Abstract:
A FIREFET(Fin and Recess channel MOSFET) and a manufacturing method thereof are provided to improve a current driving performance of the FIREFET by reducing source and drain resistances. An active region is surrounded by a field oxide film on a semiconductor substrate. Source/drain(14,16) are formed on the active region with a fin-type channel between them. A recess hole is formed under the source/drain and the fin channel. A recess channel is formed under the fin channel at one side of the recess hole. Gate oxide films(80) are formed on a surface of the recess hole including the recess channel, side surfaces of the source/drain, and the fin channel. A gate(90a) surrounds the recess channel and the fin channel on the gate oxide film and is formed between the recess hole and the source/drain.
Abstract:
A semiconductor probe using an impact-ionization semiconductor device is provided to remarkably improve the limit of sensitivity of a resistive probe and easily adjust the quantity of charges capable of being detected by a probe by developing a new probe structure for easily adjusting the band energy of a source. One tilted surface of a probe is formed by an anisotropic etch process using a first etch mask pattern formed on a silicon substrate. After impurities are doped into the exposed substrate to form a first semiconductor electrode region(16), the first etch mask pattern is removed. A second etch mask pattern opposite to the direction of the first etch mask pattern is formed on the silicon substrate. Space layers are formed on the sidewalls of the second etch mask pattern. After the exposed silicon substrate is anisotropically etched to form an opposite tilted surface of the probe, the second etch mask pattern is removed. Impurities are doped into the exposed substrate to form a second semiconductor electrode region(18), and the second etch mask pattern is removed. A silicon oxide layer pattern is formed on the resultant structure by a known method. Space layers are formed on both sidewalls of the silicon oxide layer pattern. By using the space layer, a predetermined depth of the silicon substrate is etched by a photolithography process, and the space layer is removed. The first semiconductor electrode region can be a source terminal, and the second semiconductor electrode region can be a drain terminal.
Abstract:
A method of manufacturing an enhancement semiconductor probe and an information storage device using the same are provided to reduce a process variable in device performance and to increase reliability of mass production by anisotropic-wet-etching a silicon substrate using side-walls. A method of manufacturing an enhancement semiconductor probe comprises the steps of: forming a first etching mask pattern(110a) on a silicon substrate(100c) to form a tip part of the probe in a first direction and forming side-wall areas at two sides of the first etching mask pattern; anisotropic-etching the silicon substrate to form two inclined surfaces of the probe; forming source and drain areas(160,170,180,190) on the silicon substrate by injecting dopants, using the side-wall area as masks, and removing the side-wall areas; removing the first etching mask pattern; forming a second etching mask pattern to form a tip part of the probe in a second direction; forming space layers at two sides of the second etching mask pattern; and etching the silicon substrate by photographing and etching processes and removing the space layers.
Abstract:
본 발명은 핀과 리세스 혼합 채널 영역을 가진 전계효과트랜지스터 및 그 제조방법에 관한 것으로, 벌크 기판 위에 넓은 소스/드레인 면적과 자기 정렬형으로 구현된 핀 및 리세스 혼합 채널 MOSFET 구조를 가짐으로써, 전류 구동 능력을 근본적으로 향상시킨 새로운 FIREFET 소자 구조와 비교적 간단한 공정 방법으로 소스/드레인과 게이트 사이를 자기 정렬형으로 제조할 수 있는 상기 FIREFET 소자의 제조방법이 개시된다. 핀, 리세스, FinFET, MOSFET