公开(公告)号：JP2010004036A

公开(公告)日：2010-01-07

申请号：JP2009128649

申请日：2009-05-28

Applicant: Epcos Ag ,  エプコス アクチエンゲゼルシャフトEpcos Ag

Inventor： FEIEL GERNOT ,  KRUGER HANS ,  LEIDL ANTON ,  PUFF MARKUS ,  STELZL ALOIS ,  SLAKHORST JUSTINUS ,  LEHRHOFER JOHANNES ,  SEBASTIAN BRUNNER ,  HOFFMANN CHRISTIAN ,  KARTASCHEV IGOR

IPC: H05K1/18

CPC classification number: H05K3/32 ,  H01L41/0475 ,  H01L41/053 ,  H01L41/107 ,  H01L2224/16225 ,  H05K1/181 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10083 ,  H05K2201/10287 ,  H05K2201/1031 ,  H05K2201/10386 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10962 ,  H05K2201/2045 ,  Y02P70/611

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus in which vibrations of the piezoelectric element remain extensively unaffected.
SOLUTION: The apparatus is disclosed for the suspension and contacting of the piezoelectric component 1 which has multiple electrode layers. The apparatus has a substrate 2 on which electrical conductor tracks 3 are arranged. The piezoelectric component 1 is suspended above the substrate 2 and electrically contacted at a minimum of two of its edge areas, in which the component has vibration nodes 4a and 4b. The piezoelectric component 1 is spaced apart from the substrate 2 and the vibrations of the piezoelectric component 1 remain extensively unaffected by the suspension.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种其压电元件的振动保持不受影响的装置。 解决方案：公开了用于具有多个电极层的压电元件1的悬挂和接触的装置。 该装置具有布置有电导体轨道3的基板2。 压电元件1悬挂在基板2上方并且在其边缘区域中的至少两个处被电接触，其中元件具有振动节点4a和4b。 压电部件1与基板2间隔开，并且压电部件1的振动保持不受悬架的影响。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：WO2009092361A2

公开(公告)日：2009-07-30

申请号：PCT/DE2009000073

申请日：2009-01-21

Applicant: EPCOS AG ,  PAHL WOLFGANG ,  FEIERTAG GREGOR ,  LEIDL ANTON

Inventor： PAHL WOLFGANG ,  FEIERTAG GREGOR ,  LEIDL ANTON

IPC: B81B7/00

CPC classification number: B81C1/00896 ,  B81B7/0061 ,  B81B2201/0257 ,  B81C2201/053 ,  H04R2201/003

Abstract: The invention relates to a MEMS component comprising a substrate (1) in which at least one cavity (2) is present. The cavity (2) is closed toward an active side of the substrate (1). An inactive side is disposed opposite the active side of the substrate (1), and the substrate (1) is covered by a covering film (3) on the inactive side. The invention further relates to a method for producing a MEMS component comprising the following steps. In the first step, cavities (2) are produced on a substrate wafer (1), wherein the cavities (2) are closed toward an active side and comprise an opening toward an inactive side. In a second step, a covering film (3) is applied to the inactive side of the substrate wafer (1), wherein the covering film (3) is glued to the substrate wafer (1) at least in the area of the substrate wafer (1) between the cavities (2).

Abstract translation: 本发明提供一种MEMS器件，包括衬底（1），其中，至少一个空腔（2）的存在。 到衬底（1）朝向所述空腔（2）的有源侧是封闭的。 非活动侧被相对地设置在基板（1）和所述衬底的所述有源侧（1）覆盖在非活动侧与盖（3）。 此外，提供了一种制造MEMS器件，其包括以下步骤的方法。 在第一步骤中空腔的基板晶片（1），其中所述空腔（2）被关闭以有源侧并且具有开口到非活动侧上产生（2）。 在第二个步骤中，覆盖箔（3）在所述衬底晶片（1）的非活动侧被施加，其中，所述覆盖膜（3）至少在腔（2）之间的基底晶片（1）的区域到所述衬底晶片 （1）粘接。

公开(公告)号：WO2013124170A2

公开(公告)日：2013-08-29

申请号：PCT/EP2013052553

申请日：2013-02-08

Applicant: EPCOS AG

Inventor： PAHL WOLFGANG ,  LEIDL ANTON ,  PORTMANN JUERGEN ,  EICHINGER ROBERT ,  SIEGEL CHRISTIAN ,  NICOLAUS KARL ,  WASSNER THOMAS ,  SEDLMEIER THOMAS

IPC: B81C1/00

CPC classification number: B81C1/00333 ,  B81C99/0045 ,  H01L22/12 ,  H01L2224/16225 ,  H01L2924/1461 ,  H04R31/006 ,  H01L2924/00

Abstract: The invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhering a carrier film (TF) to the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partially overlap.

