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    Method for creating and tuning electromagnetic bandgap structure and device
    2.
    发明公开
    Method for creating and tuning electromagnetic bandgap structure and device 审中-公开
    一种用于电磁带隙结构和相关装置的生成和协调过程

    公开(公告)号：EP1837945A1

    公开(公告)日：2007-09-26

    申请号：EP07075186.2

    申请日：2007-03-13

    Applicant: Delphi Technologies, Inc.

    Inventor： Berlin, Carl W. ,  Nair, Deepukumar M. ,  Walsh, Matthew R.

    IPC: H01P1/203

    CPC classification number: H01P1/203 ,  H01P1/2005 ,  H05K1/0233 ,  H05K1/0236 ,  H05K3/4069 ,  H05K2201/0215 ,  H05K2201/086 ,  H05K2201/09309 ,  H05K2201/09609 ,  H05K2203/0557 ,  H05K2203/104 ,  H05K2203/171

    Abstract: Tuned Electromagnetic Bandgap (EBG)devices (10, 30), and a method for making and tuning tuned EBG devices (10, 30) are provided. The method includes the steps of providing first and second overlapping substrates (32, 32a), placing magnetically alignable conductive material (36) between the substrates (32, 32a), and applying a magnetic field (44, 45) in the vicinity of the magnetically alignable conductive material (36) to align at least some of the material into conductive vias (46, 47). The method further includes the steps of physically altering via characteristics of EBG devices (10, 30) to tune the bandpass and resonant frequencies of the EBG devices (10, 30).

    Abstract translation: 提供调谐电磁带隙（EBG）装置（10，30），以及用于制备和调谐调谐EBG装置（10，30）的方法。 该方法包括提供第一和第二重叠衬底（32，32A）的步骤，放置磁性对准基板之间能够导电材料（36）（32，32A），和施加磁场（44,45）中的附近 磁性对准能够导电材料（36）以对齐的至少一些的材料的成导电通孔（46，47）。 该方法包括经由EBG设备的特性的进一步的物理改变的步骤（10，30）来调谐带通和EBG装置的共振频率（10，30）。

    Electromagnetic bandgap motion sensor device and method for making same
    5.
    发明公开
    Electromagnetic bandgap motion sensor device and method for making same 审中-公开
    电力公司Bandlücken-Bewegungssensorvorrichtung und Herstellungsverfahrendafür

    公开(公告)号：EP1933415A1

    公开(公告)日：2008-06-18

    申请号：EP07121196.5

    申请日：2007-11-21

    Applicant: Delphi Technologies, Inc.

    Inventor： Berlin, Carl W. ,  Nair, Deepukumar M. ,  Zimmermann, David W. ,  Sarma, Dwadasi H.R.

    IPC: H01Q1/44 ,  H01Q15/00 ,  G01P15/00 ,  H01P1/203

    CPC classification number: G01P15/00 ,  G01P15/08 ,  H01P1/2005 ,  H01P1/203 ,  H01Q1/44 ,  H01Q15/006

    Abstract: A high-frequency Electromagnetic Bandgap (EBG) motion sensor device (70), and a method (100) for making such a device (70) are provided. The device (70) includes a substantially planar substrate (72) including multiple conducting vias (76) forming a periodic lattice in the substrate (72). The vias (76) extend from the lower surface of the substrate (72) to the upper surface of the substrate (72). The device (70) also includes a movable defect (83) positioned in the periodic lattice. The movable defect (83) is configured to move relative to the plurality of vias (76). A resonant frequency of the EBG motion sensor device (70) varies based on movement of the movable defect (83).

    Abstract translation: 提供了高频电磁带隙（EBG）运动传感器装置（70）和用于制造这种装置（70）的方法（100）。 器件（70）包括基本上平面的衬底（72），其包括在衬底（72）中形成周期性晶格的多个导电通孔（76）。 通孔（76）从衬底（72）的下表面延伸到衬底（72）的上表面。 装置（70）还包括位于周期性晶格中的可动缺陷（83）。 可移动缺陷（83）构造成相对于多个通孔（76）移动。 EBG运动传感器装置（70）的共振频率根据可动缺陷（83）的移动而变化。

    Microwave Communication Package
    7.
    发明公开
    Microwave Communication Package 有权
    Mikrowellenkommunikationsverpackung mit elektronischen Schaltungen und Antenna

    公开(公告)号：EP2043150A2

    公开(公告)日：2009-04-01

    申请号：EP08164601.0

    申请日：2008-09-18

    Applicant: Delphi Technologies, Inc.

