휘발성 니켈 아미노알콕사이드 화합물, 이의 제조 방법 및이를 이용한 니켈 박막의 형성 방법
    2.
    发明公开
    휘발성 니켈 아미노알콕사이드 화합물, 이의 제조 방법 및이를 이용한 니켈 박막의 형성 방법 有权
    挥发性镍类氨基氧化物复合物及其制备方法及使用其形成镍薄膜的方法

    公开(公告)号:KR1020050033737A

    公开(公告)日:2005-04-13

    申请号:KR1020030069585

    申请日:2003-10-07

    CPC classification number: C07F15/045 C23C16/18

    Abstract: Volatile nickel aminoalkoxide complexes, a preparation method thereof and a process for formation of a nickel thin film by using the same compounds are provided, which compounds have high volatility and sufficient thermal stability, and are reduced to nickel by self-pyrolysis without a reducing agent. so that the compounds are useful as a MOCVD(metal organic chemical vapor deposition) precursor for formation of the nickel thin film. The volatile nickel aminoalkoxide complexes represented by formula (1) are provided, wherein m is an integer of 1 to 3; and R and R' are C1-C4 linear or branched alkyl. The volatile nickel aminoalkoxide complexes represented by formula (2) are provided, wherein m is an integer of 1 to 3; n is an integer of 2 to 4; and R and R' are C1-C4 linear or branched alkyl. The method for preparing the volatile nickel aminoalkoxide complexes of formula (1) or (2) comprises a halogenized hexamine nickel compound of Ni(NH3)6X2 with an alkali metal salt of aminoalkoxide of MOCR'2(CH2)mNR2 or MOCR'2(CH2)mO(CH2)nNR2, wherein X is Cl, Br or I; and M is Li or Na. The process for formation of the nickel thin film comprises growing the nickel thin film by using the volatile nickel aminoalkoxide complexes of formula (1) or (2) as a precursor at 250 to 350 deg. C.

    Abstract translation: 提供挥发性镍氨基醇氧化物络合物,其制备方法和通过使用相同化合物形成镍薄膜的方法,该化合物具有高挥发性和足够的热稳定性,并且通过自热解而不用还原剂还原成镍 。 使得这些化合物可用作用于形成镍薄膜的MOCVD(金属有机化学气相沉积)前体。 提供由式(1)表示的挥发性镍氨基醇氧化物络合物,其中m为1至3的整数; 并且R和R'是C 1 -C 4直链或支链烷基。 提供由式(2)表示的挥发性镍氨基醇盐络合物,其中m为1至3的整数; n为2〜4的整数, 并且R和R'是C 1 -C 4直链或支链烷基。 制备式(1)或(2)的挥发性镍氨基醇氧化物配合物的方法包括Ni(NH 3)6 X 2的卤化六甲基镍化合物与MOCR'2(CH2)mNR2或MOCR'2(CH2)mNR2的氨基醇盐的碱金属盐 CH2)mO(CH2)nNR2,其中X是Cl,Br或I; M为Li或Na。 形成镍薄膜的方法包括使用式(1)或(2)的挥发性镍氨基醇氧化物配合物作为前体在250至350℃下生长镍薄膜。 C。

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