公开(公告)号：DE69105753D1

公开(公告)日：1995-01-19

申请号：DE69105753

申请日：1991-02-01

Applicant: IBM

Inventor： CHANG KENNETH ,  CZORNYJ GEORGE ,  FAROOQ MUKTA ,  KUMAR ANANDA ,  PITTLER MARVIN ,  STEIMEL HEINZ

IPC: H01L23/12 ,  H01L21/48 ,  H01L21/768 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38 ,  H05K3/46 ,  H01L23/538

公开(公告)号：DE69105753T2

公开(公告)日：1995-05-24

申请号：DE69105753

申请日：1991-02-01

Applicant: IBM

Inventor： CHANG KENNETH ,  CZORNYJ GEORGE ,  FAROOQ MUKTA ,  KUMAR ANANDA ,  PITTLER MARVIN ,  STEIMEL HEINZ

IPC: H01L23/12 ,  H01L21/48 ,  H01L21/768 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38 ,  H05K3/46 ,  H01L23/538

公开(公告)号：CA1100091A

公开(公告)日：1981-04-28

申请号：CA313482

申请日：1978-10-16

Applicant: IBM

Inventor： CZORNYJ GEORGE ,  SWALEN JEROME D ,  WU ANTHONY W

IPC: B05D7/14 ,  B05D1/18 ,  B05D1/20 ,  B05D5/08 ,  B05D7/24 ,  C07C57/52 ,  C08J7/10

Abstract: PREPARATION OF POLYMER MONOMOLECULAR FILMS of the Invention A substrate surface is lubricated or passivated by applying thereto a monomolecular layer of a compound having the formula (CF3 - (CF2)n - (CH2)m - X - COO ?2 M or (CF3 - (CF2)n - (CH2)m - X - (CH2)L - COO ?2 M wherein n is 6 to 20, each of m and L is 6 to 10, X is -CH=CH-or -C?C-, and M is a divalent cation, and polymerizing said layer in situ.

公开(公告)号：DE3586231D1

公开(公告)日：1992-07-23

申请号：DE3586231

申请日：1985-09-24

Applicant: IBM

Inventor： ARAPS CONSTANCE JOAN ,  CZORNYJ GEORGE ,  KANDETZKE STEVEN M ,  TAKACS MARK ANTHONY

IPC: C08G73/10 ,  H01L21/31 ,  H01L21/312 ,  H01L21/762 ,  H01L21/76

Abstract: The photosensitivity of a particular group of polymerizable oligomers permits radiation induced polymerization. This photosensitivity thus enables the polymerizable oligomers to be used as photoresists in general, and facilitates in situ cure when the oligomers are used to produce isolation films and trenches in semiconductor devices. The photosensitivity further enables use of a simplified planarization process when the polymerizable oligomers are used in the fabrication of semiconductor structures and integrated circuit components. Specifically, the polymerizable oligomers are comprised of poly N-substituted amic acids, the corresponding amic esters, the corresponding amic isoimides, the corresponding amic imides or mixtures thereof, wherein the end groups of the polymerizable oligomer are end-capped with a vinyl or acetylenic end group.

公开(公告)号：DE3277344D1

公开(公告)日：1987-10-22

申请号：DE3277344

申请日：1982-05-28

Applicant: IBM

Inventor： BAISE ARNOLD IVAN ,  CZORNYJ GEORGE ,  WU ANTHONY WAI

IPC: H01L23/29 ,  G03F7/025 ,  G03F7/09 ,  G03F7/11 ,  H01L21/027 ,  H01L21/312 ,  H01L23/31 ,  H01L21/56 ,  G03C1/68

Abstract: A protective coating is formed on an integrated circuit device by coating the device with a solution of acetylene terminated, branched polyphenylene prepolymer material and heating the material to form a thermoset crosslinked polymer layer. Selectively patterned portions may be provided when, after the coating step and prior to the heating step, the steps of imagewise exposure to radiation and rinsing with an organic solvent are carried out.

公开(公告)号：DE2860918D1

公开(公告)日：1981-11-05

申请号：DE2860918

申请日：1978-12-01

Applicant: IBM

Inventor： CZORNYJ GEORGE ,  SWALEN JEROME DOUGLAS ,  WU ANTHONY WAI

IPC: B05D7/14 ,  B05D1/18 ,  B05D1/20 ,  B05D5/08 ,  B05D7/24 ,  C07C57/52 ,  C08F20/04 ,  C09D3/78

Abstract: A substrate surface is lubricated or passivated by applying thereto a monomolecular layer of a compound having the formula (CF3-(CF2)n-(CH2)m-X-COO)2M or (CF3-(CF2)n-(CH2)m-X-(CH2)L-COO)2M wherein n is 6 to 20, each of m and L is 6 to 10, X is -CH=CH- or -C IDENTICAL C-, and M is a divalent cation, and polymerizing said layer in situ.