公开(公告)号：US20220392741A1

公开(公告)日：2022-12-08

申请号：US17770043

申请日：2020-10-15

Applicant: ASML NETHERLANDS B.V.

Inventor： Maikel Robert GOOSEN ,  Erwin Paul SMAKMAN

IPC: H01J37/26 ,  H01J37/28 ,  H01J37/244 ,  H01J37/22

Abstract: Systems and methods of profiling a charged-particle beam are disclosed. The method of profiling a charged-particle beam may comprise activating a charged-particle source to generate the charged-particle beam along a primary optical axis, modifying the charged-particle beam by adjusting an interaction between the charged-particle beam and a standing optical wave, detecting charged particles from the modified charged-particle beam after the interaction with the standing optical wave, and determining a profile of the charged-particle beam based on the detected charged particles. Alternatively, the method may include activating an optical source, modifying the optical beam by adjusting an interaction between the optical beam and a charged-particle beam, detecting an optical signal from the modified optical beam, and determining a characteristic of the charged-particle beam based on the detected optical signal.

公开(公告)号：US20240339292A1

公开(公告)日：2024-10-10

申请号：US18748758

申请日：2024-06-20

Applicant: ASML NETHERLANDS B.V.

Inventor： Yan REN ,  Marijke SCOTUZZI ,  Albertus Victor Gerardus MANGNUS ,  Erwin Paul SMAKMAN

IPC: H01J37/244 ,  H01J37/10 ,  H01J37/28

CPC classification number: H01J37/244 ,  H01J37/10 ,  H01J37/28

Abstract: There is provided a charged particle device for a charged particle inspection apparatus for projecting an array of sub-beams towards a sample, the charged particle device comprising: a charged particle optical element and a detector. The charged particle optical element has an up-beam surface having a plurality of openings to generate an array of sub-beams from a charged particle beam. In the charged particle optical element are defined: sub-beam apertures and monitoring apertures. The sub-beam aperture extend through the charged particle element for paths of the array of sub-beams towards a sample. The monitoring aperture extends through the charged particle element. The detector is in the monitoring aperture. At least part of the detector is down-beam of the up-beam surface. The detector measures a parameter of a portion of the charged particle beam incident on the detector.

公开(公告)号：US20230324318A1

公开(公告)日：2023-10-12

申请号：US18327847

申请日：2023-06-01

Applicant: ASML Netherlands B.V.

Inventor： Yan REN ,  Erwin SLOT ,  Albertus Victor, Gerardus MANGNUS ,  Marijke SCOTUZZI ,  Erwin Paul SMAKMAN

IPC: G01N23/2251 ,  H01J37/244 ,  H01J37/09 ,  H01J37/12 ,  H01J37/147

CPC classification number: G01N23/2251 ,  H01J37/244 ,  H01J37/09 ,  H01J37/12 ,  H01J37/1472 ,  G01N2223/303 ,  H01J2237/2448 ,  H01J2237/0453 ,  H01J37/20

Abstract: A charged-particle tool configured to generate a plurality of sub-beams from a beam of charged particles and direct the sub-beams downbeam toward a sample position, the tool charged-particle tool comprising at least three charged-particle-optical components; a detector module; and a controller. Thea detector module is configured to generate a detection signal in response to charged particles that propagate upbeam from the direction of the sample position. The controller is configured to operate the tool in a calibration mode. The charged-particle-optical components include: a charged-particle source configured to emit a beam of charged particles and a beam generator configured to generate the sub-beams. The detection signal contains information about alignment of at least two of the charged-particle-optical components. The charged-particle optical components comprise two or more charged-particle optical elements comprising an array of apertures for which the charged particles may be monitored.

公开(公告)号：US20190227442A1

公开(公告)日：2019-07-25

申请号：US16314740

申请日：2017-06-27

Applicant: ASML NETHERLANDS B.V.

Inventor： Erwin Paul SMAKMAN ,  Coen Adrianus VERSCHUREN

IPC: G03F7/20 ,  G03F9/00

CPC classification number: G03F7/70625 ,  G03F7/70383 ,  G03F7/70391 ,  G03F7/70508 ,  G03F9/7026

Abstract: An exposure apparatus including: a substrate holder constructed to support a substrate; a patterning device configured to provide radiation modulated according to a desired pattern, the patterning device including an array of radiation source modules configured to project the modulated radiation onto a respective array of exposure regions on the substrate; and a distributed processing system configured to process projection related data to enable the projection of the desired pattern onto the substrate, the distributed processing system including at least one central processing unit and a plurality of module processing units each associated with a respective radiation source module.

公开(公告)号：US20190006147A1

公开(公告)日：2019-01-03

申请号：US16064193

申请日：2016-12-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Bernardo KASTRUP ,  Johannes Catharinus Hubertus MULKENS ,  Marinus Aart VAN DEN BRINK ,  Jozef Petrus Henricus BENSCHOP ,  Erwin Paul SMAKMAN ,  Tamara DRUZHININA ,  Coen Adrianus VERSCHUREN

IPC: H01J37/26 ,  H01J37/28 ,  H01J37/15 ,  H01J37/244

Abstract: An electron beam inspection apparatus, the apparatus including a plurality of electron beam columns, each electron beam column configured to provide an electron beam and detect scattered or secondary electrons from an object, and an actuator system configured to move one or more of the electron beam columns relative to another one or more of the electron beam columns. The actuator system may include a plurality of first movable structures at least partly overlapping a plurality of second movable structures, the first and second movable structures supporting the plurality of electron beam columns.

