公开(公告)号：KR1020100016329A

公开(公告)日：2010-02-12

申请号：KR1020097023297

申请日：2008-05-01

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 야마구치히로후미 ,  히로세가츠히토 ,  이케다가쿠

IPC: H01L21/68 ,  H01L21/02

CPC classification number: H01L21/681 ,  H01L21/67748

Abstract: A CCD detector (30) captures an image of the circular arc shape of the outer periphery of a semiconductor wafer (W) that is on standby at a standby position (W1) near the inlet of a processing unit (1). A calculation section (40) detects, from the captured image of the circular arc shape, positional data on multiple positions of the shape, obtains an imaginary circle of the semiconductor wafer (W), calculates the center coordinates of the imaginary circle, and calculates "information on positional displacement" of the semiconductor wafer (W) at the standby position (W1). A controller (50) controls a conveyance device (12) based on the ''information on displacement'' to correct the position of the semiconductor wafer (W) on the processing unit (1).

Abstract translation: CCD检测器（30）捕获在处理单元（1）的入口附近的待机位置（W1）待机的半导体晶片（W）的外周的圆弧形状的图像。 计算部（40）根据圆弧形状的拍摄图像检测形状的多个位置的位置数据，得到半导体晶片（W）的假想圆，计算虚拟圆的中心坐标，并计算 在待机位置（W1）处的半导体晶片（W）的位置偏移信息。 控制器（50）基于“位移信息”来控制输送装置（12），以校正处理单元（1）上的半导体晶片（W）的位置。

公开(公告)号：KR1020100014613A

公开(公告)日：2010-02-10

申请号：KR1020097020152

申请日：2008-03-26

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 야마구치히로후미

IPC: H01L21/677

CPC classification number: H01L21/67742 ,  H01L21/67196 ,  H01L21/67748 ,  H01L21/67772 ,  H01L21/67393

Abstract: In a vacuum treating apparatus including a treating vessel with delivery port adapted to have a vacuum atmosphere and perform treatment by a treating gas and a delivery chamber with vacuum atmosphere connected via a gate chamber to the delivery port of the treating vessel and equipped with delivery means for the pass and receipt of substrate, any diffusion of gas remaining in the treating vessel into the delivery chamber is suppressed. The vacuum treating apparatus comprises the treating vessel, the delivery chamber and a gate valve provided in the gate chamber so that the delivery port is closed when the substrate is treated in the treating vessel while the delivery port is opened when the pass and receipt of substrate for the treating vessel are carried out. In order to suppress any diffusion of gas remaining in the treating vessel into the delivery chamber, the gate chamber is furnished, at its position facing the delivery port, with a gate chamber inert gas supply part and a gate chamber exhaust port adapted to produce a stream of inert gas. This suppresses any diffusion of gas remaining in the treating vessel through the delivery port into the delivery chamber.

Abstract translation: 在包括处理容器的真空处理装置中，所述处理容器具有适于具有真空气氛的处理容器，并且通过处理气体进行处理，并且具有经由闸室连接到处理容器的输送口的真空气氛的输送室，并配备有输送装置 为了通过和接收基板，抑制了在处理容器中残留在输送室中的气体的任何扩散。 真空处理装置包括处理容器，输送室和设置在闸室中的闸阀，使得当基板在处理容器中被处理时输送口关闭，同时当输送口接收基板时打开输送口 对于处理容器进行。 为了抑制残留在处理容器中的气体的任何扩散进入输送室，门室在其面向输送口的位置处设有门室惰性气体供应部分和门室排气口，适于产生 惰性气流。 这抑制了通过输送口进入输送室的残留在处理容器中的气体的任何扩散。

公开(公告)号：KR1020080015476A

公开(公告)日：2008-02-19

申请号：KR1020077030757

申请日：2006-10-06

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 세키도고이치 ,  야마구치히로후미 ,  배중환

IPC: H01L21/677

CPC classification number: H01L21/67196 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67745 ,  H01L21/67276 ,  H01L21/67769

Abstract: Disclosed is a method for running a treatment system provided with a plurality of process modules for subjecting substrates to mutually identical treatments. When each process module is conditioned for preparing the execution of a predetermined process recipe, at each completion of the conditioning of one process module, the sequential transfers of untreated substrates are started on a substrate transfer route from a cassette for housing the untreated substrates to that process module, and the sequential processes on the untreated substrates by using that process module are started. Even if the conditioning time periods are uneven between the process modules of identical specifications, the treatment system can be efficiently run.

