ALIGNMENT METHOD
    1.
    发明申请
    ALIGNMENT METHOD 审中-公开

    公开(公告)号:US20190227446A1

    公开(公告)日:2019-07-25

    申请号:US16315100

    申请日:2017-08-14

    Abstract: A method of determining the position of an alignment mark on a substrate, the alignment mark having first and second segment, the method including illuminating the alignment mark with radiation, detecting radiation diffracted by the alignment mark and generating a resulting alignment signal. The alignment signal has a first component received during illumination of the first segment only, a second component received during illumination of the second segment only, and a third component received during simultaneous illumination of both segments. The positions of the segments are determined using the first component, the second component and the third component of the alignment signal.

    ALIGNMENT METHOD AND ASSOCIATED ALIGNMENT AND LITHOGRAPHIC APPARATUSES

    公开(公告)号:US20230004097A1

    公开(公告)日:2023-01-05

    申请号:US17784424

    申请日:2020-11-17

    Abstract: Disclosed is a substrate, associated patterning device and a method for measuring a position of the substrate. The method comprises performing an alignment scan of an alignment mark to obtain simultaneously: a first measurement signal detected in a first measurement channel and a second measurement signal detected in a second measurement channel. The first and second measurement signals are processed by subtracting a first direction component of the first measurement signal from a first direction component of the second measurement signal to obtain a first processed signal, the first direction components relating to said first direction. The position of an alignment mark is determined with respect to the first direction from the first processed signal.

    Alignment Measurement System, Lithographic Apparatus, and a Method to Determine Alignment of in a Lithographic Apparatus
    6.
    发明申请
    Alignment Measurement System, Lithographic Apparatus, and a Method to Determine Alignment of in a Lithographic Apparatus 有权
    对准测量系统,平版印刷设备和确定平版印刷设备中的对准的方法

    公开(公告)号:US20150261100A1

    公开(公告)日:2015-09-17

    申请号:US14725023

    申请日:2015-05-29

    Abstract: An alignment measurement system measures an alignment target on an object. A measurement illuminates the target and is reflected. The reflected measurement beam is split and its parts are differently polarized. A detector receives the reflected measurement beam. A processing unit determines alignment on the basis of the measurement beam received by the detector. An alternative arrangement utilizes an optical dispersive fiber to guide a multi-wavelength measurement beam reflected from the object to a detector.

    Abstract translation: 对准测量系统测量物体上的对准目标。 测量照亮目标并被反射。 反射的测量光束被分离,其部分被不同的极化。 检测器接收反射的测量光束。 处理单元基于由检测器接收的测量波束来确定对准。 一种替代方案是使用光学色散光纤将从物体反射的多波长测量光束引导到检测器。

    PHASE MODULATORS IN ALIGNMENT TO DECREASE MARK SIZE

    公开(公告)号:US20220397833A1

    公开(公告)日:2022-12-15

    申请号:US17633884

    申请日:2020-08-05

    Abstract: An alignment apparatus includes an illumination system configured to direct one or more illumination beams towards an alignment target and receive the diffracted beams from the alignment target. The alignment apparatus also includes a self-referencing Interferometer configured to generate two diffraction sub-beams, wherein the two diffraction sub-beams are orthogonally polarized, rotated 180 degrees with respect to each other around an alignment axis, and spatially overlapped. The alignment apparatus further includes a beam analyzer configured to generate interference between the overlapped components of the diffraction sub-beams and produce two orthogonally polarized optical branches, and a detection system configured to determine a position of the alignment target based on light intensity measurement of the optical branches, wherein the measured light intensity is temporally modulated by a phase modulator.

    METHOD FOR DETERMINING DEFORMATION

    公开(公告)号:US20210149316A1

    公开(公告)日:2021-05-20

    申请号:US16623912

    申请日:2018-05-28

    Abstract: A method for determining substrate deformation includes obtaining first measurement data associated with mark positions, from measurements of a plurality of substrates; obtaining second measurement data associated with mark positions, from measurements of the plurality of substrates; determining a mapping between the first measurement data and the second measurement data; and decomposing the mapping, by calculating an eigenvalue decomposition for the mapping, to separately determine a first deformation (e.g. mark deformation) that scales differently from a second deformation (e.g. substrate deformation) in the mapping between the data. The steps of determining a mapping and decomposing the mapping may be performed together using non-linear optimization.

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