公开(公告)号：WO2022012873A1

公开(公告)日：2022-01-20

申请号：PCT/EP2021/066813

申请日：2021-06-21

Applicant: ASML NETHERLANDS B.V.

Inventor： GKOROU, Dimitra ,  BASTANI, Vahid ,  SAHRAEIAN, Reza ,  TABERY, Cyrus, Emil

IPC: H01L21/66 ,  G03F7/20 ,  G05B19/418 ,  G05B23/02 ,  G03F7/70491 ,  G03F7/705 ,  G05B2219/45031 ,  G05B23/024 ,  G05B23/0243 ,  H01L21/67271 ,  H01L22/12 ,  H01L22/14 ,  H01L22/20

Abstract: Methods and apparatus for classifying semiconductor wafers. The method comprises: sorting a set of semiconductor wafers, using a model, into a plurality of sub-sets based on parameter data corresponding to one or more parameters of the set of semiconductor wafers, wherein the parameter data for semiconductor wafers in a sub-set include one or more common characteristics; identifying one or more semiconductor wafers within a sub-set based on a probability of the one or more semiconductor wafers being correctly allocated to the sub-set; comparing the parameter data of the one or more identified semiconductor wafers to reference parameter data; and reconfiguring the model based on the comparison. The comparison is undertaken by a human to provide constraints for the model. The apparatus is configured to undertake the method.

公开(公告)号：WO2023001463A1

公开(公告)日：2023-01-26

申请号：PCT/EP2022/066798

申请日：2022-06-21

Applicant: ASML NETHERLANDS B.V.

Inventor： ADAL, Kedir, Mohammed ,  SAHRAEIAN, Reza ,  VAN DIJK, Leon, Paul ,  VAN HAREN, Richard, Johannes, Franciscus ,  HAQUE, Abu, Niyam, Md, Mushfiqul

IPC: G03F7/20 ,  G06N3/00

Abstract: Methods, systems, and apparatus for mapping high dimensional data related to a lithographic apparatus, etch tool, metrology tool or inspection tool to a lower dimensional representation of the data. High dimensional data is obtained related to the apparatus. The high dimensional data has first dimensions N greater than two. A nonlinear parametric model is obtained, which has been trained to map a training set of high dimensional data onto a lower dimensional representation. The lower dimensional representation has second dimensions M, wherein M is less than N. The model has been trained using a cost function configured to make the mapping preserve local similarities in the training set of high dimensional data. Using the model, the obtained high dimensional data is mapped to the corresponding lower dimensional representation.

公开(公告)号：WO2021213746A1

公开(公告)日：2021-10-28

申请号：PCT/EP2021/057211

申请日：2021-03-22

Applicant: ASML NETHERLANDS B.V.

Inventor： SAHRAEIAN, Reza ,  BASTANI, Vahid ,  GKOROU, Dimitra ,  DOS SANTOS GUZELLA, Thiago

IPC: G03F7/20 ,  G06N5/04

Abstract: Apparatus and methods of configuring an imputer model for imputing a second parameter. The method comprises inputting a first data set comprising values of a first parameter to the imputer model, and evaluating the imputer model to obtain a second data set comprising imputed values of the second parameter. The method further comprises obtaining a third data set comprising measured values of a third parameter, wherein the third parameter is correlated to the second parameter; obtaining a prediction model configured to infer values of the third parameter based on inputting values of the second parameter; inputting the second data set to the prediction model, and evaluating the prediction model to obtain inferred values of the third parameter; and configuring the imputer model based on a comparison of the inferred values and the measured values of the third parameter.

公开(公告)号：WO2022100998A1

公开(公告)日：2022-05-19

申请号：PCT/EP2021/079621

申请日：2021-10-26

Applicant: ASML NETHERLANDS B.V.

Inventor： WERKMAN, Roy ,  WILDENBERG, Jochem, Sebastiaan ,  SAHRAEIAN, Reza

IPC: G03F7/20

Abstract: A method to infer a current sampling scheme for one or more current substrates is provided, the method comprising: obtaining a first model trained to infer an optimal sampling scheme based on inputting context and/or pre-exposure data associated with one or more previous substrates, wherein the first model is trained in dependency of an outcome of a second model configured to discriminate between the inferred optimal sampling scheme and a pre-determined optimal sampling scheme; and using the obtained first model to infer the current sampling scheme based on inputting context and/or pre-exposure data associated with the one or more current substrate.

公开(公告)号：WO2021197730A1

公开(公告)日：2021-10-07

申请号：PCT/EP2021/054988

申请日：2021-03-01

Applicant: ASML NETHERLANDS B.V.

