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公开(公告)号：KR1020120140096A
公开(公告)日：2012-12-28
申请号：KR1020110059756
申请日：2011-06-20
Applicant: 삼성전자주식회사
CPC classification number: H05K3/0097 , H05K3/007 , H05K2203/0169
Abstract: PURPOSE: A working panel and a working panel set comprising an array board pattern are provided to increase the output number of patterns by arranging the patterns on a damaged region of a working panel. CONSTITUTION: A first array board pattern(110) comprises a first unit board pattern. First and second guide bar patterns(111,112) are formed to face each other. The first unit board pattern is located between the first and second guide bar patterns. A second array board pattern(120) comprises a second unit board pattern. The second unit board pattern is located between third and fourth guide bar patterns. [Reference numerals] (A1,A2,A3) M in number; (B1,B2,B3) N in number
Abstract translation: 目的：提供一种工作面板和包括阵列板图形的工作面板组，以通过将图案布置在工作面板的损坏区域上来增加图案的输出数量。 构成：第一阵列板图案（110）包括第一单元板图案。 第一和第二导杆图案（111,112）形成为彼此面对。 第一单元板图案位于第一和第二导杆图案之间。 第二阵列板图案（120）包括第二单元板图案。 第二单元板图案位于第三和第四导杆图案之间。 （A1，A2，A3）M数字; （B1，B2，B3）N
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公开(公告)号：KR101055487B1
公开(公告)日：2011-08-08
申请号：KR1020090041277
申请日：2009-05-12
CPC classification number: H01L2224/48227 , H01L2924/15311 , H01L2924/15331
Abstract: 본 발명은 리지드-플렉시블 스택 모듈기판 및 그 제조방법에 관한 것으로, 일면에 제1 단자부가 형성된 플렉시블 기판의 타면에 제1 리지드 기판이 적층된 제1 리지드부, 상기 제1 리지드부의 상기 플렉시블 기판이 연장되어 형성되되, 그 일면에 제2 단자부가 형성된 플렉시블부, 및 상기 플렉시블부의 상기 플렉시블 기판이 연장되어 형성되되, 그 타면에 제2 리지드 기판이 적층된 제2 리지드부를 포함하고, 상기 플렉시블부는 상기 플렉시블부의 타면이 상기 제1 리지드부의 최외층에 부착되도록 상기 제1 리지드부를 감싸는 형태로 접혀 있고, 상기 플렉시블부와 연결된 제2 리지드부는 상기 제1 리지드부와 적층된 구조를 갖는 것을 특징으로 하며, 플렉시블 기판을 이용한 간단화 구조에 의해 초고용량화를 달성할 수 있는 리지드-플렉시블 스택 모듈기판 및 그 제조방법을 제공한다.
리지드, 플렉시블, 리지드부, 플렉시블부, 스택, 단자부-
公开(公告)号：KR1020100122301A
公开(公告)日：2010-11-22
申请号：KR1020090041277
申请日：2009-05-12
CPC classification number: H01L2224/48227 , H01L2924/15311 , H01L2924/15331
Abstract: PURPOSE: By using the rigid flexible substrate, the rigid flexible stack module substrate and manufacturing method thereof form the structure in which the first rigid part and the second rigid part are laminated. CONSTITUTION: The flexible substrate divided by the first rigid region and the second rigid region is prepared. The rigid substrate(132) is laminated in the single-side of the flexible substrate. The first outer layer circuit layer(160a) including the second terminal(164) is formed in the other side of the flexible substrate.
Abstract translation: 目的：通过使用刚性柔性基板，刚性柔性叠层模块基板及其制造方法形成第一刚性部分和第二刚性部分层压的结构。 构成：制备由第一刚性区域和第二刚性区域划分的柔性基板。 刚性基板（132）层压在柔性基板的单面中。 包括第二端子（164）的第一外层电路层（160a）形成在柔性基板的另一侧。
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公开(公告)号：KR1020050062826A
公开(公告)日：2005-06-28
申请号：KR1020030093130
申请日：2003-12-18
Applicant: 삼성전자주식회사
IPC: H05K1/02
CPC classification number: H01R12/722 , H05K1/0268
Abstract: 본 발명은 외부 접촉 탭에 구멍이 형성된 인쇄 회로 기판에 관한 것으로서, 인쇄 회로 기판을 테스트 소켓에 삽입하여 테스트할 때 외부 접촉 탭과 소켓 리드 사이의 접촉 불량에 따른 문제를 해결하기 위한 것이다. 본 발명의 인쇄 회로 기판은 한쪽 가장자리에 일렬로 배열된 복수개의 외부 접촉 탭을 포함하며, 각각의 외부 접촉 탭은 원형의 접촉 구멍을 포함한다. 접촉 구멍은 소켓 리드와 원형 접촉을 이루므로 기존의 점 접촉에 비하여 접촉 면적이 증가하고 밀착성이 높아져 전기적 접촉성이 향상된다. 따라서, 재테스트 비율이 현저하게 줄어들며 생산 시간이 단축되는 효과가 있다.
