Abstract:
A method for forming an embedded circuit is disclosed. First, a substrate including a dielectric layer is provided. Second, the dielectric layer is entirely covered by a dummy layer. Then, the dummy layer is patterned and a trench is formed in the dielectric layer at the same time. Later, a seed layer is formed to entirely cover the dummy layer and the trench. Next, the dummy layer is removed and the seed layer covering the dummy layer is removed, too. Afterwards, a metal layer is filled in the trench to form an embedded circuit embedded in the dielectric layer.
Abstract:
A selective metal surface treatment process of a circuit board, which has a solder mask and a multiple of selective metal treatment surface areas, wherein the solder mask covers the surface of the circuit board but exposes the selective metal surface treatment areas, is provided. The selective metal surface treatment process includes using a printhead to selectively print a resist on a selective metal surface treatment area, performing a surface treatment of the other selective metal surface treatment areas, and removing the resist. A selective metal surface treatment apparatus used for performing the selective metal surface treatment process of the circuit board is also provided. Through the present invention, unnecessary waste of the materials in the process is reduced and the processing time is shortened.
Abstract:
A method for fabricating a circuit board is provided. A non-conductive material layer is provided on a core substrate, wherein the non-conductive material layer comprises a dielectric material and catalytic particles. A recessed circuit structure is then formed in the non-conductive material layer with a laser beam. Simultaneously, the catalytic particles in the recessed circuit structure are activated with aid of the laser. A buried conductive structure is then formed in the recessed circuit structure by chemical copper deposition methods.
Abstract:
A manufacturing process and an apparatus for printing imprint on defective board are provided. An automatic printing device is used for replacing operator, so as to reduce manpower and to increase the correctness and veracity of defect mark printing. The manufacturing process includes the following steps: first, an image sensor captures an image of a defect mark and transmits the image to a processing unit for data processing. Next, the data is compared, and an inkjet head is notified of the correct printing position to print ink on the customer identification mark of the printed circuit board.
Abstract:
A circuit structure includes an inner circuit layer, a first and a second dielectric layers, a first and a second conductive material layers, and a second and a third conductive layers. The first dielectric layer covers a first conductive layer of the inner circuit layer and has a first surface and first circuit grooves. The first conductive material layer is disposed inside the first circuit grooves. The second conductive layer is disposed on the first surface and includes a signal trace and at least two reference traces. The second dielectric layer covers the first surface and the second conductive layer and has a second surface and second circuit grooves. Widths of the first and the second circuit grooves are smaller than that of the reference traces. The second conductive material layer is disposed inside the second circuit grooves. The third conductive layer is disposed on the second surface.
Abstract:
A circuit board includes a metal pattern layer, a thermally conductive plate, an electrically insulating layer, and at least one electrically insulating material. The thermally conductive plate has a plane. The electrically insulating layer is disposed between the metal pattern layer and the plane and partially covers the plane. The electrically insulating material covers the plane where is not covered by the electrically insulating layer and touches the thermally conductive plate. The electrically insulating layer exposes the electrically insulating material, and a thermal conductivity of the electrically insulating material is larger than a thermal conductivity of the electrically insulating layer.
Abstract:
A method for manufacturing an embedded wiring board is provided. An activating insulation layer is formed, in which the activating insulation layer includes a plurality of catalyst particles, and covers a first wiring layer. An intaglio pattern and at least one blind via partially exposing the first wiring layer are formed on the activating insulation layer, in which some of the catalyst particles are activated and exposed in the intaglio pattern and the blind via. The activating insulation layer is dipped in a first chemical plating solution, and a solid conductive pillar is formed in the blind via through electroless plating. The activating insulation layer is dipped in a second chemical plating solution after the solid conductive pillar is formed, and a second wiring layer is formed in the intaglio pattern through the electroless plating. Components of the first chemical plating solution and the second chemical plating solution are different.
Abstract:
A circuit board including a circuit layer, a thermally conductive substrate, an insulation layer, and at least one thermally conductive material is provided. The thermally conductive substrate has a plane. The insulation layer is disposed between the circuit layer and the plane and partially covers the plane. The thermally conductive material covers the plane without covered by the insulation layer and is in contact with the thermally conductive substrate. The insulation layer exposes the thermally conductive material.
Abstract:
A method of fabricating a substrate includes following steps. First, a metallic panel having a first surface and a second surface is provided. A first half-etching process is carried out to etch the first surface of the metallic panel to a first depth so that a first patterned metallic layer is formed on the first surface. Next, a first insulating material is deposited into gaps in the first patterned metallic layer to form a first insulator. Thereafter, a second half-etching process is carried out to etch the second surface of the metallic panel to a second depth and expose at least a portion of the first insulator so that a second patterned metallic layer is formed on the second surface. The first depth and the second depth together equal the thickness of the metallic panel.
Abstract:
A method for fabricating a double-sided or multi-layer printed circuit board (PCB) by ink-jet printing that includes providing a substrate, forming a first self-assembly membrane (SAM) on at least one side of the substrate, forming a non-adhesive membrane on the first SAM, forming at least one microhole in the substrate, forming a second SAM on a surface of the microhole, providing catalyst particles on the at least one side of the substrate and on the surface of the microhole, and forming a catalyst circuit pattern on the substrate.