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    코어 기판 및 그 제조 방법
    2.
    发明公开
    코어 기판 및 그 제조 방법 无效
    核心基板及其制造方法

    公开(公告)号：KR1020090037801A

    公开(公告)日：2009-04-16

    申请号：KR1020080086684

    申请日：2008-09-03

    Applicant: 후지쯔 가부시끼가이샤

    Inventor： 히라노신 ,  이이다겐지 ,  마에하라야스토모 ,  아베도모유키 ,  나카가와다카시 ,  요시무라히데아키 ,  야마와키세이고 ,  오자키노리카즈

    IPC: H05K1/02 ,  H05K1/05

    CPC classification number: H05K9/00 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/09809 ,  Y10T29/49155

    Abstract: A core substrate and a method for manufacturing the same are provided to prevent void inside an insulating material filled in a pilot hole by coating an inner wall of the pilot hole with a plating layer. A core substrate includes a core unit(10), a wiring layer, a plating layer(19) and an insulating material(20). A pilot hole(18) is formed in the core unit. A plated through hole is passed through the pilot hole. The wiring layer is laminated in both sides of the core unit. The plating layer is coated in the inner wall of the pilot hole. The insulating material is filled between an outer circumference of the plated through hole and the plating layer. The insulating layer is laminated in the plating layer. The plating layer smooths an inner wall of the pilot hole. The plating layer surrounds the conductive attachment in the inner wall of the pilot hole.

    Abstract translation: 提供了一种芯基板及其制造方法，以通过用镀层涂覆导向孔的内壁来防止填充在引导孔中的绝缘材料内的空隙。 核心基板包括芯单元（10），布线层，镀层（19）和绝缘材料（20）。 在核心单元中形成导向孔（18）。 电镀通孔穿过引导孔。 布线层层叠在芯单元的两侧。 镀层涂在导孔的内壁。 绝缘材料填充在电镀通孔的外周与电镀层之间。 绝缘层层压在镀层中。 镀层使引导孔的内壁平滑。 镀层围绕导向孔的内壁中的导电附件。

    배선 기판
    3.
    发明公开
    배선 기판 失效
    电路板

    公开(公告)号：KR1020090032964A

    公开(公告)日：2009-04-01

    申请号：KR1020080080957

    申请日：2008-08-19

    Applicant: 후지쯔 가부시끼가이샤

    Inventor： 요시무라히데아키 ,  후쿠조노겐지 ,  이이다겐지 ,  아베도모유키 ,  마에하라야스토모 ,  나카가와다카시 ,  히라노신 ,  간다다카시

    IPC: H01L23/12 ,  H01L23/14 ,  H05K1/11 ,  H05K3/46

    CPC classification number: H05K1/0366 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09145 ,  Y10T428/24917 ,  Y10T428/24926

    Abstract: A wiring substrate is provided to prevent the generation of exfoliation or the crack by reducing the tensile stress under the environment of low temperature. A wiring substrate(1) comprises a core layer(10) and a pair of wiring layers(12). The wiring layer is laminated on the front and rear side of the core layer. The core layer is comprised of the resin composition containing the carbon fiber material. The inclusion rate of the carbon fiber material of the core layer is 30~80vol%. The resin composition comprises the resin and inorganic filler. The wiring layer has the laminating structure of being general by the insulating layer and the wiring pattern. The wiring pattern formed in the adjacent layer is electrically connected with a via hole. The electrode pad for the external connectivity is formed in the wiring pattern.

    Abstract translation: 提供布线基板以防止在低温环境下降低拉伸应力而产生剥离或裂纹。 布线基板（1）包括芯层（10）和一对布线层（12）。 布线层层叠在芯层的前后侧。 芯层由含有碳纤维材料的树脂组合物构成。 芯层碳纤维材料的夹杂率为30〜80vol％。 树脂组合物包含树脂和无机填料。 布线层具有通过绝缘层和布线图案的层叠结构。 形成在相邻层中的布线图案与通孔电连接。 用于外部连接的电极焊盘形成在布线图案中。

    코어 기판 및 프린트 배선판
    5.
    发明公开
    코어 기판 및 프린트 배선판 有权
    核心基板和印刷电路板

    公开(公告)号：KR1020090124917A

    公开(公告)日：2009-12-03

    申请号：KR1020090020281

    申请日：2009-03-10

    Applicant: 후지쯔 가부시끼가이샤

    Inventor： 요시무라히데아키 ,  이이다겐지 ,  아베도모유키 ,  마에하라야스토모 ,  나카가와다카시 ,  히라노신

    IPC: H05K1/05 ,  H05K3/46

    CPC classification number: H05K3/4641 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09536 ,  H05K2201/09809 ,  Y10T428/24331

    Abstract: PURPOSE: A core board and a printed wiring board are provided to suppress generation of thermal stress within the core board by having a pair of insulating layers having high strength. CONSTITUTION: A core layer(13) is formed by impregnating resin in carbon fibers. A through hole(17) for a basic hole is formed in the core layer, and passes through the core layer from a surface to a back surface. A filler(27) of a cylindrical shape is filled within the through hole for the basic hole. A pair of insulating layers(22,23) is formed by impregnating resin in glass fibers. In the insulating layers, the core layer is inserted between a surface and a back surface. A conductive via(25) is formed along an inner wall surface of the through hole. A through hole(24) passes through the core layer along a central axis of the through hole for the basic hole.