公开(公告)号：US20230154722A1

公开(公告)日：2023-05-18

申请号：US17361119

申请日：2019-12-17

Applicant: ASML Netherlands B.V.

Inventor： Arno Jan BLEEKER ,  Pieter Willem Herman DE JAGER ,  Maikel Robert GOOSEN ,  Erwin Paul SMAKMAN ,  Albertus Victor Gerardus MANGNUS ,  Yan REN ,  Adam LASSISE

IPC: H01J37/147 ,  H01J37/244 ,  H01J37/26 ,  H01J37/28

CPC classification number: H01J37/1474 ,  H01J37/244 ,  H01J37/265 ,  H01J37/28 ,  H01J2237/2817 ,  H01J2237/2448 ,  H01J2237/24475

Abstract: Apparatuses and methods for charged-particle detection may include a deflector system configured to direct charged-particle pulses, a detector having a detection element configured to detect the charged-particle pulses, and a controller having a circuitry configured to control the deflector system to direct a first and second charged-particle pulses to the detection element; obtain first and second timestamps associated with when the first charged-particle pulse is directed by the deflector system and detected by the detection element, respectively, and third and fourth timestamps associated with when the second charged-particle pulse is directed by the deflector system and detected by the detection element, respectively; and identify a first and second exiting beams based on the first and second timestamps, and the third and fourth timestamps, respectively.

公开(公告)号：US20210249224A1

公开(公告)日：2021-08-12

申请号：US17054559

申请日：2019-05-24

Applicant: ASML NETHERLANDS B.V.

Inventor： Erwin Paul SMAKMAN ,  Albertus Victor Gerardus MANGNUS ,  Maikel Robert GOOSEN

IPC: H01J37/317 ,  H01J37/147 ,  H01J37/20 ,  H01J37/04 ,  H01J37/244

Abstract: An electron beam apparatus including: an electron beam source configured to generate an electron beam; a beam conversion unit including an aperture array configured to generate a plurality of beamlets from the electron beam, and a deflector unit configured to deflect one or more groups of the plurality of beamlets; and a projection system configured to project the plurality of beamlets onto an object, wherein the deflector unit is configured to deflect the one or more groups of the plurality of beamlets to impinge on the object at different angles of incidence, each beamlet in a group having substantially the same angle of incidence on the object.

公开(公告)号：US20190339621A1

公开(公告)日：2019-11-07

申请号：US16314805

申请日：2017-06-27

Applicant: ASML NETHERLANDS B.V.

Inventor： Coen Adrianus VERSCHUREN ,  Erwin Paul SMAKMAN

IPC: G03F7/20

Abstract: A direct write exposure apparatus configured to process a plurality of substrates, the apparatus including: a substrate holder configured to hold a substrate having a usable patterning area; a patterning system configured to project different patterns onto the substrate; a processing system configured to: determine a first combination of one or more patterns that are to be applied on a first substrate of the plurality of substrates; and determine a second, different combination of one or more patterns that are to be applied on a second, subsequent, substrate of the plurality of substrates.

公开(公告)号：US20190011841A1

公开(公告)日：2019-01-10

申请号：US16064274

申请日：2016-12-13

Applicant: ASML NETHERLANDS B.V.

Inventor： Pieter Willem Herman DE JAGER ,  Coen Adrianus VERSCHUREN ,  Erwin Paul SMAKMAN ,  Erwin JOhn VAN ZWET ,  Wouter Frans Willem MULCKHUYSE ,  Pieter VERHOEFF ,  Robert Albertus Johannes VAN DER WERF

IPC: G03F7/20

Abstract: An exposure apparatus including: a substrate holder constructed to support a substrate; a patterning device configured to provide radiation modulated according to a desired pattern, the patterning device including a plurality of two-dimensional arrays of radiation sources, each radiation source configured to emit a radiation beam; a projection system configured to project the modulated radiation onto the substrate, the projection system including a plurality of optical elements arranged side by side and arranged such that a two-dimensional array of radiation beams from a two-dimensional array of radiation sources impinges a single optical element of the plurality of optical elements; and an actuator configured to provide relative motion between the substrate and the plurality of two-dimensional arrays of radiation sources in a scanning direction to expose the substrate.

公开(公告)号：US20250166960A1

公开(公告)日：2025-05-22

申请号：US18829231

申请日：2024-09-09

Applicant: ASML Netherlands B.V.

Inventor： Wei FANG ,  Lingling PU ,  Thomas Jarik HUISMAN ,  Erwin Paul SMAKMAN

IPC: H01J37/22 ,  G02B21/00 ,  G02B21/36 ,  G06N20/00 ,  G06T5/50 ,  G06T7/00 ,  G06V10/44 ,  G06V10/82 ,  G06V20/69

Abstract: Systems and methods for image enhancement are disclosed. A method for enhancing an image may include acquiring a first scanning electron microscopy (SEM) image at a first resolution. The method may also include acquiring a second SEM image at a second resolution. The method may further include providing an enhanced image by using the first SEM image as a reference to enhance the second SEM image. The enhanced image may be provided by using one or more features extracted from the first image to enhance the second SEM image, or using the first SEM image as a reference to numerically enhance the second SEM image.