Controlled spalling of group III nitrides containing an embedded spall releasing plane

    公开(公告)号:GB2521517A

    公开(公告)日:2015-06-24

    申请号:GB201418871

    申请日:2014-10-23

    Applicant: IBM

    Abstract: A spall releasing plane 15 is formed in the middle of and embedded within a Group III nitride material layer 14. The spall releasing plane includes a material that has a different strain, a different structure and a different composition compared with the Group III nitride material portions and can be formed by adding impurities during the vapour deposition process. Device layer 16, stressor layer 22 and handle 24 are deposited onto the upper surface of the material layer. An edge exclusion layer 18 and adhesion layer 20 can be added above the device layer to aide in the spalling process. This method overcomes the issue of having a lattice mismatch when using Group III nitride materials, e.g. GaN, AlN, InGaN.

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    发明专利
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    公开(公告)号:AT464654T

    公开(公告)日:2010-04-15

    申请号:AT01972244

    申请日:2001-09-27

    Applicant: IBM

    Abstract: A method for forming strained Si or SiGe on relaxed SiGe on insulator (SGOI) is described incorporating growing epitaxial Si1-yGey layers on a semiconductor substrate, implanting hydrogen into a selected Si1-yGey layer to form a hydrogen-rich defective layer, smoothing surfaces by Chemo-Mechanical Polishing, bonding two substrates together via thermal treatments and separating two substrates at the hydrogen-rich defective layer. The separated substrates may have its upper surface smoothed by CMP for epitaxial deposition of relaxed Si1-yGey, and strained Si1-yGey depending upon composition, strained Si, strained SiC, strained Ge, strained GeC, and strained Si1-yGeyC.

    Controlled spalling of group III nitrides containing an embedded spall releasing plane

    公开(公告)号:GB2521517B

    公开(公告)日:2015-12-30

    申请号:GB201418871

    申请日:2014-10-23

    Applicant: IBM

    Abstract: A spall releasing plane is formed embedded within a Group III nitride material layer. The spall releasing plane includes a material that has a different strain, a different structure and a different composition compared with the Group III nitride material portions that provide the Group III nitride material layer and embed the spall releasing plane. The spall releasing plane provides a weakened material plane region within the Group III nitride material layer which during a subsequently performed spalling process can be used to release one of the portions of Group III nitride material from the original Group III nitride material layer. In particular, during the spalling process crack initiation and propagation occurs within the spall releasing plane embedded within the original Group III nitride material layer.

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