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公开(公告)号：DE2650484A1
公开(公告)日：1977-06-08
申请号：DE2650484
申请日：1976-11-04
Applicant: IBM
Abstract: A magnetoresistive permalloy film is deposited upon a substrate and coated with a separating layer composed of titanium or a similar high resistivity, conductive material. A soft biasing layer of a material such as permalloy or a hard biasing material such as cobalt chromium is deposited upon the separating layer to complete a sandwich. All layers are coextensive in outline because their outlines are formed by a single etching step.
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公开(公告)号：DE2358875A1
公开(公告)日：1974-06-27
申请号：DE2358875
申请日：1973-11-27
Applicant: IBM
Inventor： BAJOREK CHRISTOPHER HENRY , KRONGELB SOL , MAYADAS ASHOK FRANK
IPC: G11C11/14 , G01R33/09 , G11B5/39 , G11B5/72 , G11C19/08 , H01C1/034 , H01C10/10 , H01F41/32 , H01L43/08 , G11B5/30
Abstract: 1391150 Magnetic heads INTERNATIONAL BUSINESS MACHINES CORP 12 Oct 1973 [30 Nov 1972] 47709/73 Heading G5R [Also in Division H3] Decrease of sensitivity due to oxidization of a magnetoresistive thin film magnetic bubble sensor or magnetic tape reading head is prevented by an overlay of Al 2 O 3 or Si 3 N 4 . The magnetoresistive material may be permalloy, or an alloy of Ni-Fe, Ni-Fe-Co, Ni-Co or Fe-Co, and have a thickness of between 200 and 1000. The overlay may be of twice this thickness. As applied to sensing magnetic bubbles 4, Fig. 1, in a magnetic plate 2, the sensor consists of a permalloy element 10 having an easy axis of magnetization in the direction of current flow from a source 12 through the element. The presence of a magnetic bubble changes the element resistance which is detected by the change of voltage across the source. A layer of a dielectric material S and a sputtered layer 18 of Al 2 O 3 or Si 3 N 4 extend over the magnetic plate and the magnetoresistive element. Similar layers are applied over the reading head 20, Fig. 2, of a moving magnetic tape 22, the magnetoresistive sensor 10 being similar to that shown in Fig. 1.
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公开(公告)号：AU6270973A
公开(公告)日：1975-05-22
申请号：AU6270973
申请日：1973-11-20
Applicant: IBM
Abstract: 1450204 Magnetic heads INTER. NATIONAL BUSINESS MACHINES CORP 9 Nov 1973 [29 Dec 1972] 52064/73 Heading G5R [Also in Division H3] A magnetic sensing head comprises a unitary structure of a layer of magneto-resistive material 16 for sensing a magnetic field and an adjacent biasing layer 14 of permantly magnetized material to bias the layer 16 magnetically to a required operating range, layers 14 and 16 being in direct contact with one another. The layers 14 and 16 may be co-planar or laminated, with the direction of magnetization, arrow M h , of bias layer 14 parallel or perpendicular to the easy axis and sense current direction, arrow I, of layer 16. Layer 16 is of permalloy material, e.g. Ni-Fe, Ni-Co or Ni-Fe-Co, and the bias layer 14 may be of ferrite. Layers 14,16, may be evaporated, sputtered or electroplated on a substrate 12 with thicknesses of 200 to 2000 and 50 to 400 Šngstroms respectively. The bias may be established due to exchange or epitaxially coupled layers 14, 16, there being direct atomic contact between the layers. In another form the biasing layer 14 is a composite layer comprising exchange or epitaxially coupled films with a magnetically soft film atomically coupled to a magnetically hard film, e.g. Ni-Fe deposited on a Fe 2 O 3 , a Fe 2 O 3 on Ni-Fe, Co or Co-rich Ni-Co on vanadium or chromium, or binary Co-P. In a further form, the bias layer, or two bias layers with the sensing layer therebetween, is or are formed by preferentially oxiding one or both surfaces of a permalloy sensor strip. Alternatively such surfaces may have localized zones with a raised coercivity produced by chemical reaction with chlorides or sulphates, etching to roughen the surfaces, or by selective deposition of materials which exchange couple to the sensing layer. The combined sensing and bias layers may be surrounded by a magnetic shield (8) in a record head, Fig. 1 (not shown). The head may be used for reading tapes, discs, magnetic ink, or sheets capable of generating and transporting magnetic bubble domains.
