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公开(公告)号：KR1020090002887A
公开(公告)日：2009-01-09
申请号：KR1020070067253
申请日：2007-07-04
Applicant: 삼성전기주식회사
IPC: H01L23/12
CPC classification number: H01L21/78 , H01L21/0231 , H01L21/0273 , H01L21/268 , H01L23/481 , H01L23/4828
Abstract: The wafer level device packaging method is provided to prevent the generation of warpage in the thermal process and to reduce the stress about the wafer for device substrate and the wafer for the cap substrate. The wafer(10) for the cap substrate is mounted on the wafer supporter (Wafer Support Substrate)(20) by the medium of the adhesive(12). The separate space(13) is formed for setting up the cutting line(50) and for surrounding a plurality of vias(11). The upper seal ring pattern(14) is formed with the closed line. The wafer supporter and the wafer are bonded by adhesive. The warpage by the thermal expansion can be prevented by the separate space.
Abstract translation: 提供了晶片级装置封装方法以防止在热处理中产生翘曲并且减小用于器件衬底的晶片和盖衬底的晶片的应力。 用于盖基板的晶片（10）通过粘合剂（12）的介质安装在晶片支撑件（晶片支撑基板）（20）上。 分离空间（13）形成用于设置切割线（50）并围绕多个通路（11）。 上密封圈图案（14）形成有闭合线。 晶片支架和晶片通过粘合剂粘合。 可以通过分开的空间来防止热膨胀的翘曲。
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公开(公告)号：KR100866619B1
公开(公告)日：2008-11-03
申请号：KR1020070097803
申请日：2007-09-28
Applicant: 삼성전기주식회사
IPC: H01L23/12 , H01L27/146
CPC classification number: H01L27/14618 , H01L27/14683 , H01L2224/02372 , H01L2224/05001 , H01L2224/05009 , H01L2224/05024 , H01L2224/05548 , H01L2224/13 , H01L2924/00014 , H01L2224/05599
Abstract: An interconnection process for the external connection including via etc can be facilitated. The reliability can be improved. The focusing unregulated can be achieved in using a camera module. The image sensor includes a wafer(11); the image sensor(12) mounted on the wafer; the transparent member mounted on the wafer in order to seal the image sensor; the via which is formed on wafer and located in the outer side of the transparent member(14); the upper pad(15) formed in the top end portion of via; the encapsulation part(16) formed in the outer side of the transparent member in the upper side of wafer; the external connection member(18) electrically connected to the bottom part of via.
Abstract translation: 可以促进用于包括通孔等的外部连接的互连处理。 可靠性得到提高。 在使用相机模块时可以实现未调节的对焦。 图像传感器包括晶片（11）; 安装在晶片上的图像传感器（12） 透明构件安装在晶片上以便密封图像传感器; 形成在晶片上并位于透明构件（14）的外侧的通孔; 上焊盘（15）形成在通孔的顶端部分中; 形成在晶片上侧的透明构件的外侧的封装部（16） 电连接到通孔的底部的外部连接构件（18）。
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公开(公告)号：KR1020100068660A
公开(公告)日：2010-06-24
申请号：KR1020080127091
申请日：2008-12-15
Applicant: 삼성전기주식회사
IPC: H01L23/12
CPC classification number: H01L21/568 , H01L2224/12105 , H01L2224/19 , H01L2924/351 , H01L2924/00 , H01L2924/00012
Abstract: PURPOSE: A stacked wafer level package and a method for manufacturing the same are provided to reduce a cost for manufacturing the package by performing both a stacking process for semiconductor chips and a packaging process on a wafer. CONSTITUTION: An external connection unit is arranged in the lower part of a rearranged wiring layer(111). A chip connection pad(130a) is arranged on the upper part of the rearranged wiring layer. A semiconductor chip(160) is mounted on the rearranged wiring layer. A metal post(140) is electrically connected to the rearranged wiring layer. A sealing unit(170) hermetically seals the semiconductor chip. Electronic components(200) are electrically connected to the metal post.
Abstract translation: 目的：提供堆叠晶片级封装及其制造方法，以通过执行半导体芯片的堆叠处理和晶片上的封装处理来降低制造封装的成本。 构成：在重排布线层（111）的下部设有外部连接单元。 芯片连接焊盘（130a）布置在重排布线层的上部。 半导体芯片（160）安装在重新布置的布线层上。 金属柱（140）电连接到重新布置的布线层。 密封单元（170）密封半导体芯片。 电子部件（200）电连接到金属柱。
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公开(公告)号：KR100951284B1
公开(公告)日：2010-04-02
申请号：KR1020070053718
申请日：2007-06-01
Applicant: 삼성전기주식회사
IPC: H01L21/60
CPC classification number: H01L23/10 , H01L21/76898 , H01L2924/0002 , H03H9/105 , H03H9/1092 , H01L2924/00
Abstract: 웨이퍼 레벨 패키지 제조방법을 제공한다.
