Abstract:
A method of manufacturing an object holder for use in a lithographic apparatus, the object holder comprising one or more electrically functional components, the method comprising: using a composite structure comprising a carrier sheet different from a main body of the object holder and a layered structure comprising one or a plurality of layers and formed on the carrier sheet; connecting the composite structure to a surface of the main body such that the layered structure is between the carrier sheet and the surface of the main body; and removing the carrier sheet from the composite structure, leaving the layered structure connected to the main body.
Abstract:
An apparatus for cleaning an object (W), the apparatus comprising: an object support (16) for supporting the object; a low pressure chamber (15) for exposing a first surface of the object to a low pressure when the object is arranged on the object support, an electrode (23a, 23b) arranged adjacent to and separated from the first surface of the object when the object is arranged on the object support, the electrode being in electrical communication with a surface of the object support which is adjacent the first surface of the object; and a power supply (24a, 24b) arranged to apply a voltage between the electrode and the object; thereby generating a discharge between the object and the electrode.
Abstract:
A chuck, chuck control system, lithographic apparatus and method of using a chuck are disclosed. In an embodiment, there is provided a chuck (43) for use in holding a patterning device (MA) or a substrate (W) onto a supporting table (MT, WT) of a lithography apparatus (100) by electrostatic force, in which the patterning device is for imparting a radiation beam (B) with a pattern in its cross-section to form a patterned radiation beam, and the substrate is for receiving the patterned radiation beam; said chuck comprising: a dielectric member (45); a temperature conditioning fluid channel (48) formed within the chuck; a drive electrode (40, 42) for applying a potential difference between the drive electrode and the patterning device or substrate across the dielectric member in order to electrostatically attract the patterning device or substrate towards the drive electrode; and a first shield electrode (60) for reducing or preventing the development of an electric field across temperature conditioning fluid in the temperature conditioning fluid channel due to a voltage applied to the drive electrode, in order to reduce or prevent electrolysis in the fluid.
Abstract:
Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.
Abstract:
A method of clamping articles (MA, W) for a lithographic apparatus, the method comprising: providing a chuck (50) comprising an electrode (40) connected to a power supply; providing an article on the chuck; applying with the power supply to the electrode a voltage having a clamping polarity so as to provide a clamping force between the chuck and the article on the chuck; replacing the article on the chuck with a succeeding article on the chuck; and applying a voltage having the clamping polarity to the electrode so as to provide a clamping force between the clamp and the succeeding article on the chuck.
Abstract:
A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors (202) within a lithographic apparatus, and/or a separate metrology tool (240). Other inspections tools (244, 248) perform wafer backside inspection to produce second measurement data (302). High- resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed (CORR) to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map (506) is used to identify potentially relevant clusters of defects in the more detailed original defect map (520). The responsible apparatus can be identified by pattern recognition (PREC) as part of automated root cause analysis, alternatively, reticle inspection data may be used as second measurement data (302).
Abstract:
A clamp assembly is disclose, the clamp assembly comprising a clamp (50) configurable to clamp a support member (110) to a lower base surface (49) of the clamp by electrostatic adhesion, and an arrangement configurable to direct a gas to the lower base surface (49) of the clamp. The arrangement is configurable to humidify the gas by exposing the gas to a liquid. Also disclosed is a method of discharging a lower base surface of a clamp, The method comprises the steps of humidifying a gas by exposing the gas to a liquid, and directing the humidified gas to a lower base surface of the clamp.
Abstract:
A feedthrough for providing an electrical connection is provided. The feedthrough comprises a conductor and a quartz or a glass structure configured to surround at least a portion of the conductor and provide isolation to the conductor. The conductor and the quartz or glass structure may be coaxially arranged. The feedthrough can provide an electrical connection between an inside and outside of a vacuum chamber that contains a sample.
Abstract:
A support such as a clamp is configured to releasably hold a patterning device such as a reticle to secure it and prevent heat-induced deformation of it. For example, an electrostatic clamp includes a first substrate having opposing first and second surfaces, a plurality of burls located on the first surface and configured to contact the reticle, a second substrate having opposing first and second surfaces. The first surface of the second substrate is coupled to the second surface of the first substrate. A plurality of cooling elements is located between the first surface of the second substrate and the second surface of the first substrate. The cooling elements are configured to cause electrons to travel from the second surface of the first substrate to the first surface of the second substrate. Each cooling element is substantially aligned with a respective burl.