公开(公告)号：MY126247A

公开(公告)日：2006-09-29

申请号：MYPI20022733

申请日：2002-07-18

Applicant: IBM

Inventor： ALCOE DAVID JANES ,  STUTZMAN RANDALL JOSEPH ,  WEISMAN RENEE L ,  ZITZ JEFFREY ALLEN ,  COFFIN JEFFREY THOMAS ,  GAYNES MICHAEL ANTHONY ,  HAMEL HARVEY CHARLES ,  INTERRANTE MARIO J ,  PETERSON BRENDA LEE ,  SHANNON MEGAN J ,  SABLINSKI WILLIAM EDWARD ,  SPRING CHRISTOPHER TODD

IPC: H01L23/29 ,  H01L23/552 ,  H01L23/31 ,  H05K9/00

Abstract: ELECTRONIC PACKAGES INCORPORATING EMI SHIELDING, AND PARTICULARLY SEMICONDUCTOR DEVICES WHICH INCORPORATED SEMICONDUCTOR CHIP-CARRIER STRUCTURES HAVING GROUNDED BANDS EMBEDDED THEREIN WHICH ARE ADAPTED TO REDUCE OUTGOING AND INCLUDENT EMI EMISSIONS FOR HIGH-SPEED SWITCHING ELECTRONIC PACKAGES. (FIG. 1)