公开(公告)号：JPH10107066A

公开(公告)日：1998-04-24

申请号：JP25532197

申请日：1997-09-19

Applicant: IBM

Inventor： DANIEL GEORGE BERGER ,  GUY PAUL BREULETTE ,  DAVID HERSH DANOVICI ,  PETER ALFRED GRUBER ,  BRUCE LEE HUMPHREY ,  MICHAEL LIER ,  WILLIAM THOMAS MOTSCHIF ,  CARLOS JUAN SAMBUSETTI

IPC: B23K35/26 ,  H01L21/60 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a method for forming an interconnecting section on an electronic device. SOLUTION: The very small recessed sections of a molding tool 10 having the recessed sections are filled up with molten solder 22 by making the solder 22 to flow and the solder 22 is solidified. Then the tool 10 is aligned with a wafer 30 carrying chips to which solder bumps 40 having a high melting point are stuck. Consequently, each very small recessed section of the tool 10 is aligned with the solder bump 40 on each chip. After alignment, the solder in the recessed sections are transferred to the top sections of the solder bumps 40 by passing an aligned molding tool 10/wafer assembly 50 through a reflow furnace. Therefore, two-layer metallic composition bumps are formed of the two kinds of different solder alloys.

公开(公告)号：JP2002134926A

公开(公告)日：2002-05-10

申请号：JP2001193284

申请日：2001-06-26

Applicant: IBM

Inventor： DANIEL GEORGE BERGER ,  FAROOQ SHAJI ,  HERRON LESTER WYNN ,  HUMENIK JAMES N ,  KNICKERBOCKER JOHN ULRICH ,  PASCO ROBERT WILLIAM ,  PERRY CHARLES H ,  SACHDEV KRISHNA G

IPC: G02B6/12 ,  B32B18/00 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H05K1/03 ,  H05K1/05 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide an organic inorganic compound electronic substrate which can be manufactured at a low cost, a compound electronic substrate wherein relative permitivity, impedance, CTE, double refraction and mutual connection stress are low, and package card reliability is high, a compound electronic substrate wherein Tg is high and thermal stability is superior, and a compound electronic substrate having low hygroscopicity. SOLUTION: A compound electronic and/or optical substrate contains polymer material and ceramic material, and has relative permitivity lower than 4 and coefficient of thermal expansion of 8-14 ppm/ deg.C at 100 deg.C. This compound substrate is composed of polymer material containing ceramic filler material or ceramic material containing polymer filler material.

公开(公告)号：SG103294A1

公开(公告)日：2004-04-29

申请号：SG200103425

申请日：2001-06-09

Applicant: IBM

Inventor： DANIEL GEORGE BERGER ,  SHAJI FAROOQ ,  LESTER WYNN HERRON ,  JAMES N HUMENIK ,  JOHN ULRICH KNICKERBOCKER ,  ROBERT WILLIAM PASCO ,  CHARLES H PERRY ,  KRISHNA GANDHI SACHDEV

IPC: B32B15/04 ,  G02B6/43 ,  H01L23/14 ,  H01L23/15 ,  H01L23/498 ,  H01L23/538