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公开(公告)号:KR101608902B1
公开(公告)日:2016-04-05
申请号:KR1020090109152
申请日:2009-11-12
Applicant: 삼성전자주식회사
IPC: H01L21/762
CPC classification number: H01L21/823481 , H01L21/76229 , H01L21/823425
Abstract: 반도체소자및 그제조방법을제공한다. 반도체소자는반도체기판내에형성되어활성영역을정의하는트렌치, 트렌치내에형성된매립절연막, 매립절연막과트렌치사이에형성된산화막, 산화막과매립절연막사이에형성된질화막및 산화막과질화막사이에형성된배리어막을포함하는소자분리구조물을갖는다.
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公开(公告)号:KR101718981B1
公开(公告)日:2017-03-23
申请号:KR1020100062512
申请日:2010-06-30
Applicant: 삼성전자주식회사
IPC: H01L29/78 , H01L21/336
CPC classification number: H01L27/088 , H01L23/535 , H01L27/0207 , H01L29/0649 , H01L29/0847 , H01L29/42376 , H01L29/4238 , H01L29/4933 , H01L29/7833
Abstract: 콘택플러그를포함하는반도체소자들을제공한다. 일실시예에따르면, 게이트전극이활성영역상부에배치되고, 층간유전막이기판상에배치될수 있다. 게이트-콘택플러그가층간유전막을관통하여게이트전극에접촉된다. 게이트-콘택플러그의적어도일부가활성영역과중첩될수 있다.
Abstract translation: 提供了一种包括接触插塞的半导体器件。 根据一个实施例,栅电极设置在有源区之上并且可以设置在作为层间电介质膜的板上。 栅极接触插塞穿透层间介电膜并接触栅电极。 栅极接触插塞的至少一部分可以与有源区重叠。
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公开(公告)号:KR1020120001897A
公开(公告)日:2012-01-05
申请号:KR1020100062512
申请日:2010-06-30
Applicant: 삼성전자주식회사
IPC: H01L29/78 , H01L21/336
CPC classification number: H01L27/088 , H01L23/535 , H01L27/0207 , H01L29/0649 , H01L29/0847 , H01L29/42376 , H01L29/4238 , H01L29/4933 , H01L29/7833 , H01L29/4232
Abstract: PURPOSE: A semiconductor device including a contact plug is provided to obtain high reliability and integration by increasing an amount of turn-on currents of a field effect transistor by widening an active area. CONSTITUTION: A device isolation pattern(102) is arranged on a substrate to define an active area(ACT). A gate electrode(110) is arranged on the upper side of the active area. A capping dielectric pattern is arranged on the gate electrode. A first source/drain area(122) and a second source/drain area(124) are formed in the active area of both sides of the gate electrode. An interlayer dielectric layer(130) is arranged on the substrate including the gate electrode.
Abstract translation: 目的:提供一种包括接触插头的半导体器件,通过增加有源区域来增加场效应晶体管的导通电流量,从而获得高可靠性和集成度。 构成:器件隔离图案(102)布置在衬底上以限定有源区(ACT)。 栅电极(110)设置在有源区的上侧。 在栅极电极上设置覆盖电介质图案。 在栅电极的两侧的有源区域中形成有第一源极/漏极区域(122)和第二源极/漏极区域(124)。 在包括栅电极的基板上布置有层间绝缘层(130)。
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公开(公告)号:KR1020110052206A
公开(公告)日:2011-05-18
申请号:KR1020090109152
申请日:2009-11-12
Applicant: 삼성전자주식회사
IPC: H01L21/762
CPC classification number: H01L21/823481 , H01L21/76229 , H01L21/823425
Abstract: PURPOSE: A semiconductor device with a device separating structure is provided to suppress holes from being induced into an active area by thermal electrons trapped in a nitride film pattern, thereby preventing the leaked currents of a PMOS transistor from increasing. CONSTITUTION: A semiconductor substrate(100) comprises a trench(103) defining active areas. A buried insulating film(142) is formed in the trench. An oxide film is formed between the buried insulating film and the trench. A nitride film is formed between the oxide film and the buried insulating film. A barrier film is formed between the oxide film and the nitride film.
Abstract translation: 目的:提供一种具有器件分离结构的半导体器件,以通过捕获在氮化物膜图案中的热电子来抑制空穴被诱发到有源区域,从而防止PMOS晶体管的泄漏电流增加。 构成:半导体衬底(100)包括限定有源区的沟槽(103)。 在沟槽中形成掩埋绝缘膜(142)。 在掩埋绝缘膜和沟槽之间形成氧化膜。 在氧化膜和掩埋绝缘膜之间形成氮化膜。 在氧化膜和氮化物膜之间形成阻挡膜。
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公开(公告)号:KR101649965B1
公开(公告)日:2016-08-24
申请号:KR1020100013873
申请日:2010-02-16
Applicant: 삼성전자주식회사
IPC: H01L21/8242 , H01L27/108
CPC classification number: H01L27/105 , H01L21/823437 , H01L21/823481 , H01L27/1052 , H01L27/10829 , H01L27/10876 , H01L27/10894 , H01L27/10897
Abstract: 반도체소자를제공한다. 반도체소자는기판에일 방향으로연장하는액티브패턴을한정하는소자분리패턴및 질화라이너를포함하는필드패턴, 액티브패턴및 필드패턴의경계부위에기판표면으로부터하방으로매립된구조로형성되며액티브패턴의연장방향으로연장하는삽입패턴및 기판상에형성되는트랜지스터를포함한다. 이때, 삽입패턴의일 측면은소자분리패턴과접하며, 타측면은액티브패턴에접할수 있다.