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公开(公告)号：DE2363123A1
公开(公告)日：1974-07-18
申请号：DE2363123
申请日：1973-12-19
Applicant: IBM
Abstract: 1450204 Magnetic heads INTER. NATIONAL BUSINESS MACHINES CORP 9 Nov 1973 [29 Dec 1972] 52064/73 Heading G5R [Also in Division H3] A magnetic sensing head comprises a unitary structure of a layer of magneto-resistive material 16 for sensing a magnetic field and an adjacent biasing layer 14 of permantly magnetized material to bias the layer 16 magnetically to a required operating range, layers 14 and 16 being in direct contact with one another. The layers 14 and 16 may be co-planar or laminated, with the direction of magnetization, arrow M h , of bias layer 14 parallel or perpendicular to the easy axis and sense current direction, arrow I, of layer 16. Layer 16 is of permalloy material, e.g. Ni-Fe, Ni-Co or Ni-Fe-Co, and the bias layer 14 may be of ferrite. Layers 14,16, may be evaporated, sputtered or electroplated on a substrate 12 with thicknesses of 200 to 2000 and 50 to 400 Šngstroms respectively. The bias may be established due to exchange or epitaxially coupled layers 14, 16, there being direct atomic contact between the layers. In another form the biasing layer 14 is a composite layer comprising exchange or epitaxially coupled films with a magnetically soft film atomically coupled to a magnetically hard film, e.g. Ni-Fe deposited on a Fe 2 O 3 , a Fe 2 O 3 on Ni-Fe, Co or Co-rich Ni-Co on vanadium or chromium, or binary Co-P. In a further form, the bias layer, or two bias layers with the sensing layer therebetween, is or are formed by preferentially oxiding one or both surfaces of a permalloy sensor strip. Alternatively such surfaces may have localized zones with a raised coercivity produced by chemical reaction with chlorides or sulphates, etching to roughen the surfaces, or by selective deposition of materials which exchange couple to the sensing layer. The combined sensing and bias layers may be surrounded by a magnetic shield (8) in a record head, Fig. 1 (not shown). The head may be used for reading tapes, discs, magnetic ink, or sheets capable of generating and transporting magnetic bubble domains.
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公开(公告)号：DE69027639D1
公开(公告)日：1996-08-08
申请号：DE69027639
申请日：1990-08-03
Applicant: IBM
Inventor： BAJOREK CHRISTOPHER HENRY , GLASER THOMAS WILLIAM , GREENBERG RICHARD , NEUBAUER JERRY LEE , REIDENBACH JOHN RALPH
IPC: G06F3/06 , G11B17/038 , G11B25/04 , G11B33/02 , G11B33/12
Abstract: High density magnetic disk storage and semiconductor module technologies are combined to provide a disk drive using a standard multilayer ceramic substrate 10 as the disk drive base support member to support spindle 14 and actuator assemblies 25 including 1 inch diameter disks. The ceramic substrate has components and VLSI chips 40, 41 mounted directly thereon to avoid use of one level of packaging and presents standard pins 44 to mount the drive using standard sockets 45 to afford economy and reliability.
