mold, and a forming method of fine patterns using the mold are provided to reduce costs needed for manufacturing processes and to form nano-sized line patterns on a substrate. CONSTITUTION: A manufacturing method of a mold includes the following: a first pattern is formed on a substrate(210) using ultraviolet ray shielding materials; a molding resin is applied on the substrate; a mask mold with a second pattern is pressurized on the substrate with the molding resin in order to arrange a surface which is shared by the first pattern and the second pattern; the patterns are imprinted; the molding resin is cured; and the master mold is removed from the substrate.
Abstract:
PURPOSE: A fine pattern forming method with a photo mask and a nano-imprinting mold is provided to form patterns of various shapes and to form nano-sized line patterns by using micro-sized line patterns. CONSTITUTION: A fine pattern forming method includes the following: Pattern forming resist(120) is applied on a substrate(110); a master mold with a first pattern is in contact with the upper side of the pattern forming resist; the master mold is pressurized to be imprinted; the master mold is irradiated with ultraviolet rays through a photo-mask with a second pattern which is different from the first pattern; and the master mold and the photo-mask are separated from the substrate to develop the pattern forming resist.
Abstract:
PURPOSE: A method for manufacturing a thin film transistor using a single copper target and thin film transistor using the method are provided to perform a sputtering process by copper or a single copper alloy target, thereby providing a thin fill transistor which forms a source and a drain by copper or copper alloy. CONSTITUTION: A gate electrode(105) is formed on a glass substrate(101). A gate insulating film(107), a semiconductor layer(117), and an ohmic contact layer(119) are deposited on the gate electrode. A natural oxide film is formed on the ohmic contact layer. An oxide film(115) is deposited on the ohmic contact layer using metal including copper. A source-drain layer(121) is deposited on the oxide film using metal including the copper.
Abstract:
PURPOSE: A ReRAM device and a manufacturing method thereof are provided to improve the interfacial property and memory property of a ReRAM device by forming a second electrode layer pattern after forming an adhesive patter between the second electrode pattern and a metal oxide layer. CONSTITUTION: A substrate(100) comprises a substrate insulating layer(120) and a substrate body layer(110). A first electrode layer(200) is formed on the substrate. A metal oxide layer(300) is formed on the first electrode layer. A self-assembled monolayer, which includes an aperture pattern exposing the metal oxide layer, is formed on the metal oxide layer. A second electrode layer pattern(500) is formed on the metal oxide layer.
Abstract:
본 발명은 자기조립단분자막을 이용하여 증착 형성한 금속 나노크리스탈에 의해 전하를 저장하는 플래쉬 메모리의 플로팅 게이트를 형성하기 위한 플로팅 게이트 형성방법, 이를 이용한 비휘발성 메모리 장치 및 그 제조방법에 관한 것으로, 반도체 기판 상에 플로팅 게이트를 형성하는 방법은 반도체 기판 상에 터널링 산화막을 형성하는 단계와, 상기 터널링 산화막 상에 자기조립 방식으로 조립되는 자기조립단분자막(self-assembled monolayers, SAMs)으로서 금속 나노 크리스탈과 이온결합이 이루어질 수 있는 결합기를 제공하며 다수의 금속 나노 크리스탈이 터널링 산화막으로 확산되는 것을 방지하기 위한 씨드층(seed layer)을 형성하는 단계와, 상기 씨드층(seed layer) 위에 불연속적인 입자형태로 증착되어 전하를 저장하는 다수의 금속 나노크리스탈을 형� �하는 단계를 포함하는 것을 특징으로 한다. 플래쉬 메모리, 플로팅 게이트, SAMs, 금속 나노크리스탈, 증착
Abstract:
A method for forming a floating gate, a non-volatile memory device, and a manufacturing thereof are provided to prevent a property change of layer quality due to a high-temperature heat treatment process by forming a nano crystal with a micell. A tunneling oxide layer(11) is formed on an upper surface of a semiconductor substrate(10). A nano structure is formed on the tunneling oxide layer by using a self-assembly method. A gate forming solution including a micell template is coated on the nano structure. A precursor material for synthesizing metal salt is introduced into the nano structure. A floating gate is formed by arranging the metal salt on the tunneling oxide layer by removing the micell template on the semiconductor substrate.
Abstract:
본 발명은 신뢰성이 향상된 반도체 소자 및 그 제조방법을 위하여, 하부 구조체, 하부 구조체 상에 형성된 MPTMS(mercaptopropyltrimethoxysilane)를 포함하는 장벽층, 장벽층 상에 형성된 도전층을 포함하는, 반도체 소자 및 그 제조방법이 제공된다.