Inventor： KOULIERAKIS, Eleftherios ,  LANCIA, Carlo ,  GONZALEZ HUESCA, Juan Manuel ,  YPMA, Alexander ,  GKOROU, Dimitra ,  SAHRAEIAN, Reza

IPC: G03F7/20 ,  G03F7/705 ,  G03F7/70525

Abstract: Described is a method for determining an inspection strategy for at least one substrate, the method comprising: quantifying, using a prediction model, a compliance metric value for a compliance metric relating to a prediction of compliance with a quality requirement based on one or both of pre- processing data associated with the substrate and any available post-processing data associated with the at least one substrate; and deciding on an inspection strategy for said at least one substrate, based on the compliance metric value, an expected cost associated with the inspection strategy and at least one objective value describing an expected value of the inspection strategy in terms of at least one objective relating to the prediction model.

公开(公告)号：WO2022179773A1

公开(公告)日：2022-09-01

申请号：PCT/EP2022/051299

申请日：2022-01-21

Applicant: ASML NETHERLANDS B.V.

Inventor： DOS SANTOS GUZELLA, Thiago ,  ISHIBASHI, Masashi ,  SANNO, Noriaki ,  BASTANI, Vahid ,  SAHRAEIAN, Reza ,  SAPUTRA, Putra

IPC: G01N21/956 ,  G03F7/20 ,  G05B19/418 ,  G06N20/00 ,  H01L21/66

Abstract: Described is a method for determining a spatially varying process offset for a lithographic process, the spatially varying process offset (MTD) varying over a substrate subject to the lithographic process to form one or more structures thereon. The method comprises obtaining a trained model (MOD), having been trained to predict first metrology data based on second metrology data, wherein the first metrology data (OV) is spatially varying metrology data which relates to a first type of measurement of said structures being a measure of yield and said second metrology data (PB) is spatially varying metrology data which relates to a second type of measurement of said structures and correlates with said first metrology data; and using said model to obtain said spatially varying process offset (MTD).

公开(公告)号：WO2021001114A1

公开(公告)日：2021-01-07

申请号：PCT/EP2020/065619

申请日：2020-06-05

Applicant: ASML NETHERLANDS B.V.

Inventor： BASTANI, Vahid ,  SONNTAG, Dag ,  SAHRAEIAN, Reza ,  GKOROU, Dimitra

IPC: G03F7/20 ,  G05B19/418 ,  H01L21/66

Abstract: A method of determining a contribution of a process feature to the performance of a process of patterning substrates. The method may comprise obtaining a first model trained on first process data and first performance data. One or more substrates may be identified based on a quality of prediction of the first model when applied to process data associated with the one or more substrates. A second model may be trained on second process data and second performance data associated with the identified one or more substrates. The second model may be used to determine the contribution of a process feature of the second process data to the second performance data associated with the one or more substrates.

公开(公告)号：EP4130880A1

公开(公告)日：2023-02-08

申请号：EP21189299.7

申请日：2021-08-03

Applicant: ASML Netherlands B.V.

Inventor： ADAL, Kedir, Mohammed ,  SAHRAEIAN, Reza ,  VAN DIJK, Leon, Paul ,  VAN HAREN, Richard, Johannes, Franciscus ,  HAQUE, Abu, Niyam, Md, Mushfiqul

IPC: G03F7/20 ,  G06N3/00

Abstract: Methods, systems, and apparatus for mapping high dimensional data related to an apparatus to a lower dimensional representation of the data. High dimensional data is obtained related to the apparatus. The high dimensional data has first dimensions N greater than 2. A nonlinear parametric model is obtained, which has been trained to map a training set of high dimensional data onto a lower dimensional representation. The lower dimensional representation has second dimensions M, wherein M is less than N. The model has been trained using a cost function configured to make the mapping preserve local similarities in the training set of high dimensional data. Using the model, the obtained high dimensional data is mapped to the corresponding lower dimensional representation.

公开(公告)号：EP4374226A1

公开(公告)日：2024-05-29

申请号：EP22738350.2

申请日：2022-06-21

Applicant: ASML Netherlands B.V.

Inventor： ADAL, Kedir, Mohammed ,  SAHRAEIAN, Reza ,  VAN DIJK, Leon, Paul ,  VAN HAREN, Richard, Johannes, Franciscus ,  HAQUE, Abu, Niyam, Md, Mushfiqul

IPC: G03F7/20 ,  G06N3/00

CPC classification number: G03F7/70508 ,  G03F7/705 ,  G03F7/70525

公开(公告)号：EP4139749A1

公开(公告)日：2023-03-01

申请号：EP21712845.3

申请日：2021-03-22

Applicant: ASML Netherlands B.V.

Inventor： SAHRAEIAN, Reza ,  BASTANI, Vahid ,  GKOROU, Dimitra ,  DOS SANTOS GUZELLA, Thiago

IPC: G03F7/20 ,  G06N5/04