본 발명은 상부면에 하나이상의 디바이스부를 구비하고 상기 디바이스부와 전기적으로 연결되는 본딩패드를 구비하는 디바이스 기판용 웨이퍼를 제공하는 단계 ; 상기 본딩패드를 따라 상기 디바이스부를 에워싸는 접합용 실링라인을 제공하는 단계 ; 상기 접합용 실링라인을 매개로 캡 기판용 웨이퍼와 디바이스 기판용 웨이퍼를 접합하는 단계 ; 상기 본딩패드와 전기적으로 연결되는 외부단자를 상기 캡기판용 웨이퍼에 형성하는 단계 ; 및 상기 캡기판용 웨이퍼와 디바이스 기판용 웨이퍼를 절단라인을 따라 절단하여 복수개의 웨이퍼 레벨 패키지를 개별적으로 분리하는 단계 ; 를 포함하고, 상기 접합용 실링라인은 상기 본딩패드를 비전도성 소재로 완전히 덮도록 상기 본딩패드를 따라 연속적으로 형성됨을 특징으로 한다.
본 발명에 의하면, 제품의 사이즈를 줄여 소형화를 도모하고, 웨이퍼의 변형및 파손없이 접합공정을 수행하고, 웨이퍼의 재료선택에 대한 자유도를 높일 수 있다.
웨이퍼, 레벨, 디바이스, 실링, 캡 기판, 디바이스 기판-
公开(公告)号：KR100914892B1
公开(公告)日：2009-08-31
申请号：KR1020080031213
申请日：2008-04-03
Applicant: 삼성전기주식회사
CPC classification number: H01L2224/11
Abstract: A ball grid array package and manufacturing method thereof are provided to prevent warpage by the metal plate. The metal oxide layer(15) is formed on the metal plate(10). The alignment mark(20) is formed in the metal oxide layer. The mold frame(25) is formed on the metal oxide layer and has the cavity(30) limiting the chip mounting region. The gap between the chip and the metal plate exposed by the alignment mark is coated with the thermally conductive adhesive(35). The metal plate is made of copper(Cu). The metal oxide layer is made of the copper oxide film of the black formed by the dark treatment.
Abstract translation: 提供球栅阵列封装及其制造方法以防止金属板翘曲。 金属氧化物层（15）形成在金属板（10）上。 对准标记（20）形成在金属氧化物层中。 模具框架（25）形成在金属氧化物层上，并且具有限制芯片安装区域的空腔（30）。 通过对准标记曝光的芯片和金属板之间的间隙涂覆有导热粘合剂（35）。 金属板由铜（Cu）制成。 金属氧化物层由黑色处理形成的黑色氧化铜膜构成。
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Patent Agency Ranking
公开(公告)号：KR1020090085206A
公开(公告)日：2009-08-07
申请号：KR1020080010984
申请日：2008-02-04
Applicant: 삼성전기주식회사
CPC classification number: H01L24/97 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A wafer level package and a manufacturing method thereof are provided to reduce the whole thickness of a package while being low prices without a substrate. In a wafer level package and a manufacturing method thereof, a chip(130) is mounted in a metal wiring(120a), and a mold(150) is formed on the metal wiring part in order to protect the chip. An external connection member(170) is electrically connected to the lower part of the metal wiring. A wafer level package includes at least more than one a chip, and a wafer level package includes a passive element formed on the metal wiring on which the chip is not formed.
Abstract translation: 提供了晶片级封装及其制造方法，以便在没有基板的情况下以低廉的价格降低封装的整体厚度。 在晶片级封装及其制造方法中，芯片（130）安装在金属布线（120a）中，并且在金属布线部分上形成模具（150）以保护芯片。 外部连接构件（170）电连接到金属布线的下部。 晶片级封装包括至少多于一个芯片，并且晶片级封装包括形成在其上未形成芯片的金属布线上的无源元件。
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公开(公告)号：KR1020080108667A
公开(公告)日：2008-12-16
申请号：KR1020070056501
申请日：2007-06-11
Applicant: 삼성전기주식회사
IPC: H01L27/146 , H01L27/14
CPC classification number: H01L27/14618 , H01L27/1462 , H01L31/0203 , H01L31/02161 , H01L31/02164
Abstract: An image sensor module of the wafer level for the wafer level package and a manufacturing method thereof are provided to efficiently protect the image sensor from the external foreign substance by forming the coating layer to cover the image sensor. An image sensor module comprises the wafer(10) and the coating layer(50). An image sensor(20) is equipped on the wafer. The coating layer is coated on the upper side of wafer in order to cover the image sensor. The coating layer is made of the optical permeability transparent material including the hetero material. The coating layer is coated within the image sensor area on the wafer. The adhesive reinforcing layer is formed on the wafer except for the region where the coating layer is formed.