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公开(公告)号：KR1020070111886A
公开(公告)日：2007-11-22
申请号：KR1020060045279
申请日：2006-05-19
Applicant: 삼성전자주식회사
CPC classification number: H05K1/185 , H05K3/3436 , H05K3/3452 , H05K3/4697
Abstract: A printed circuit board for surface mount and a method for forming the same are provided to increase a degree of integration by arranging a part or the whole of a passive element to be covered with a semiconductor package. A printed circuit board for surface mount includes a passive element(150) and a semiconductor package(160). The passive element is buried in a printed circuit board(110) and is protruded from an upper part of the printed circuit board. The semiconductor package is mounted on an upper part of the printed circuit board. A part or an entire part of the passive element is overlapped with the semiconductor package. The semiconductor package is mounted on the printed circuit board by solder balls(165). The passive element is buried in a non-penetrating hole(120) of the printed circuit board.
Abstract translation: 提供了一种用于表面贴装的印刷电路板及其形成方法，以通过将半导体封装件覆盖的无源元件的一部分或全部布置来增加集成度。 用于表面贴装的印刷电路板包括无源元件（150）和半导体封装（160）。 无源元件被埋在印刷电路板（110）中并且从印刷电路板的上部突出。 半导体封装安装在印刷电路板的上部。 无源元件的一部分或全部与半导体封装重叠。 半导体封装通过焊球（165）安装在印刷电路板上。 无源元件被埋在印刷电路板的非穿透孔（120）中。
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Patent Agency Ranking
公开(公告)号：KR1020060132247A
公开(公告)日：2006-12-21
申请号：KR1020050052485
申请日：2005-06-17
Applicant: 삼성전자주식회사
CPC classification number: H05K3/244 , H01L2924/0002 , H05K3/243 , H05K3/28 , H05K3/282 , H05K3/427 , H05K2201/0391 , H05K2203/0574 , H01L2924/00
Abstract: A semiconductor apparatus with an improved reliability and a method for manufacturing the same are provided to suppress a crack in a temperature cycle according to a temperature variation by treating a pad surface of a printed circuit board with an OSP process and forming a nickel and gold plating layer on a lateral side of a through hole. In a semiconductor apparatus with an enhanced reliability, a printed circuit board(142) includes a pad formed on a surface of an insulation material and a through hole(150) penetrating the insulation material up and down. A surface of the pad of the printed circuit board(142) is treated with an OSP(Organic Solderability Preservative) process and a lateral side of the through hole(150) is treated with a gold plating. A semiconductor element is mounted on an upper side of the printed circuit board(142) though the pad.
Abstract translation: 提供一种可靠性提高的半导体装置及其制造方法，用于通过用OSP工艺处理印刷电路板的焊盘表面以形成镍和镀金电镀来根据温度变化来抑制温度循环中的裂纹 层在通孔的侧面上。 在具有增强的可靠性的半导体装置中，印刷电路板（142）包括形成在绝缘材料的表面上的焊盘和上下穿透绝缘材料的通孔（150）。 用OSP（有机可焊性防腐剂）处理印刷电路板（142）的焊盘的表面，并用镀金处理通孔（150）的侧面。 半导体元件通过焊盘安装在印刷电路板（142）的上侧。
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公开(公告)号：KR1020040058417A
公开(公告)日：2004-07-05
申请号：KR1020020084247
申请日：2002-12-26
Applicant: 삼성전자주식회사
IPC: H05K1/18
CPC classification number: H01R13/10 , H05K1/181 , H05K2201/10159
Abstract: PURPOSE: A PCB for memory module and a socket for mounting the same are provided to minimize the size of the memory module by forming connectors at both edges of board main body. CONSTITUTION: A PCB for memory module(100) comprises a board main body(110), a plurality of memory chip(112) pad groups, and connectors(116). The memory chip pad groups are arranged on a plate surface of the main body and formed of pads corresponding to a plurality of semiconductor memory chips having a plurality of lead wires. The connectors are formed in a lengthwise direction along the both corner edges of the board main body. The connectors are formed with a tap.