Abstract translation: 本发明涉及一种方法，用于制造传感器（SEN），其包含载体（TR）上定位的传感器元件（SE），所述传感器元件（SE）上配置覆盖物（AF），的步骤，其中的传感器元件（SE） 将背衬片（TF）粘附到盖（AF），并且在背衬片（TF）和盖（AF）中形成开口（SO），开口 （SO）在载体膜（TF）和盖（AF）中至少部分重叠。

公开(公告)号：WO2008155296A2

公开(公告)日：2008-12-24

申请号：PCT/EP2008057498

申请日：2008-06-13

Applicant: EPCOS AG ,  SCHAEUFELE ANSGAR ,  LEIDL ANTON ,  SAUER WOLFGANG

Inventor： SCHAEUFELE ANSGAR ,  LEIDL ANTON ,  SAUER WOLFGANG

IPC: H03H9/24

CPC classification number: H03H9/173 ,  H03H9/02133 ,  H03H9/09 ,  H03H9/174

Abstract: The invention relates to a component (1) in which the attachment of the component (1) is performed in a stress-reduced manner. The component (1) can rest on a membrane (4) or be held by a spring element (2). The membrane (4) or the spring element (2) is located above a depression (6) or an opening (7) partially bridged by the membrane (4). The membrane (4) preferably has an elastic modulus that is less than or equal to the elastic modulus of the component (1) or of the substrate (3). The component (1) can be covered in a planar manner entirely or partially on two sides with metal electrodes (10).

Abstract translation: 提出了一种装置（1），其中所述组分（1）的悬浮液在电压降为方式。 所述装置（1）可以休息或在膜（4）通过弹簧元件（2）保持。 所述膜（4）或位于凹部（6）或开口上方的弹簧元件（2）（7），其部分地由膜桥接（4）。 优选地，所述膜（4）的弹性模量小于或等于所述组件的弹性模量（1）或底物（3）。 成分（1）可以完全或部分地覆盖aufzwei两侧平面金属电极（10）。

公开(公告)号：WO2011092137A3

公开(公告)日：2011-12-22

申请号：PCT/EP2011050902

申请日：2011-01-24

Applicant: EPCOS AG ,  FEIERTAG GREGOR ,  KRUEGER HANS ,  PAHL WOLFGANG ,  LEIDL ANTON

Inventor： FEIERTAG GREGOR ,  KRUEGER HANS ,  PAHL WOLFGANG ,  LEIDL ANTON

IPC: B81C1/00

CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81C1/00238 ,  B81C1/00309 ,  G01L9/0073 ,  H01L23/10 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/27438 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/83825 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01029 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/163 ,  H01L2924/181 ,  H04R19/04 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00

Abstract: The invention relates to a miniaturized electrical component comprising an MEMS chip and an ASIC chip. The MEMS chip and the ASIC chip are disposed on top of each other; an internal mounting of MEMS chip and ASIC chip is connected to external electrical terminals of the electrical component by means of vias through the MEMS chip or the ASIC chip.

Abstract translation: 指定具有MEMS芯片和ASIC芯片的小型化电气部件。 MEMS芯片和ASIC芯片一个在另一个之上布置; MEMS芯片和ASIC芯片的内部互连经由通过MEMS芯片的通孔接触或通过ASIC芯片与电气部件的外部电连接互连。

公开(公告)号：WO2006089640A2

公开(公告)日：2006-08-31

申请号：PCT/EP2006001120

申请日：2006-02-08

Applicant: EPCOS AG ,  LEIDL ANTON ,  PAHL WOLFGANG ,  WOLFF ULRICH

Inventor： LEIDL ANTON ,  PAHL WOLFGANG ,  WOLFF ULRICH

IPC: H04R17/02

CPC classification number: H04R17/02

Abstract: The invention relates to a microphone membrane (M1) comprising two piezoelectric layers (PS1, PS2) with c-axes oriented in the same direction. A first electroconductive surface (E11) is formed in the central metal layer and subjected to a first electrical potential. The piezoelectric layers (PS1, PS2) are respectively arranged between the central metal layer (ML2) and an outer metal layer (ML1, ML3). In a preferred embodiment, the membrane (M1) has a largely symmetrical structure in terms of the layer sequence and the layer thickness thereof.