    Abstract translation: 目的：提供一种芯板和印刷电路板，通过具有一对具有高强度的绝缘层来抑制芯板内的热应力产生。 构成：通过将树脂浸渍在碳纤维中形成芯层（13）。 在芯层中形成用于基本孔的通孔（17），并且从表面到背面通过芯层。 圆柱形填料（27）填充在基孔的通孔内。 通过将树脂浸渍在玻璃纤维中形成一对绝缘层（22,23）。 在绝缘层中，芯层插入在表面和背面之间。 沿着通孔的内壁表面形成导电通孔（25）。 通孔（24）沿着用于基本孔的通孔的中心轴线穿过芯层。

    코어 기판 및 그 제조 방법
    6.
    发明公开
    코어 기판 및 그 제조 방법 失效
    核心基板及其制造方法

    公开(公告)号：KR1020090037792A

    公开(公告)日：2009-04-16

    申请号：KR1020080075355

    申请日：2008-07-31

    Applicant: 후지쯔 가부시끼가이샤

    Inventor： 이이다겐지 ,  아베도모유키 ,  마에하라야스토모 ,  히라노신 ,  나카가와다카시 ,  요시무라히데아키 ,  야마와키세이고 ,  오자키노리카즈

    IPC: H05K1/02

    CPC classification number: H05K3/4608 ,  H05K1/056 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09309 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09809 ,  H05K2203/1178 ,  Y10S428/901 ,  Y10T29/49155

    Abstract: A core substrate and a method for manufacturing the same are provided to prevent expansion of a plating layer in an inner surface of a base hole by discharging the gas generated from a core unit and a substrate through a gas exhaust hole. A core substrate includes a core unit(10), a conductive layer, a gas exhaust hole, an insulating material, a wiring layer and an insulating layer. A pilot hole is formed in the core unit. The plated through hole is penetrated through the pilot hole. The core unit has the conductivity. The conductive layer is formed in the inner wall surface of the pilot hole and the surface of the core unit. The gas exhaust hole is formed in the conductive layer. The insulating material is filled between the inner wall surface and an outer circumference of the plated through hole. The wiring layer is laminated on both sides of the core unit. A copper foil(14) is adhered in both sides of the core unit. The insulating layer is formed in the conductive layer.

    Abstract translation: 提供了一种芯基板及其制造方法，用于通过排气孔排出由核心单元和基板产生的气体来防止基孔内表面中的镀层的膨胀。 核心基板包括芯单元（10），导电层，排气孔，绝缘材料，布线层和绝缘层。 在核心单元中形成导向孔。 电镀通孔穿过导孔。 核心单元具有导电性。 导电层形成在引导孔的内壁面和芯部的表面。 排气孔形成在导电层中。 绝缘材料填充在电镀通孔的内壁表面和外周之间。 布线层层压在芯单元的两侧。 铜芯（14）粘附在芯单元的两侧。 绝缘层形成在导电层中。

    적층 기판의 제조 방법
    9.
    发明公开
    적층 기판의 제조 방법 有权
    生产多层板的方法

    公开(公告)号：KR1020070120016A

    公开(公告)日：2007-12-21

    申请号：KR1020060130774

    申请日：2006-12-20

    Applicant: 후지쯔 가부시끼가이샤

    Inventor： 나까가와다카시 ,  스가노세이치 ,  이다겐지 ,  마에하라야스토모 ,  스즈키히토시 ,  스기모토가오루 ,  후쿠주노겐지 ,  간다다카시 ,  다테히로아키 ,  야기도모히사

    IPC: H05K3/46

    CPC classification number: H05K3/4614 ,  H05K3/321 ,  H05K3/361 ,  H05K3/4069 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/0568 ,  H05K2203/063 ,  Y10T29/49117

    Abstract: A method for manufacturing a multilayer board is provided to improve a connection reliability between terminal portions on substrates with different heat expansion ratios by improving a bonding strength between the substrates. A filler which is made by plating a solder with a second melting point on a surface of a metal particle with a first melting point is mixed with a hardener to form a bonding ink(20). The bonding ink is applied on a terminal portion(12a) of a first substrate(12). The second melting point is lower than the first melting point. An adhesive sheet(24) containing a thermosetting resin is attached to a second substrate(14). A through-hole is formed on the adhesive sheet corresponding to a terminal portion(14a) of the second substrate. The first and second substrates are attached to each other with the adhesive sheet while the terminal portions are arranged to face each other. Heat and pressure are applied on the first and second substrates to cure the adhesive sheet and the bonding ink.

    Abstract translation: 提供一种制造多层板的方法，通过提高基板之间的接合强度来提高具有不同热膨胀率的基板上的端子部分之间的连接可靠性。 通过将具有第一熔点的金属颗粒表面上的具有第二熔点的焊料电镀制成的填料与硬化剂混​​合以形成粘合油墨（20）。 接合油墨被施加在第一基板（12）的端子部分（12a）上。 第二熔点低于第一熔点。 含有热固性树脂的粘合片（24）附着在第二基片（14）上。 在对应于第二基板的端子部分（14a）的粘合片上形成通孔。 第一和第二基板通过粘合片彼此附接，而端子部分彼此面对。 在第一和第二基板上施加热和压力以使粘合片和粘结油墨固化。

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