Abstract translation: 目的：提供用于存储器模块的PCB和用于安装其的插座，以通过在板主体的两个边缘处形成连接器来最小化存储器模块的尺寸。 构成：用于存储器模块（100）的PCB包括板主体（110），多个存储芯片（112）焊盘组和连接器（116）。 存储芯片焊盘组布置在主体的板表面上，并且由对应于具有多根引线的多个半导体存储器芯片的焊盘构成。 连接器沿着板主体的两个角部边缘的长度方向形成。 连接器用龙头形成。
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公开(公告)号：KR1020080073506A
公开(公告)日：2008-08-11
申请号：KR1020070012206
申请日：2007-02-06
Applicant: 삼성전자주식회사
IPC: H01L23/02 , H01L27/108 , H05K1/02
CPC classification number: H05K1/0207 , H05K1/056 , H05K3/4641 , H05K2201/0919 , H05K2201/10159 , H05K2201/1056 , H05K2203/1572
Abstract: A printed circuit board and a semiconductor memory module using the same are provided to effectively radiate heat from the semiconductor memory module to the outside by applying a PCB(Printed Circuit Board) with a metal core on the semiconductor memory module. A printed circuit board includes a board unit(110) and a metal core(130). The board unit includes first and second surfaces, which are opposed to each other. The metal core includes an insertion portion(130i) and an elongation portion(130e). The insertion portion is inserted into an inner portion of the board unit. The elongation portion is elongated from at least one side portion of the board unit. The elongation portions of a pair of metal cores are elongated from both sides of the board unit, respectively. The metal core contains a thermally conductive material, which is selected from the group consisting of aluminum, copper, silver, and gold.
Abstract translation: 提供一种印刷电路板和使用其的半导体存储器模块，以通过在半导体存储器模块上施加具有金属芯的PCB（印刷电路板）来有效地将热量从半导体存储器模块辐射到外部。 印刷电路板包括板单元（110）和金属芯（130）。 板单元包括彼此相对的第一和第二表面。 金属芯包括插入部（130i）和伸长部（130e）。 插入部插入到板单元的内部。 伸长部分从板单元的至少一个侧部伸长。 一对金属芯的伸长部分分别从板单元的两侧伸长。 金属芯包含导热材料，其选自铝，铜，银和金。
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公开(公告)号：KR1020080061719A
公开(公告)日：2008-07-03
申请号：KR1020060136734
申请日：2006-12-28
Applicant: 삼성전자주식회사
IPC: H01G4/30
Abstract: A method of manufacturing a capacitor for a semiconductor device and a capacitor using the same are provided to improve contact between molten solder and external electrodes by forming OSP(Organic Solderability Preservation) coating films on copper electrodes of a laminate of dielectric sheets. A method of manufacturing a capacitor for a semiconductor device includes the steps of: forming a laminate of a plurality of dielectric sheets on which internal electrodes are printed(S20); forming external electrodes on side surfaces of the laminate to be electrically connected to the internal electrodes(S40); and forming OSP coating films on the external electrodes to prevent oxidation of the external electrodes(S50). The external electrode contains copper, and the OSP coating film contains alkylbenzimidazole.
Abstract translation: 提供一种制造用于半导体器件的电容器和使用其的电容器的方法，以通过在电介质片层叠体的铜电极上形成OSP（有机可焊性保存）涂层来改善熔融焊料和外部电极之间的接触。 制造半导体器件的电容器的方法包括以下步骤：形成印刷有内部电极的多个电介质片材的层叠体（S20）。 在所述层叠体的侧面形成外部电极以与所述内部电极电连接（S40）; 并在外部电极上形成OSP涂层以防止外部电极氧化（S50）。 外部电极含有铜，OSP涂膜含有烷基苯并咪唑。
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公开(公告)号：KR1020070062079A
公开(公告)日：2007-06-15
申请号：KR1020050121785
申请日：2005-12-12
Applicant: 삼성전자주식회사
CPC classification number: H05K3/1216 , H05K1/0266 , H05K3/18 , H05K3/281
Abstract: A printed circuit board having a position aligning mark and a manufacturing method thereof are provided to perform uniform solder printing by not protruding the position aligning mark from a photosensitive insulation layer. A metal circuit wiring is formed on at least one surface of a printed circuit board. A photosensitive insulation layer is formed on the metal circuit pattern. A position aligning mark(29) encloses a side of the photosensitive insulation layer, and an upper surface of the position aligning mark is exposed at a position lower than a height of the photosensitive insulation layer to guide a mounting position of an electronic component. The position aligning mark is a plating layer.
Abstract translation: 提供具有位置对准标记的印刷电路板及其制造方法，以通过不从光敏绝缘层突出位置对准标记来进行均匀的焊料印刷。 在印刷电路板的至少一个表面上形成金属电路布线。 在金属电路图案上形成感光绝缘层。 位置对准标记（29）包围光敏绝缘层的一侧，并且位置对准标记的上表面在比感光绝缘层的高度低的位置处露出，以引导电子部件的安装位置。 位置对准标记是镀层。
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