Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus which can be used by combining with (E)UV radiation. SOLUTION: A method of performing an inclined focal test including each step of generating a target object, a projection beam for irradiation, at least one reflective device, and a projection beam for first projected irradiation on the target object by using at least one reflective device in a first direction, comprises steps of: providing a second projection beam with an inclination against the first projection beam by using an inclination device for inclining at least one reflective device in a second direction; generating a projection beam of a second projected irradiation on the target object; determining the lateral movement of the first and second projected projection beams on the target object; and determining the focal deviation of the target object against the projected projection beams from the lateral movement. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an improving method for the calibration of a level sensor or a height sensor in a lithographic device. SOLUTION: In order to reduce the process dependency of substrate position measurement obtained by a level sensor, the method includes step for: compensating the differences between measured values in a plurality of level sensor devices and obtaining at least one calibration value for the level sensor system corresponding to a property of the substrate; and measuring the position of the surface of the substrate using the plurality of level sensor devices based on the at least one calibration value. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of performing a tilted focus testing and an exposure apparatus, capable of easily giving a tilt to the projection beam with a pattern using a tilting device, and capable of easily performing tilted defocus testing, and to provide a device manufactured in accordance with it. SOLUTION: In order to tilt the at least one reflective device to the second orientation, a device for tilting is used. A step for supplying the second projection beam with a tilt to the above first projection beam, and a step for producing a second projected radiation beam onto the target object, are provided along with a step for determining a lateral shift of the first and second projected radiation beams on the target object and, determining from the lateral shift a defocus of the target object with respect to the projected radiation beam. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an exposure device, tilt equipment, a method for conducting a tilt convergence test, and a device manufactured by the same. SOLUTION: The exposure device is equipped with a lighting system for providing a projection radiation beam, a support structure which is equipped with a pattern and supports equipment functioning to impart a pattern to a section of the projection beam, a table for holding a target object, a projection system for projecting a patterned beam on the target object, and the tilt equipment for providing a tilted projection beam. The tilt equipment is provided substantially on a pupil plane of the projection system. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To improve the compensation of wafer surface topography. SOLUTION: A lithography apparatus includes a substrate table built so that a substrate is held; a projection system constituted so that a radiation beam may be projected on a target part of the substrate through an exposure slit region; a pattern forming device constituted to form a radiation beam pattern formed by giving a pattern in the section of the radiation beam and which focuses the pattern formed radiation beam on the target area of the substrate within a depth of a focus (DOF); and a measuring system constituted so that at least the partial surface topography of the target part is measured. The projection system is configured to form a controlled exposure slit region adjusted so that a surface topography change is equal to or smaller than the depth of the focus on it by adjusting the size of the exposure slit region. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide the method of measuring information provided by a substrate. SOLUTION: This substrate comprises feature formed by lithography equipment. This method comprises the steps of projecting light beam on a marker arranged in upper part of and/or near the feature on the substrate, and detecting information provided by this marker using a sensor. Coating is arranged on the substrate. Therefore, when this coating is between the light beam and the feature, the light beam is protected from substantially becoming cause of reading incorrectly information provided by the marker by being reflected. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method and a system for performing a focus test in a lithographic apparatus. SOLUTION: In the method, a substrate includes a layer of a radiation photosensitive material, the substrate is illuminated in the lithographic apparatus by a first focus sensitive feature and a second focus feature, and the substrate is analyzed to provide results of a focus test by the first focus sensitive feature imaged on the substrate. The focus test is performed on a regularly manufactured wafer. When a prescribed statistical characteristic related to the second focus feature imaged on the substrate is entered into a prescribed limit or only when the prescribed statistical characteristic enters into the prescribed limit, the results of the focus test are accepted. The second focus feature may be a focus sensitive feature or a focus insensitive feature. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
A method for measuring information provided by a substrate (W) is disclosed. The substrate (W) includes a feature (300) that has been created by a lithographic apparatus. The method includes projecting a beam of light (100) onto a marker (200) disposed above and/or near the feature (300) on the substrate (W), and detecting information provided by the marker (200) with a sensor. A coating (330) is disposed on the substrate (W) so that the coating (330) lies between the beam of light (100) and the feature (300) to substantially prevent the beam of light (100) from being reflected by the feature (300) and causing an inaccurate readout of the information provided by the marker (200).