Abstract:
PURPOSE: A supporting wafer for a semiconductor light emitting device, a manufacturing method thereof, and a method for manufacturing a vertical semiconductor light emitting device are provided to form a metal oxide film on a side of a wafer, thereby protecting the supporting wafer from chemical materials. CONSTITUTION: A supporting wafer(110) is prepared. The supporting wafer is made of an alloy of a semiconductor material and metal. A metal oxide film(112) is formed on a side of the supporting wafer. The metal oxide film is formed by anodizing an alloy ingot of the semiconductor material and metal.
Abstract:
PURPOSE: A semiconductor light emitting device is provided to improve design freedom of a chip and to enhance reliability by simplifying connecting and wiring types of each unit LED cell. CONSTITUTION: A plurality of light emitting structures(10) is arranged on a conductive substrate(11). The plurality of light emitting structures comprises a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer which is arranged between the first conductive semiconductor layer and the second conductive semiconductor layer. An insulating layer is formed between the light emitting structures. First and second external connecting terminals(A,B) are connected to the corresponding conductive semiconductor layer of the light emitting structure, respectively.
Abstract:
PURPOSE: A semiconductor light emitting device is provided to offer high electric current dispersion efficiency in a large area by decentralizing a plurality of contact holes into a proper location. CONSTITUTION: A semiconductor laminate(15) is divided into a first region and a second region by a separation groove. The semiconductor laminate comprises first and second major surfaces which face each other. The semiconductor laminate comprises first and second electrical conduction semiconductor layers(15a,15c) which provide the first and second major surfaces and an active layer(15b) which is formed between the first and second electrical conduction semiconductor layers. At least one or more contact holes(H) are connected to one region of the first electrical conduction semiconductor layer after passing through the active layer from the first and second major surfaces. A first electrode(12) is connected to the first electrical conduction semiconductor layer through the one or more contact holes. A second electrode(14) is connected to the second electrical conduction semiconductor layer. An electrode connecting part(17) interlinks the second electrode and the first electrical conduction semiconductor layer.
Abstract:
본 발명은 표면 플라스몬 공명을 이용하여 발광 효율이 향상될 수 있는 질화물 반도체 발광소자 및 그 제조방법에 관한 것으로, 본 발명의 질화물 반도체 발광소자는, n형 질화물 반도체층; 상기 n형 질화물 반도체층 상에 형성된 활성층; 상기 활성층 상에 형성되며, 상면에 요철 구조를 갖는 p형 질화물 반도체층; 및 표면 플라스몬이 상기 활성층에서 발광된 광과 상호 커플링되도록 상기 요철 구조의 오목면 상에 형성된 플라스몬 발생층;을 포함한다.
Abstract:
PURPOSE: A vertical structure semiconductor light emitting device and a manufacturing method thereof are provided to improve luminous efficiency and electrostatic withstanding voltage by efficiently spreading currents between an n type electrode and a p type electrode. CONSTITUTION: A light emitting structure includes a p type semiconductor layer, an active layer, and an n type semiconductor layer which are successively laminated on a conductive substrate. An n type electrode(106) is formed on the upper side of the n type semiconductor layer. The n type semiconductor layer is made of hetero materials. The n type semiconductor layer includes a current blocking region(107) which induces a current flowing between the n type electrode and the conductive substrate in a lateral direction. A high reflective ohmic contact layer(104) is formed between a p type semiconductor layer and a conductive substrate.
Abstract:
본 발명은 반도체 발광소자 및 그 제조방법에 관한 것으로, 보다 구체적으로는 제 1 도전형 반도체층, 활성층, 제 2 도전형 반도체층, 제 2 전극층, 절연층, 도전성 기판이 순차 적층된 반도체 발광소자로서, 상기 도전성 기판은 상기 제 1 도전형 반도체층에 전기적으로 접속하기 위하여, 상기 제 2 도전형 반도체층 및 활성층과는 전기적으로 절연되어 상기 도전성 기판의 일면으로부터 제 1 도전형 반도체층의 일부 영역까지 연장된 하나 이상의 콘택 홀을 포함하고, 상기 제 2 전극층은 상기 제 2 도전형 반도체층과의 계면 중 일부가 노출된 영역을 포함하고, 상기 노출 영역에는 식각 저지층이 형성되는 것을 특징으로 하는 반도체 발광소자에 관한 것이다. 본 발명에 따른 반도체 발광소자는 최대 발광면적을 확보하여 발광효율을 최대화하는 동시에 작은 면적의 전극으로 균일한 전류분산이 가능하며, 누설전류의 발생이 감소된다. 반도체 발광소자, 콘택 홀, 노출 영역, 식각 저지층, 전극 패드부
Abstract:
PURPOSE: A method for manufacturing a semiconductor light emitting device is provided to efficiently reduce the deviation of a chrominance index due to the thickness difference of a wavelength conversion layer by forming at least two wavelength conversion layers with different wavelength conversion material containing conditions. CONSTITUTION: A plurality of electrodes(16) are formed on a semiconductor laminate(15). Structures(17,18) with preset heights are formed on the plurality of electrodes. A wavelength conversion layer(19) is formed on the semiconductor laminate to cover the structure. The wavelength conversion layer includes a first layer(19a) and a second layer(19b). The first layer includes wavelength conversion materials(P) with relatively high density.