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    공기조화기의 실외기 및 그 제어방법
    2.
    发明公开
    공기조화기의 실외기 및 그 제어방법 审中-实审
    空调室外机及其控制方法

    公开(公告)号：KR1020160036420A

    公开(公告)日：2016-04-04

    申请号：KR1020140128679

    申请日：2014-09-25

    Applicant: 삼성전자주식회사

    Inventor： 강태우 ,  이한석 ,  채왕병

    IPC: F24F1/58 ,  F24F11/02

    CPC classification number: G01N21/55 ,  F24F1/06 ,  F24F1/50 ,  F24F1/58 ,  G01B11/14 ,  G01W1/14

    Abstract: 공기조화기의실외기에쌓이는눈을감지할수 있는공기조화기의실외기와그 제어방법을개시한다. 실외기에는감지장치가설치되어감지장치에포함되는적설감지영역에눈이쌓인경우, 광센서를통하여적설여부를감지한다. 광센서에서감지되는값은제어부에송신되며, 제어부는적설되지않는때의기본값과비교하여기본값과다른값을수신받았을때, 팬구동부를제어하여팬을구동시킨다.팬의구동으로발생하는바람은적설감지영역및 팬가드와토출부에쌓인눈을제거하여팬이쌓인눈에의해오작동하는것을방지할수 있다.

    Abstract translation: 公开了感测积雪的空调的室外机及其控制方法。 传感器被安装在室外单元中，以便当雪沉积在包括在传感器中的沉积的雪感测区域中时，感测雪是否通过光学传感器沉积。 由光学传感器检测到的值被发送到控制单元，并且控制单元在不积雪时将该值与参考值进行比较，并且当控制单元接收到不同于 参考值。 通过风扇的运转产生的风消除了积存在风扇防护装置，放电单元以及积雪区域中的积雪，并防止风扇由于积雪而发生故障。

    서셉터 및 이를 구비하는 화학 기상 증착 장치
    4.
    发明公开
    서셉터 및 이를 구비하는 화학 기상 증착 장치 无效
    用于化学气相沉积的SUSCEPTOR和装置，包括它们

    公开(公告)号：KR1020110084644A

    公开(公告)日：2011-07-26

    申请号：KR1020100004301

    申请日：2010-01-18

    Applicant: 삼성전자주식회사

    Inventor： 정호일 ,  조현수 ,  강태우 ,  임은광

    IPC: H01L21/687 ,  H01L21/205

    CPC classification number: H01L21/68785 ,  H01L21/67017 ,  H01L21/68764

    Abstract: PURPOSE: A susceptor and a chemical vapor deposition device with the same are provided to stably and effectively rotate a receiving object in which a deposited object is mounted using energy generated by a gas flow, thereby uniformly growing a thin film on the deposited object. CONSTITUTION: A rotating object(32) rotates by a rotating shaft connected to a driving device. A receiving groove is placed on the rotating object and is opened upward. A gas flowing path(35) is placed along with the inside of the rotating object so that the gas flowing path is located in the lower part of the receiving groove. A driving gas moves into the receiving groove through the bottom surface of the receiving groove. A driving gas supply path is placed in the rotating shaft. A satellite(50) comprises a disc and a plurality of driving grooves. The driving groove is formed along with the main circumference from the bottom surface of the disc.

    Abstract translation: 目的：提供一种感受器和具有该感受器和化学气相沉积装置的化学气相沉积装置，以便使用由气流产生的能量来稳定和有效地旋转其中安装沉积物体的接收物体，从而在沉积物体上均匀生长薄膜。 构成：旋转物体（32）通过连接到驱动装置的旋转轴旋转。 接收槽放置在旋转物体上并向上打开。 气体流动路径（35）与旋转物体的内部一起放置，使得气体流动路径位于接收槽的下部。 驱动气体通过容纳槽的底面移动到接​​收槽中。 驱动气体供给路径被放置在旋转轴中。 卫星（50）包括盘和多个驱动槽。 驱动槽与盘的底面一起形成有主圆周。

    파티클 발생율을 최소화하기 위한 반도체 디바이스제조방법
    5.
    发明公开
    파티클 발생율을 최소화하기 위한 반도체 디바이스제조방법 无效
    用于最小化粒子发生速率的半导体器件制造方法

    公开(公告)号：KR1020080025811A

    公开(公告)日：2008-03-24

    申请号：KR1020060090429

    申请日：2006-09-19

    Applicant: 삼성전자주식회사

    Inventor： 강태우

    IPC: H01L21/28

    CPC classification number: H01L21/76846 ,  H01L21/76856 ,  H01L21/76877

    Abstract: A method for fabricating a semiconductor device is provided to prevent wafer loss and reduce unscheduled equipment downtime while minimizing formation of eddy current caused by sudden pressure change during the formation of a titanium layer and a titanium nitride layer, by progressively increasing the amount of gas injected into a process chamber. A method for fabricating a semiconductor device comprises the steps of: forming a first metal above a semiconductor substrate with a cell transistor formed thereon(S400); depositing a dielectric layer above the semiconductor substrate comprising the first metal and partially etching the dielectric layer to form a via contact hole which exposes the first metal(S402); injecting a process gas to form a barrier layer within the via contact hole, wherein the process gas is injected by several times with progressively increased amount(S404,406,408); filling a conductive material within a via contact hole comprising the barrier layer to form a via contact(S410); and forming a second metal above the via contact(S412). The process gas is a nitrogen gas to form a titanium nitride layer above titanium.

