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公开(公告)号:KR1020150038808A
公开(公告)日:2015-04-09
申请号:KR1020130116462
申请日:2013-09-30
Applicant: 삼성전자주식회사
IPC: H01L27/108 , H01L21/8242
CPC classification number: H01L28/75 , H01L27/10855 , H01L28/65 , H01L28/91
Abstract: 반도체장치및 그제조방법이제공된다. 상기반도체장치는, 기판, 상기기판상에형성된하부전극, 상기하부전극상에형성된유전막, 상기유전막상에형성된접착막, 및상기접착막상에형성된상부전극을포함하되, 상기접착막은상기유전막과상기상부전극에접촉하고, 도전성물질을포함한다.
Abstract translation: 提供一种半导体器件及其制造方法。 半导体器件包括衬底; 形成在所述基板上的下电极; 形成在下电极上的电介质膜; 形成在电介质膜上的粘合膜; 以及形成在所述粘合膜上的上电极,其中所述粘合膜附着到所述电介质膜和所述上电极,并且包含导电材料。
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公开(公告)号:KR1020150031380A
公开(公告)日:2015-03-24
申请号:KR1020130110644
申请日:2013-09-13
Applicant: 삼성전자주식회사
IPC: H01L27/108 , H01L21/8242
CPC classification number: H01L28/65 , H01L27/10852 , H01L28/90
Abstract: A semiconductor memory device includes a lower electrode including a precious metal and a conductive precious metal oxide; a dielectric membrane placed on the lower electrode and including a titanium oxide; a protective insulating membrane placed on the dielectric membrane and including a tantalum oxide; and an upper electrode placed on the protective insulating membrane. The purpose of the present invention is to provide a semiconductor device including a capacitor having excellent reliability, and a manufacturing method thereof.
Abstract translation: 半导体存储器件包括:包含贵金属和导电贵金属氧化物的下电极; 介电膜放置在下电极上并包含氧化钛; 保护绝缘膜,放置在电介质膜上并包括氧化钽; 和放置在保护绝缘膜上的上电极。 本发明的目的是提供一种包括具有优异可靠性的电容器的半导体器件及其制造方法。
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公开(公告)号:KR101934037B1
公开(公告)日:2018-12-31
申请号:KR1020120132422
申请日:2012-11-21
Applicant: 삼성전자주식회사
IPC: H01L27/108 , H01L21/8242
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公开(公告)号:KR1020140065186A
公开(公告)日:2014-05-29
申请号:KR1020120132422
申请日:2012-11-21
Applicant: 삼성전자주식회사
IPC: H01L27/108 , H01L21/8242
CPC classification number: H01L28/60 , H01L27/10852 , H01L28/87 , H01L28/91
Abstract: A plurality of lower electrodes are arranged on a substrate. A first and a second supporter are formed between the lower electrodes. An upper electrode is formed on the lower electrodes. A capacitor dielectric layer is arranged between the lower electrodes and the upper electrode. The first supporter has a first element, a second element, and oxygen (O). The adhesion property of the oxide of the first element to the lower electrodes is better than the second supporter. The band gap energy of the oxide of the second element is higher than the oxide of the first element.
Abstract translation: 多个下电极设置在基板上。 第一和第二支撑件形成在下电极之间。 上电极形成在下电极上。 在下电极和上电极之间设置有电容器电介质层。 第一支持物具有第一元素,第二元素和氧(O)。 第一元件的氧化物与下电极的粘合性优于第二支持体。 第二元素的氧化物的带隙能量高于第一元素的氧化物。
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