Abstract translation: 提供晶片级封装的晶片级的图像传感器模块及其制造方法，以通过形成覆盖图像传感器的涂层来有效地保护图像传感器免受外部异物的影响。 图像传感器模块包括晶片（10）和涂层（50）。 图像传感器（20）装配在晶片上。 为了覆盖图像传感器，将涂层涂覆在晶片的上侧。 涂层由包括异质材料的透光透明材料制成。 将涂层涂覆在晶片上的图像传感器区域内。 除了形成涂层的区域之外，在晶片上形成粘合剂增强层。
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公开(公告)号：KR1020090006980A
公开(公告)日：2009-01-16
申请号：KR1020070070507
申请日：2007-07-13
Applicant: 삼성전기주식회사
IPC: H01L27/146
CPC classification number: H01L27/14618 , H01L2224/13 , H04N5/2257
Abstract: An image sensor module of wafer level and manufacturing method thereof is provided to remove complicated wiring by installing an image sensor module of the wafer level in which the wireless telecommunication is possible. An image sensor module of wafer level includes a wafer(10), an image sensor(20), radio communications chip(30) and a protective cover(40) installed at the upper side of the image sensor. An image sensor and air cavity(40a) in which radio communications chip are sealed up are udder of a protective cover corresponding to the upper side of the wafer. The lead portion(40b), protruded from the external circumference of the wafer, is assembled by a bonding method. The protective cover is formed by one of glass, quartz, plastic and polymer.
Abstract translation: 提供晶片级的图像传感器模块及其制造方法，通过安装可能进行无线通信的晶片级的图像传感器模块来去除复杂的布线。 晶片级的图像传感器模块包括晶片（10），图像传感器（20），无线电通信芯片（30）和安装在图像传感器上侧的保护盖（40）。 无线电通信芯片被密封的图像传感器和空气腔（40a）是与晶片上侧相对应的保护盖的一部分。 从晶片的外周突出的引线部分（40b）通过接合方法组装。 保护罩由玻璃，石英，塑料和聚合物之一形成。
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公开(公告)号：KR100878409B1
公开(公告)日：2009-01-13
申请号：KR1020070071496
申请日：2007-07-18
Applicant: 삼성전기주식회사
IPC: H01L23/12
CPC classification number: H01L23/28 , H01L21/268 , H01L21/78 , H01L23/481 , H01L23/4828 , H01L24/26
Abstract: A wafer level device package capable of improving packaging yield by reducing stress about wafer and packaging method thereof are provided to perform airtight property of semiconductor device by using molding material. A wafer level device package capable of improving packaging yield by reducing stress about wafer comprises a first substrate, a second substrate, a molding part(40), a device, and two or more via parts(12). The second substrate is faced with the first substrate, is contacted on one surface of the first substrate, and is sealed by the molding part. The device is surrounded in one surface of the first substrate or the second substrate. The via part penetrates the second substrate and the molding part, and is formed to electrically connect with the device. A molding layer(45) corresponding to the molding part is formed in the other surface of the first substrate.
Abstract translation: 提供能够通过减少晶片的应力来提高封装产量的晶片级器件封装及其封装方法，以通过使用成型材料来实现半导体器件的气密性。 能够通过减少晶片的应力而提高封装产量的晶片级器件封装包括第一衬底，第二衬底，模制部件（40），器件以及两个或多个通孔部件（12）。 第二基板面对第一基板，在第一基板的一个表面上接触，并被模制部件密封。 该装置被包围在第一基板或第二基板的一个表面中。 通孔部穿透第二基板和成型部，并且形成为与设备电连接。 在第一基板的另一个表面上形成对应于成型部件的成型层（45）。
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公开(公告)号：KR1020080108668A
公开(公告)日：2008-12-16
申请号：KR1020070056502
申请日：2007-06-11
Applicant: 삼성전기주식회사
IPC: H01L27/14 , H01L27/146
CPC classification number: H01L31/0203 , H01L27/14618 , H01L31/02325
Abstract: An image sensor module and a manufacturing method thereof are provided to protect the image sensor from the external foreign materials by covering the image sensor with the optical permeability protective film and coating the hetero material on the surface of optical permeability protective film. An image sensor module comprises the wafer(110), and the optical permeability protective film(150). An image sensor(120) is equipped on the upper side of the wafer. An optical permeability protective film is equipped on the upper side of wafer as a transfer manner in order to cover the image sensor. The optical permeability protective film is made of the thermal curing or the light curing resin having adhesive. The optical permeability protective film has the buffering property where the optical permeability protective film and the image sensor are contacted.
Abstract translation: 提供了一种图像传感器模块及其制造方法，通过用透光性保护膜覆盖图像传感器并将异质材料涂覆在透光性保护膜的表面上来保护图像传感器免受外部异物的侵害。 图像传感器模块包括晶片（110）和透光性保护膜（150）。 图像传感器（120）装配在晶片的上侧。 为了覆盖图像传感器，以透光性保护膜作为转印方式配置在晶片的上侧。 透光保护膜由具有粘合剂的热固化或光固化树脂制成。 透光性保护膜具有透光性保护膜和图像传感器接触的缓冲性。
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