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Patent Agency Ranking
公开(公告)号：DE3166953D1
公开(公告)日：1984-12-06
申请号：DE3166953
申请日：1981-07-21
Applicant: IBM
Inventor： BAJOREK CHRISTOPHER HENRY , CHANCE DUDLEY AUGUSTUS , HO CHUNG WEN
IPC: H01L23/12 , H01G4/12 , H01G4/38 , H01L23/15 , H01L23/538 , H01L23/64 , H01L25/00 , H01L27/00 , H05K1/03 , H05K1/09 , H05K1/16 , H05K3/46 , H05K3/00 , H01G4/40
Abstract: A laminated ceramic sheet printed circuit carrier (1) for supporting semiconductor integrated circuit chips (11) has a coefficient of thermal expansion matched to that of the chips (11) as well as a high value of capacitance. The carrier (1) provides both mechanical and electrical connections to the chip (11). The carrier (1) contains a matrix of dot capacitors (9) formed between laminated layers (2) of ceramic material. In some cases, conductive layers are provided on the upper and lower surfaces of a thin film of ceramic material in which dielectric bodies are interspersed in an array of openings therein. The resultant ceramic dielectric combination has a coefficient of thermal expansion which matches the coefficient of thermal expansion of the silicon chip and the substrate thereby relieving stress upon the solder ball joints between the interposer and both the chip and the substrate. This minimizes the mechanical stress upon the solder ball joints during thermal cycling of the structure. Alternatively, an array of multilayer ceramic capacitors has an array of dielectric bodies located within holes in ceramic layers between capacitor plates, or entire arrays of capacitors are formed in the space between ceramic sheets. … In addition to its principal application in a chip carrier, other applications are in chip interposers and discrete capacitors for mounting on chip carriers.
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公开(公告)号：DE3177003D1
公开(公告)日：1989-04-13
申请号：DE3177003
申请日：1981-06-03
Applicant: IBM
IPC: H05K1/18 , H01L23/538 , H01L23/64 , H05K1/03 , H05K1/09 , H05K1/16 , H05K3/46 , H05K3/36 , H01G4/30 , H01L23/12 , H01L23/56
Abstract: A carrier for microcircuit LSI chips (180) includes stacks (11) of parallel ceramic sheets (14) carrying thin conductive capacitor plates (20) laminated in a ceramic structure, in which the capacitor plates serve as power distribution conductors. Groups of plates provide electrical connection (19,21) beteeen power supply strips (16) and conductor straps (95, 98) which are connected to solder bonds (181) for the chips. This provides capacitance to smooth the power supply to high switching speed VSL1 chips. Stacks (11) of laminated ceramic capacitors serving as power planes are inserted into slots in laminated ceramic sheets. Signal vias (42) are provided about the periphery of the power planes. A highly parallel distribution of current is provided by means of horizontal power conducting straps which reduce voltage fluctuations, electrical resistance, and current per via.
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公开(公告)号：DE3070244D1
公开(公告)日：1985-04-04
申请号：DE3070244
申请日：1980-11-18
Applicant: IBM
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公开(公告)号：DE68919461T2
公开(公告)日：1995-05-24
申请号：DE68919461
申请日：1989-08-03
Applicant: IBM
IPC: G11B5/39
Abstract: A shielded magnetoresistive (MR) sensor in which the first shield (12) is of sendust or super sendust and the second shield is of permalloy is made by the steps of depositing a layer of sendust or super sendust to form a first shield; heat treating the sendust layer at a temperature greater than 400 DEG C; depositing a first electrically insulating layer (18) ; depositing, in the presence of a magnetic field, a MR layer (20) ; depositing a second layer (26) of electrically insulating material; and, depositing a layer (28) of permalloy to form the second shield.
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公开(公告)号：DE68919461D1
公开(公告)日：1995-01-05
申请号：DE68919461
申请日：1989-08-03
Applicant: IBM
IPC: G11B5/39
Abstract: A shielded magnetoresistive (MR) sensor in which the first shield (12) is of sendust or super sendust and the second shield is of permalloy is made by the steps of depositing a layer of sendust or super sendust to form a first shield; heat treating the sendust layer at a temperature greater than 400 DEG C; depositing a first electrically insulating layer (18) ; depositing, in the presence of a magnetic field, a MR layer (20) ; depositing a second layer (26) of electrically insulating material; and, depositing a layer (28) of permalloy to form the second shield.
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