Abstract translation: 公开了一种用于运行处理系统的方法，该处理系统具有多个用于对基板进行相同处理的处理模块。 当每个处理模块被调节以准备执行预定的处理配方时，在每个完成一个处理模块的调理时，未处理的基板的顺序传送在基板传送路线上从用于容纳未处理的基板的盒开始到 开始使用该处理模块和未处理的基板上的顺序处理。 即使相同规格的处理模块之间的调理时间段不均匀，也可以有效地运行处理系统。

公开(公告)号：KR1020140048052A

公开(公告)日：2014-04-23

申请号：KR1020130121877

申请日：2013-10-14

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 구보데라마사토 ,  기쿠시마히로히토 ,  야마구치히로후미 ,  사사키요시아키 ,  유멩야우

IPC: H01L21/677 ,  B25J9/16

CPC classification number: G05B19/4189 ,  G05B2219/37608 ,  H01L21/67259 ,  H01L21/67748 ,  H01L21/67766 ,  H01L21/681 ,  H01L21/67265 ,  G05B2219/39527 ,  G05B2219/45031 ,  H01L21/67742

Abstract: The present invention provides a method for positioning a return device by which the workability of a teaching operation is improved, inter-operator deviation is reduced, and the risk of interference with an object to be processed is suppressed. The method for positioning a return device which has a maintaining pin portion maintaining a lower surface of a peripheral portion of the object to be processed and has a pick portion configured to be accessible to and separable from a mount configured to be pivotable and movable in an up-and-down direction and provided with a detection unit at a tip end to detect the presence and absence of the object to be processed, includes a height determining step in which a height reference position of the pick portion is determined through the detection of an upper end edge of the maintaining pin portion by the detection unit; an advance angle determining step in which the shift angle between the radial direction of the mount and the advance direction of the pick portion is determined and the advance angle of the pick portion is corrected; an advance starting point positioning step in which the shift horizontal distance between the radial direction of the mount and the advance direction of the pick portion is determined and the advance starting point position of the pick portion is corrected; and an advance amount determining step in which the advance reference amount of the pick portion is determined from the coordinates of the maintaining pin portion. [Reference numerals] (AA) Start; (BB) Height determining step; (CC) Advance angle determining step; (DD) Advance starting point positioning step; (EE) Advance amount determining step; (FF) End

Abstract translation: 本发明提供了一种用于定位返回装置的方法，通过该方法可以提高教学操作的可操作性，减少操作者之间的偏差，并且抑制与被处理对象的干扰的风险。 一种用于定位返回装置的方法，该返回装置具有维持销部分，该保持销部分保持待处理物体的周边部分的下表面，并且具有构造成能够接近并可与其分离的拾取部分，所述安装件被构造成可枢转和移动 上下方向，并且在尖端设置有检测单元，以检测待处理对象的存在和不存在，包括：高度确定步骤，其中通过检测所述拾取部分的高度参考位置来确定 由所述检测单元保持所述保持销部分的上端边缘; 提前角确定步骤，其中确定安装座的径向与拾取部的前进方向之间的移动角度，并且校正拾取部的提前角度; 提前起点定位步骤，其中确定安装座的径向与拾取部的前进方向之间的移动水平距离，并且校正拾取部的前进起点位置; 以及提前量确定步骤，其中根据保持销部分的坐标确定拾取部分的提前基准量。 （附图标记）（AA）开始; （BB）高度确定步骤; （CC）前进角确定步骤; （DD）提前起点定位步骤; （EE）预付金额确定步骤; （FF）结束

公开(公告)号：KR100940135B1

公开(公告)日：2010-02-03

申请号：KR1020077030757

申请日：2006-10-06

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 세키도고이치 ,  야마구치히로후미 ,  배중환

IPC: H01L21/677

CPC classification number: H01L21/67196 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67745

Abstract: 서로 동일한 처리를 기판에 실시하기 위해 마련된 복수의 프로세스 모듈을 구비한 처리 시스템의 운전 방법이 개시된다. 소정의 프로세스 레시피를 실행하기 위한 준비로서의 각 프로세스 모듈의 컨디셔닝을 행할 때, 하나의 프로세스 모듈의 컨디셔닝이 완료될 때마다, 미처리 기판을 수납하는 카세트로부터 그 프로세스 모듈로의 기판 반송 경로 상에서 점차적인 미처리 기판의 반송을 개시함과 아울러 그 프로세스 모듈을 이용한 미처리 기판에 대한 점차적인 프로세스가 개시된다. 동일 사양의 프로세스 모듈 간에 컨디셔닝 시간이 일정하지 않다고 하더라도, 처리 시스템을 효율적으로 운용할 수 있다.