Abstract translation: 本发明涉及一种麦克风膜（M1），其包括具有同向c轴两个压电体层（PS1，PS2）。 在中间金属层包括第一导电表面（E11）形成，这是在通过一个第一电势作用。 中心金属层（ML2）和布置在外部金属层（ML1，ML3）之间设置的压电体层（PS1，PS2）。 在一个优选的变型中，膜（M1）相对于层的顺序和层的厚度，以大致对称的结构。

公开(公告)号：WO2010089261A3

公开(公告)日：2011-06-03

申请号：PCT/EP2010051113

申请日：2010-01-29

Applicant: EPCOS AG ,  PAHL WOLFGANG ,  FEIERTAG GREGOR ,  LEIDL ANTON

Inventor： PAHL WOLFGANG ,  FEIERTAG GREGOR ,  LEIDL ANTON

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/0023 ,  B81C2203/0136 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention relates to a sensor module comprising a carrier (1), at least one sensor chip (3) and at least one evaluation chip (4) that is electrically coupled to the sensor chip (3). The carrier (1) has a recess (2) wherein the sensor chip (3) is at least partially located. The evaluation chip (4) is arranged on the carrier (1) and covers the recess (2) at least partially.

Abstract translation: 传感器模块，包括一支架（1），至少一个传感器芯片（3）和至少一个评估芯片（4），其被电耦合到传感器芯片（3）。 该载体（1）具有凹部（2），其中，所述传感器芯片（3）至少部分地位于。 评价芯片（4）被布置在所述载体（1）和所述凹部（2）上至少覆盖部分上。

公开(公告)号：WO2006032335A8

公开(公告)日：2006-05-18

申请号：PCT/EP2005008964

申请日：2005-08-18

Applicant: EPCOS AG ,  HAUSER MARKUS ,  KNAUER ULRICH ,  LEIDL ANTON ,  RIHA EVELYN ,  RIHA GERD ,  ROESLER ULRIKE ,  RUILE WERNER ,  RUPPEL CLEMENS ,  SCHOLL GERD ,  WOLFF ULRICH

Inventor： HAUSER MARKUS ,  KNAUER ULRICH ,  LEIDL ANTON ,  RIHA EVELYN ,  RIHA GERD ,  ROESLER ULRIKE ,  RUILE WERNER ,  RUPPEL CLEMENS ,  SCHOLL GERD ,  WOLFF ULRICH

IPC: H03H3/10 ,  H03H9/02 ,  H03H9/08

CPC classification number: H03H9/08 ,  H03H3/10 ,  H03H9/02574 ,  H03H9/02834 ,  H03H9/02984

Abstract: The invention relates to a component which functions with the aid of acoustic waves, and which combines various measures in order to lower the temperature path, in particular the resonance frequency. Said component comprises a piezoelectric substrate (PS) having a relatively thin thickness (dp) in the region of 5 50 times the wave length capable of expanding in the material. Electrically conductive component structures (BES) are provided on the top surface and on the lower side, a compensation layer (Ks) is mechanically connected to the substrate such that mechanical deformation occurs, or that a deformation is produced in the event of a change in temperature. A Si0 2 layer having a thickness of 5 20 % of the acoustic waves capable of expanding therein is arranged over the component structures (BES).

Abstract translation: 所以建议利用声波工作，它结合了各种措施，以降低在特定的谐振频率的温度响应。 该装置包括具有从5至50倍，在材料的波长中传播的范围内的相对小的厚度（DP）的压电基片（PS）。 在顶部导电部件结构是设置在底机械牢固地与基板，补偿层（KS）连接，该机械应力被创建，或当温度变化时，一个应力积聚（BES）。 关于组件结构（BES）在其繁殖轴的厚度的声学的5〜20％由SiO _{2 布置层。}

公开(公告)号：DE102008028757A1

公开(公告)日：2009-12-31

申请号：DE102008028757

申请日：2008-06-17

Applicant: EPCOS AG

Inventor： FEIERTAG GREGOR ,  KRUEGER HANS ,  LEIDL ANTON ,  STELZL ALOIS

IPC: H01L23/538

Abstract: On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.

公开(公告)号：DE102008005686A1

公开(公告)日：2009-07-30

申请号：DE102008005686

申请日：2008-01-23

Applicant: EPCOS AG

Inventor： PAHL WOLFGANG ,  FEIERTAG GREGOR ,  LEIDL ANTON

IPC: B81B7/02 ,  B81C1/00 ,  G01L9/00 ,  H04R19/04

Abstract: A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on the inactive side.