Abstract:
A method of treating or operating a radiation source apparatus (SO), for instance for generating EUV radiation for device lithography, is disclosed. The method is for use with radiation source apparatus having a chamber (220) arranged to hold a plasma (210) for radiation generation, with the plasma excited from a metal fuel in use by a first plasma generator (LA). The method comprises flowing a gas (via 41) comprising hydrogen and boron hydride through the chamber with the gas in an excited state comprising free radicals of hydrogen. The presence of the boron hydride with the hydrogen radicals in the gas is effective cleaning or reducing build-up of metal fuel deposits on surfaces of the chamber or associated optics, particularly on reflective surfaces of the radiation collector mirror (CO). The method is particularly suitable for use with tin fuel. The hydrogen free radicals may be generated by the plasma (210) for radiation generation itself, or may involve exciting the gas using a second, separate free radical generator (41). The method may be used to reduce deposition whilst the radiation source apparatus is in use for generation of radiation or may be applied as a treatment for cleaning whilst radiation generation is interrupted.
Abstract:
A reluctance actuator assembly comprising a reluctance actuator, a flux sensor to measure a magnetic flux in a gap of the reluctance actuator, and a flux amplifier to drive an actuator coil of the reluctance actuator based on a flux set point and the flux measured by the flux sensor. A method comprising providing to the flux amplifier a flux setpoint, the flux setpoint comprising a time constant component and a sinusoidally varying component at an excitation frequency, measuring a force generated by the reluctance actuator in response to the flux setpoint, and calibrating the reluctance actuator assembly from the measured force.
Abstract:
A lithographic apparatus comprises a first body (B1; MO) comprising a heat source (HS; CL), a second body (B2; ME) and a heater device (HD). The second body has a facing surface (FS) facing the first body via a gap (GA) between the first and second bodies. The heat source is for providing a heat flux to the second body via the gap. The heater device is attached to the facing surface. The heater device is configured to provide a further heat flux to the second body.
Abstract:
A lithographic apparatus has a support that is provided with burls for holding an object. The support has been fabricated with a lithographic manufacturing method, e.g., a MEMS-technology, so as to create burls whose orientations or positions are individually electrically controllable.
Abstract:
A method is disclosed to form a patterned epitaxy template, on a substrate, to direct self-assembly of block copolymer for device lithography. A resist layer on a substrate is selectively exposed with actinic (e.g. UV or DUV) radiation by photolithography to provide exposed portions in a regular lattice pattern of touching or overlapping shapes arranged to leave unexposed resist portions between the shapes. Exposed or unexposed resist is removed with remaining resist portions providing the basis for a patterned epitaxy template for the orientation of the self-assemblable block copolymer as a hexagonal or square array. The method allows for simple, direct UV lithography to form patterned epitaxy templates with sub-resolution features.
Abstract:
A method is disclosed to form a patterned template on a substrate, to direct orientation of a self-assemblable block copolymer. The method involves providing a resist layer of a positive tone resist on the substrate and overexposing the resist with actinic (e.g. UV) radiation by photolithography to expose a continuous region of the resist layer with a sub-resolution unexposed resist portion at the interface between the resist and the substrate. The resist portion remaining at the interface, after removal of the exposed region, provides a basis for a chemical epitaxy template. The method may allow for simple, direct photolithography to form a patterned chemical epitaxy template and optionally include an accurately co-aligned graphoepitaxy feature and/or a substrate alignment feature.
Abstract:
A spectral purity filter is integrated with a collector optic (CO) in an EUV lithography apparatus. The element is coated on at least one surface (410) with a multilayer stack comprising a plurality of alternating material layers (for example Mo, Si) suitable for reflecting radiation of EUV wavelength. To manufacture the element, a substrate (402) is provided with a three-dimensional profile (410a, 412, 410b) on a scale much larger than the wavelength of EUV radiation. The multilayer stack is then applied as a series conformal coatings formed by atomic layer deposition on the substrate after formation of said profile. The profile, as reproduced in the MLM coating (310a, 312, 310b), forms a spectral purity filter. Unwanted radiation such as infrared radiation will be scattered or diffracted so that a reduced portion is reflected in the same direction as the reflected EUV radiation. The profile may be designed to form a phase grating, or a scattering texture.
Abstract:
A substrate holder for use in a lithographic apparatus, the substrate holder including: a main body (100) having a surface (107); a plurality of burls (106) projecting from the surface and having end surfaces to support a substrate; and a thin film stack (200) on the main body surface and forming an electric component, the thin film stack having a conductive layer (108) configured to distribute electrical charge substantially uniformly throughout a plane of the stack in which the conductive layer is positioned.
Abstract:
A mirror for reflection of EUV radiation having a wavelength from 5 to 20nm has a multilayer stack of pairs of alternating layers materials having different refractive indices with a protective region is disposed on the stack, the protective region having from 1 to 5 pairs of alternating layers of materials of differing refractive indices disposed on the multilayer stack, so that alternation of magnitude of refractive index continues from the multilayer stack through the protective region. The mirror is arranged so that radiation for reflection is incident upon the protective region before being incident upon the multilayer stack. The materials of the protective region are selected to have a high resistance to blister formation when subjected to bombardment by hydrogen atoms or ions, for instance from an EUV plasma source, in use. For instance, the multilayer stack may be of silicon/molybdenum, with the protective region of silicon nitride/molybdenum. The protective region acts to prevent hydrogen atoms or ions penetrating into and blistering the mirror, but without resulting in excessive losses in the reflectivity of the mirror. The mirror is particularly useful as a collector mirror such as a normal incidence collector for laser produced plasma EUV sources and is useful for device lithography and in lithography apparatus.
Abstract:
A substrate holder for use in a lithographic apparatus, the substrate holder including: a main body (100) having a surface (107); a plurality of burls (106) projecting from the surface and having end surfaces to support a substrate; and a thin film stack (200) on the main body surface and forming an electric component, the thin film stack having a conductive layer (108) configured to distribute electrical charge substantially uniformly throughout a plane of the stack in which the conductive layer is positioned.