公开(公告)号：KR1020080108565A

公开(公告)日：2008-12-15

申请号：KR1020087025939

申请日：2007-04-26

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 사사키요시아키 ,  야마구치히로후미

IPC: H01L21/31 ,  H01L21/66 ,  H01L21/68 ,  H01L21/205

CPC classification number: H01L21/681 ,  C23C16/04 ,  C23C16/52 ,  H01L21/67259 ,  H01L21/67288

Abstract: A film position adjusting method is provided to easily correct a discrepancy of a film depositing position in a substrate processing system. The substrate processing system is comprised of a process chamber (12), and an orienter (16) for centering of a wafer (W) to be carried in the process chamber (12). The orienter (16) is provided with an orienter sensor (42) for measuring a discrepancy at the central position of the wafer (W), and an image sensor (41) for measuring a width of a non-film depositing portion at circumferential portions of the wafer (W). Subjected to film deposition processing in the process chamber (12), the wafer (W) is carried to the orienter (16) where a discrepancy from the central position of the wafer (W) is measured, the wafer (W) is then subjected to centering, and the width of the non-film depositing portion of the wafer (W) is measured, and a film position discrepancy is calculated in accordance with the width of the non-film depositing portion. To correct the calculated film position discrepancy, a wafer carrying target position on a receiving plate (13) in the process chamber (12) is adjusted. ® KIPO & WIPO 2009

Abstract translation: 提供胶片位置调整方法以便容易地校正基板处理系统中的胶片沉积位置的差异。 基板处理系统包括处理室（12）和用于定心待处理室（12）中的晶片（W）的定向器（16）。 定向器（16）设置有用于测量晶片（W）的中心位置处的偏差的定向传感器（42）和用于测量圆周部分上非成膜部分的宽度的图像传感器（41） 的晶片（W）。 在处理室（12）中进行成膜处理时，将晶片（W）运送到定向器（16），其中测量与晶片（W）的中心位置的偏差，然后对晶片（W）进行 测量晶片（W）的非胶片沉积部分的宽度，并根据非胶片沉积部分的宽度计算胶片位置偏差。 为了校正计算出的胶片位置偏差，调节在处理室（12）中的接收板（13）上承载目标位置的晶片。 ®KIPO＆WIPO 2009

公开(公告)号：KR101745045B1

公开(公告)日：2017-06-08

申请号：KR1020130121877

申请日：2013-10-14

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 구보데라마사토 ,  기쿠시마히로히토 ,  야마구치히로후미 ,  사사키요시아키 ,  유멩야우

IPC: H01L21/677 ,  B25J9/16

CPC classification number: G05B19/4189 ,  G05B2219/37608 ,  H01L21/67259 ,  H01L21/67748 ,  H01L21/67766 ,  H01L21/681

Abstract: 티칭조작의작업성이향상해서작업자간의편차를저감하고, 피처리체와간섭할위험을억제하는반송기구의위치결정방법을제공한다. 피처리체의주변부의하면을유지하는유지핀부를가지고, 또한선회및 상하이동가능하게이루어진탑재대에대하여접근및 이간이가능하게이루어져서선단에피처리체의유무를검출하는검출부를마련한픽부를가지는반송기구의위치결정방법에있어서, 검출부에의해유지핀부의상단에지를검출해서픽부의높이기준위치를결정하는높이결정공정과, 탑재대의반경방향과픽부의전진방향과의어긋남각도를구해서픽부의전진각도를수정하는전진각도결정공정과, 탑재대의반경방향과픽부의전진방향과의어긋남수평거리를구해서픽부의전진기점위치를수정하는전진기점위치결정공정과, 유지핀부의좌표로부터픽부의전진기준량을구하는전진량결정공정을가진다.

Abstract translation: 提高教学操作的加工性，以减少操作者的偏差，并提供抑制到待治疗的受试者和干扰的风险的转移机构的位置的方法。 它保持销部分，用于保存根据该对象的周边被加工，并且具有旋转的输送机构和垂直可移动地与yirueojyeoseo制成使该方法和离开相对于用于检测物体的存在或不存在设置有检测器支架，以在尖端被处理拾取部件 在定位方法中，在保持角度，将拾取单元移动向前求出偏差角的销部，以检测是否在顶部和高度确定确定所述截齿的基准位置的高度的步骤中，用一个径向和由所述检测器接部前进方向 校正提前角确定步骤中，安装台径向方向和所述拾取单元向前移动开始定位过程以固定变速获得向前的方向和保持销，以获得拾取单元的水平距离起始剔取部分向前位置从坐标部向前移动参考量 并且提前量确定步骤。

