수평 탄소 나노튜브를 구비하는 전자소자 및 그 제조 방법
    6.
    发明公开
    수평 탄소 나노튜브를 구비하는 전자소자 및 그 제조 방법 失效
    具有水平碳纳米管的电子元件及其制造方法

    公开(公告)号:KR1020020037409A

    公开(公告)日:2002-05-21

    申请号:KR1020000067337

    申请日:2000-11-14

    Abstract: PURPOSE: An electronic element having a horizontal carbon nanotube and manufacturing method thereof are provided to adjust the length of the carbon nanotube, enhance attachment of the carbon nanotube and a substrate, and facilitate subsequent processes after carbon nanotube formation. CONSTITUTION: An electronic element comprises an insulating film(21), a catalytic metal pattern(22), a carbon nanotube(23), and a protection insulating film(24). The catalytic metal pattern(22) is formed by depositing a metal film and selectively etching the insulating film(21). The carbon nanotube(23) is grown vertically to the catalytic metal pattern(22) by a thermal chemical deposition method and a plasma chemical deposition method. The protection insulating film(24) of SOG(silicon-on-glass) is formed over the whole structure. The protection insulating film(24) is selectively removed by lithography and etching and selectively etching the carbon nanotube to regulate the non-uniformly grown nanotube.

    Abstract translation: 目的:提供一种具有水平碳纳米管的电子元件及其制造方法,以调节碳纳米管的长度,增强碳纳米管和基底的附着,并促进碳纳米管形成后的后续工艺。 构成:电子元件包括绝缘膜(21),催化金属图案(22),碳纳米管(23)和保护绝缘膜(24)。 催化金属图案(22)通过沉积金属膜并选择性地蚀刻绝缘膜(21)而形成。 碳纳米管(23)通过热化学沉积法和等离子体化学沉积法垂直生长至催化金属图案(22)。 在整个结构上形成SOG(玻璃上硅)的保护绝缘膜(24)。 通过光刻和蚀刻选择性地去除保护绝缘膜(24),并选择性地蚀刻碳纳米管以调节不均匀生长的纳米管。

    수평 탄소 나노튜브를 구비하는 전자소자 및 그 제조 방법
    9.
    发明授权
    수평 탄소 나노튜브를 구비하는 전자소자 및 그 제조 방법 失效
    수평탄소나노튜브를구비하는전자소자및그제조방

    公开(公告)号:KR100373327B1

    公开(公告)日:2003-02-25

    申请号:KR1020000067337

    申请日:2000-11-14

    Abstract: PURPOSE: An electronic element having a horizontal carbon nanotube and manufacturing method thereof are provided to adjust the length of the carbon nanotube, enhance attachment of the carbon nanotube and a substrate, and facilitate subsequent processes after carbon nanotube formation. CONSTITUTION: An electronic element comprises an insulating film(21), a catalytic metal pattern(22), a carbon nanotube(23), and a protection insulating film(24). The catalytic metal pattern(22) is formed by depositing a metal film and selectively etching the insulating film(21). The carbon nanotube(23) is grown vertically to the catalytic metal pattern(22) by a thermal chemical deposition method and a plasma chemical deposition method. The protection insulating film(24) of SOG(silicon-on-glass) is formed over the whole structure. The protection insulating film(24) is selectively removed by lithography and etching and selectively etching the carbon nanotube to regulate the non-uniformly grown nanotube.

    Abstract translation: 一种具有水平碳纳米管的电子元件及其制造方法,用于调节碳纳米管的长度,提高碳纳米管与基板的附着性,并且有利于碳纳米管形成后的后续工艺。 构成:电子元件包括绝缘膜(21),催化金属图案(22),碳纳米管(23)和保护绝缘膜(24)。 催化金属图案(22)通过沉积金属膜并选择性蚀刻绝缘膜(21)而形成。 碳纳米管(23)通过热化学沉积法和等离子体化学沉积法垂直于催化金属图案(22)生长。 SOG(玻璃上硅)的保护绝缘膜(24)形成在整个结构上。 通过光刻和蚀刻选择性地去除保护绝缘膜(24),并选择性地蚀刻碳纳米管以调节不均匀生长的纳米管。

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