    Abstract translation: 提供了一种用于制造半导体器件的方法，以防止晶片损耗并减少不期望的设备停机时间，同时通过逐渐增加注入的气体的量来最小化形成由钛层和氮化钛层形成期间突然的压力变化引起的涡流的形成 进入处理室。 一种制造半导体器件的方法包括以下步骤：在其上形成有单元晶体管的半导体衬底上形成第一金属（S400）; 在包括所述第一金属的所述半导体衬底之上沉积介电层并且部分地蚀刻所述电介质层以形成暴露所述第一金属的通孔接触孔（S402）; 注入工艺气体以在通孔接触孔内形成阻挡层，其中工艺气体以逐渐增加的量注入数次（S404,406,408）; 在包括所述阻挡层的通孔接触孔内填充导电材料以形成通孔接触（S410）; 以及在所述通孔接触件上方形成第二金属（S412）。 处理气体是氮气，以在钛上形成氮化钛层。

    웨이퍼 에지 식각 장치
    6.
    发明公开
    웨이퍼 에지 식각 장치 无效
    蚀刻边缘边缘的装置

    公开(公告)号：KR1020070113778A

    公开(公告)日：2007-11-29

    申请号：KR1020060047506

    申请日：2006-05-26

    Applicant: 삼성전자주식회사

    Inventor： 강태우 ,  송세훈 ,  임장빈

    IPC: H01L21/306

    CPC classification number: H01L21/67069 ,  G03F7/2028

    Abstract: An apparatus for etching the edge of a wafer is provided to prevent a wafer and a stage from being attached to each other by static electricity and so forth by reducing the contact area between the wafer and the stage. An etching gas supply part supplies an etching gas to the inside of a process chamber(110). A wafer stage(120) includes a stage body(122) disposed in the chamber and a plurality of support members with a pin shape formed on the upper surface of the stage body. The support members support the wafer while the wafer is separated from the stage body. From the etching gas, a shield part(150) shields the center part of the wafer supported on the wafer stage except the edge of the wafer. RF power is applied to a lower electrode(140) disposed along the circumference of the wafer stage. An upper electrode(160) is disposed on the chamber to confront the lower electrode. Lift pins(144) penetrate the stage and transfer vertically so that the wafer is moved up/down with respect to the stage.

    Abstract translation: 提供一种用于蚀刻晶片边缘的装置，以通过减小晶片和台架之间的接触面积来防止晶片和平台通过静电等彼此附接。 蚀刻气体供给部将蚀刻气体供给到处理室（110）的内部。 晶片台（120）包括设置在腔室中的台体（122）和形成在台体上表面上的销形状的多个支撑构件。 支撑构件在晶片与载物台分离的同时支撑晶片。 从蚀刻气体中，屏蔽部分（150）屏蔽除晶片边缘外的晶片载台上的晶片的中心部分。 RF功率被施加到沿着晶片台的圆周设置的下电极（140）。 上电极（160）设置在腔室上以面对下电极。 提升销（144）穿透平台并垂直移动，使晶片相对于平台上下移动。

    챔버 커버 탈착 장치
    10.
    发明公开
    챔버 커버 탈착 장치 无效
    用于连接或拆卸舱室盖的装置

    公开(公告)号：KR1020080005662A

    公开(公告)日：2008-01-15

    申请号：KR1020060064263

    申请日：2006-07-10

    Applicant: 삼성전자주식회사

    Inventor： 강태우 ,  임장빈 ,  배종환 ,  이병삼 ,  김대운

    IPC: H01L21/02

    CPC classification number: H01L21/02 ,  H01L21/6719 ,  H01L21/67201

    Abstract: An apparatus for attaching or detaching a cover of a chamber is provided to prevent a shower head attached to a bottom surface of the cover from being damaged by preventing the cover and a container body from being collided with each other at the time of attaching or detaching the cover. An apparatus(100) for attaching or detaching a cover(14) of a chamber includes a supporting unit(110) and a driving unit(120). The supporting unit is attached to the cover attachable to or detachable from a container body(12). The supporting unit is attached to the container body. The driving unit linearly moves the supporting unit so as to attach or detach the cover to or from the container body. Plural driving units are arranged along the circumference of the container body at a predetermined interval. The supporting unit is projected to the outside of the cover. The supporting unit and the driving unit are attachable or detachable.

    Abstract translation: 提供一种用于安装或拆卸室的盖子的装置，以防止在安装或拆卸时防止盖子和容器主体相互碰撞而附着在盖的底表面上的淋浴头被损坏 封面。 用于安装或拆卸腔室的盖子（14）的装置（100）包括支撑单元（110）和驱动单元（120）。 支撑单元附接到可附接到容器主体（12）上或从容器主体（12）拆卸的盖子。 支撑单元附接到容器主体。 驱动单元直线地移动支撑单元，以将盖与容器主体相连或者分离。 多个驱动单元以预定间隔沿容器主体的圆周布置。 支撑单元投影到盖的外侧。 支撑单元和驱动单元是可附接或可拆卸的。

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