公开(公告)号：KR101205416B1

公开(公告)日：2012-11-27

申请号：KR1020100014954

申请日：2010-02-19

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 사카우에히로미츠 ,  야마구치히로후미

IPC: H01L21/677 ,  B65G49/07 ,  H01L21/68

CPC classification number: H01L21/67766 ,  H01L21/67778

Abstract: 처리 장치와 기판 수용부 사이에서의 기판의 반송 시간을 단축하여 기판 처리 시스템 스루풋을 향상시킨다. 처리 장치(22)에 대하여 기판(W) 반송을 행하는 기판 반송 장치(24)는, 처리 장치(22)로 반입되는 복수의 기판(W)을 수직 방향으로 다단으로 수용하는 기판 수용부(50)와, 처리 장치(22)로부터 반출되는 복수의 기판(Wa)을 수직 방향으로 다단으로 수용하는 기판 수용부(51)와, 기판 수용부(50)로부터 처리 장치(22)로 기판(W)을 반송하는 기판 보지부(56)와, 처리 장치(22)로부터 기판 수용부(51)로 기판을 반송하는 기판 보지부(57)를 가지고 있다. 기판 수용부(50) 내는 기판(W)과 기판 보지부(56)를 상대적으로 상하 방향으로 이동시키는 승강 기구(54)를 구비하고, 기판 수용부(51) 내는 기판(Wa)과 기판 보지부(57)를 상대적으로 상하 방향으로 이동시키는 승강 기구(55)를 구비하고 있다.

公开(公告)号：KR1020100099654A

公开(公告)日：2010-09-13

申请号：KR1020100014954

申请日：2010-02-19

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 사카우에히로미츠 ,  야마구치히로후미

IPC: H01L21/677 ,  B65G49/07 ,  H01L21/68

CPC classification number: H01L21/67766 ,  H01L21/67778 ,  H01L21/68714 ,  Y10S414/137

Abstract: PURPOSE: A device and a method for transferring a substrate are provided to improve the throughput of a substrate processing system by reducing a transfer time of a substrate between a processing device and a substrate receiving unit. CONSTITUTION: A first substrate receiver(50) receives a plurality of substrates(W) inputted to a processing device(22) in a vertical direction with multi-stages. A second substrate receiver(51) receives a plurality of substrates outputted from the processing device in the vertical direction with multi-stages. A first substrate holder(56) transfers the substrate from the first substrate receiver to the processing device. A second substrate holder(57) transfers the substrate from the processing device to the second substrate receiver. A first lifting unit(42a) transfers the substrate between the first substrate receiver and the first substrate holder by vertically moving the first substrate holder and the substrate in the first substrate receiver. A second lifting unit(42b) transfers the substrate between the second substrate receiver and the second substrate holder by vertically moving the second substrate holder and the substrate in the second substrate receiver.

Abstract translation: 目的：提供用于转移衬底的装置和方法，以通过减少处理装置和衬底接收单元之间的衬底的传送时间来改善衬底处理系统的生产量。 构成：第一基板接收器（50）以多级方式接收在垂直方向上输入到处理装置（22）的多个基板（W）。 第二基板接收器（51）以多级方式从垂直方向接收从处理装置输出的多个基板。 第一衬底保持器（56）将衬底从第一衬底接收器传送到处理设备。 第二衬底保持器（57）将衬底从处理装置传送到第二衬底接收器。 第一提升单元（42a）通过在第一衬底接收器中垂直移动第一衬底保持器和衬底而在第一衬底接收器和第一衬底保持器之间传送衬底。 第二提升单元（42b）通过在第二衬底接收器中垂直移动第二衬底保持器和衬底而在第二衬底接收器和第二衬底保持器之间传送衬底。

公开(公告)号：KR100256512B1

公开(公告)日：2000-05-15

申请号：KR1019960020198

申请日：1996-06-07

Applicant: 도쿄엘렉트론가부시키가이샤 ,  바리안 세미컨덕터 이큅먼트 가부시키가이샤

Inventor： 가토스스무 ,  야마구치히로후미

IPC: H01L21/02

CPC classification number: H01L21/67167 ,  C23C14/50 ,  C23C14/568 ,  H01L21/67201 ,  Y10S414/139

Abstract: 본 발명에 있어서는, 진공예비챔버내의 피처리체를 냉각하기 위한 냉각대에 피처리체와 냉각대 사이에 소정의 갭을 두고 피처리체를 지지하는 지지부재가 설치되어 있기 때문에, 피처리체를 냉각대와 직접 접촉시키지 않고 냉각시키는 것이 가능하게 된다. 따라서, 피처리체와 냉각대 사이의 면접촉에 기인하는 화학반응이 일어나지 않게 되어 피처리체가 오엽되지 않게 된다. 피처리체가 급속한 냉각에 의해 다소 휘어지거나 미소한 진동을 발생시킨다고 해도, 냉각대와 직접 접촉하지 않기 때문에, 파티클이 발생되지 않게 된다. 더욱이, 처리전의 피처리체를 예열하기 위한 예열장치가 냉각대 위에 설치된다. 따라서, 진공예비챔버를 처리후의 피처리체를 냉각하기 위해서 뿐만 아니라 처리전의 피처리체를 예열하는데 이용할 수 있고, 따라서 스루풋의 향상이 도모된다.