    Inventor： Walsh, Matthew R. ,  Nair, Deepukumar M. ,  Zimmerman, David W. ,  Haffke, Benjamen E. ,  Brandenburg, Scott D.

    IPC: H01L23/66

    CPC classification number: H01L23/66 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2924/1617 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01P5/107

    Abstract: A microwave communication package (10) is constructed on an electrically conducting base plate (12) having a first side (14) defining a base plate cavity (16), with an antenna apparatus (40) mounted on an opposite, second side (18). A dielectric substrate (20) on the first side of the base plate covers the base plate cavity; and sealing apparatus (72) contacting the dielectric substrate and the base plate completely around the base plate cavity hermetically seals the cavity. Circuitry (30, 32) mounted on a surface of the substrate within the base plate cavity includes one or more microstrip lines (54) communicating components (30) to one or more waveguides comprising openings (50) extending through the base plate; and the waveguides are coupled at their opposite ends to the antenna apparatus.

    Abstract translation: 微波通信封装（10）构造在具有限定基板腔（16）的第一侧面（14）的导电基板（12）上，天线装置（40）安装在相对的第二侧（18 ）。 基板的第一侧上的电介质基板（20）覆盖基板空腔; 并且密封装置（72）使绝缘基片和基板完全围绕底板腔体密封，密封空腔。 安装在基板腔内的基板表面上的电路（30,32）包括一个或多个微带线路（54），其将部件（30）连接到一个或多个包括延伸穿过基板的开口（50）的波导; 并且波导在其相对端耦合到天线装置。

    High-frequency electromagnetic bandgap device and method for making same
    8.
    发明公开
    High-frequency electromagnetic bandgap device and method for making same 审中-公开
    电子邮件地址和电子邮件地址和Herstellungsverfahrendafür

    公开(公告)号：EP1942557A1

    公开(公告)日：2008-07-09

    申请号：EP07120978.7

    申请日：2007-11-19

    Applicant: Delphi Technologies, Inc.

    Inventor： Berlin, Carl W. ,  Nair, Deepukumar M.

    IPC: H01Q15/00 ,  H01P1/203

    CPC classification number: H01Q15/0026 ,  H01P1/2005 ,  H01Q15/006 ,  H05K1/0216 ,  H05K2201/09309 ,  H05K2201/09609 ,  Y10T29/49016

    Abstract: A high-frequency Electromagnetic Bandgap (EBG) device (70,90), and a method (100) for making the device are provided. The device (70,90) includes a first substrate (72) including multiple conducting vias (74) forming a periodic lattice. The vias (74) ofthe first substrate (72) extend from the lower surface ofthe first substrate (72) to the upper surface of the first substrate (72). The device (70,90) also includes a second substrate (76) having multiple conducting vias (78) forming a periodic lattice. The vias (78) ofthe second substrate (76) extend from the lower surface of the second substrate (76) to the upper surface of the second substrate (76). The second substrate (76) is positioned adjacent to, and overlapping, the first substrate (72), such that the lower surface of the second substrate (76) is in contact with the upper surface of the first substrate (72), and such that a plurality of vias (78) of the second substrate (76) are in contact with a corresponding plurality of vias (74) of the first substrate (72).

    Abstract translation: 提供高频电磁带隙（EBG）装置（70,90）和制造该装置的方法（100）。 器件（70,90）包括第一衬底（72），其包括形成周期性晶格的多个导电通孔（74）。 第一基板（72）的通孔（74）从第一基板（72）的下表面延伸到第一基板（72）的上表面。 器件（70,90）还包括具有形成周期性晶格的多个导电通孔（78）的第二衬底（76）。 第二基板（76）的通路（78）从第二基板（76）的下表面延伸到第二基板（76）的上表面。 第二基板（76）定位成与第一基板（72）相邻并重叠，使得第二基板（76）的下表面与第一基板（72）的上表面接触， 所述第二基板（76）的多个通孔（78）与所述第一基板（72）的对应的多个通孔（74）接触。

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