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公开(公告)号:KR1020130109821A
公开(公告)日:2013-10-08
申请号:KR1020120031870
申请日:2012-03-28
Applicant: 삼성전자주식회사
IPC: H01L27/115 , H01L21/8247
CPC classification number: H01L29/7831 , G11C11/403 , G11C11/40615 , G11C11/4097 , G11C2207/2227 , H01L27/105 , H01L27/115 , H01L27/11521 , H01L21/28273
Abstract: PURPOSE: A semiconductor memory device has improved data retention characteristics by preventing junction leakage and/or recombination caused by PN junction. CONSTITUTION: A write transistor (WTr) includes a first write gate (WG1) controlling first source and drain terminals and a second write gate (WG2) controlling a channel region. The first write gate has a first work function. The second write gate has a second work function different from the first work function. The first source and drain terminals of the write transistor do not have PN junction. A read transistor (RTr) includes a memory node gate (MNG) connected to the first source and drain terminals of the write transistor. The memory node gate is arranged between a control gate (RCG) and the channel region of the read transistor.
Abstract translation: 目的:半导体存储器件通过防止由PN结引起的结漏电和/或复合,具有改善的数据保留特性。 构成:写入晶体管(WTr)包括控制第一源极和漏极端子的第一写入栅极(WG1)和控制沟道区域的第二写入栅极(WG2)。 第一个写入口具有第一个工作功能。 第二写入门具有与第一功能不同的第二功能。 写入晶体管的第一个源极和漏极端子没有PN结。 读取晶体管(RTr)包括连接到写入晶体管的第一源极和漏极端子的存储器节点栅极(MNG)。 存储节点门被布置在控制栅(RCG)和读晶体管的沟道区之间。
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公开(公告)号:KR1020110094476A
公开(公告)日:2011-08-24
申请号:KR1020100013873
申请日:2010-02-16
Applicant: 삼성전자주식회사
IPC: H01L21/8242 , H01L27/108
CPC classification number: H01L27/105 , H01L21/823437 , H01L21/823481 , H01L27/1052 , H01L27/10829 , H01L27/10876 , H01L27/10894 , H01L27/10897
Abstract: PURPOSE: A semiconductor device is provided to suppress HEIP(Hot Electron Induced Punch-through) characteristic deterioration by forming an insertion pattern removing adjacent nitride linear to a gate electrode. CONSTITUTION: In a semiconductor device, a substrate comprises a cell area and a peripheral area. The cell region comprises a cell active pattern(CA) and a cell filed pattern(CF). The peripheral area comprises a peripheral cell region and a peripheral filed pattern. A first transistor(TR 1) is formed in the cell region. An insertion pattern(IP) is recessed from the surface of the substrate.
Abstract translation: 目的:提供一种半导体器件,用于通过形成去除与栅电极线性相邻的氮化物的插入图案来抑制HEIP(热电子诱发穿通)特性劣化。 构成:在半导体器件中,衬底包括电池区域和周边区域。 小区区域包括小区活动模式(CA)和小区归属模式(CF)。 外围区域包括外围单元区域和外围区域图案。 在单元区域中形成第一晶体管(TR 1)。 插入图案(IP)从衬底的表面凹陷。
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公开(公告)号:KR101944535B1
公开(公告)日:2019-01-31
申请号:KR1020120031870
申请日:2012-03-28
Applicant: 삼성전자주식회사
IPC: H01L27/115 , H01L21/8247
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公开(公告)号:KR1020170099444A
公开(公告)日:2017-09-01
申请号:KR1020160021242
申请日:2016-02-23
Applicant: 삼성전자주식회사
IPC: H01L21/762 , H01L21/02
CPC classification number: H01L29/7827 , H01L28/00 , H01L29/045 , H01L29/4236
Abstract: 반도체장치가제공된다. 반도체장치는트렌치를포함하는반도체기판및 상기트렌칭를덮는절연막을포함한다. 상기반도체기판은결정구조를가지며, 상기트렌치는상기결정구조의 {320} 면을갖는내측벽을포함한다.
Abstract translation: 提供了一种半导体器件。 该半导体器件包括具有沟槽和覆盖该沟槽的绝缘膜的半导体衬底。 半导体衬底具有晶体结构,并且沟槽包括具有晶体结构的{320}面的内壁。
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公开(公告)号:KR1020150117770A
公开(公告)日:2015-10-21
申请号:KR1020140043151
申请日:2014-04-10
Applicant: 삼성전자주식회사
IPC: H01L21/336 , H01L21/316 , H01L29/78
CPC classification number: H01L21/28282 , H01L21/02164 , H01L21/0228 , H01L21/76229
Abstract: 반도체소자및 그제조방법이제공된다. 반도체소자의제조방법은기판상에트렌치를형성하는것; 상기트렌치내에제1 산화막을형성하는것; 상기제1 산화막상에제2 산화막을형성하되, 상기제2 산화막은상기제1 산화막보다치밀한것; 상기제2 산화막상에제3 산화막을형성하는것; 및상기제3 산화막상에제공되며, 상기트렌치를채우는절연패턴을형성하는것을포함할수 있다.
Abstract translation: 提供半导体器件及其制造方法。 半导体器件的制造方法包括以下步骤:在衬底上形成沟槽; 在沟槽中形成第一氧化膜; 在所述第一氧化物膜上形成第二氧化物膜,其中所述第二氧化物膜比所述第一氧化物膜更致密; 在所述第二氧化物膜上形成第三氧化物膜; 以及提供提供给第三氧化膜的绝缘图案,其中沟槽填充有绝缘图案。
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