Abstract:
PROBLEM TO BE SOLVED: To provide a material for forming a near-infrared absorptive film used in optical auto-focusing for enabling high-accuracy auto-focusing during an optical lithography process used in semiconductor fabrication, and to provide a laminate film comprising a near-infrared absorptive film which is formed by the above material, and a photoresist film.SOLUTION: The material for forming a near-infrared absorptive film contains (A) at least one near-infrared absorptive dye of formula (1) [wherein R1 and R2 are each a monovalent hydrocarbon group; k is an integer of 0 to 5; m is 0 or 1; n is 1 or 2; Z is O, S or C(R')(R"); R' and R" are each H or a monovalent hydrocarbon group; and Xis an anion], (B) at least one polymeric compound and (C) at least one solvent. By using for the optical lithography, the laminate film including the near-infrared absorptive film formed by the material and the photoresist film, the detection accuracy of optical auto-focusing is improved, the projected image of the optical lithography becomes clear, and a better photoresist pattern can be formed by improved contrast.
Abstract:
A curable liquid formulation containing at least (i) one or more near-infrared absorbing triphenylamine -based dyes, and (ii) one or more casting solvents. The invention is also directed to solid near- infrared absorbing films composed of crosslinked forms of the curable liquid formulation. The invention is also directed to a microelectronic substrate containing a coating of the solid near-infrared absorbing film as well as a method for patterning a photoresist layer coated on a microelectronic substrate in the case where the near-infrared absorbing film is between the microelectronic substrate and a photoresist film.
Abstract:
A photoacid generator compound P+ A-, comprises an antenna group P+ comprising a cation that generates protons upon interaction with light, and A- comprising a weakly coordinating peracceptor-substituted aromatic anion that does not contain fluorine or semi-metallic elements such as boron. In one embodiment, such anions comprise the following compounds 4, 5, 6 and 7, wherein E comprises an electron- withdrawing group and the removal of one proton generates aromaticity. P+ comprises an onium cation that decomposes into a proton and other components upon interaction with photons. P+ may comprise an organic chalcogen onium cation or a halonium cation, wherein the chalcogen onium cation in another embodiment may comprises an oxonium, sulfonium, selenium, tellurium, or onium cation, and the halonium cation may comprise an iodonium, chlorine or bromine onium cation. A novel compound comprises TPS CN5. A photolithographic formulation comprises the photoacid generator in combination with a photolithographic composition such as a photolithographic polymer. The formulation, when on a substrate, is exposed to optical lithographic radiation or ArF (193 nm) or KrF (248 nm) radiation, and developed. A product comprises an article of manufacture made by the method of the invention.
Abstract translation:光酸产生剂化合物P + A-包含天线基团P +,所述天线基团P +包含在与光相互作用时产生质子的阳离子,和包含不包含氟或半金属元素如硼的弱配位的被取代基取代的芳族阴离子的A-。 在一个实施方案中,这样的阴离子包含以下化合物4,5,6和7,其中E包含吸电子基团并且去除一个质子产生芳香性。 P +包含鎓阳离子,其在与光子相互作用时分解成质子和其他组分。 P +可以包含有机硫属元素鎓阳离子或卤化鎓阳离子,其中在另一个实施方案中硫属元素鎓阳离子可以包含氧鎓,锍,硒,碲或鎓阳离子,并且所述卤鎓阳离子可以包含碘鎓,氯或溴鎓阳离子 。 一种新型化合物包含TPS CN5。 光刻制剂包含与光刻组合物例如光刻聚合物组合的光酸产生剂。 当在基材上时,该配方暴露于光学光刻辐射或ArF(193nm)或KrF(248nm)辐射下并显影。 产品包括通过本发明的方法制造的制品。
Abstract:
Ein Silizium enthaltendes, antireflektierendes Beschichtung-(SiARC, Silicon-containing Antireflective Coating-)Material wird auf einem Substrat aufgetragen. Das SiARC-Material, das ein Basispolymer enthält, kann ein Bor-Silikat-Polymer enthalten, das Silsesquioxan enthält. Es wird eine Ätzfolge verwendet, die eine erste Nassätzung aufweist, wobei eine basische Lösung verwendet wird, eine zweite Nassätzung, wobei eine saure Lösung verwendet wird, und eine dritte Nassätzung, wobei eine andere basisches Lösung verwendet wird. Die erste Nassätzung kann dazu verwendet werden, das Bor-Silikat-Polymer aufzubrechen, und die zweite Nassätzung kann das Basispolymermaterial entfernen, und die dritte Nassätzung kann das restliche Bor-Silikat-Polymer und andere Restmaterialien entfernen. Das SiARC-Material kann von einem Substrat mittels der Ätzfolge entfernt werden, und das Substrat kann zu Monitoring-Zwecken wiederverwendet werden.
Abstract:
Embodiments include a silicon-containing antireflective material including a silicon- containing base polymer, a non-polymeric silsesquioxane material, and a photoacid generator. The silicon-containing base polymer may contain chromophore moieties, transparent moieties, and reactive sites on an SiOx background, where x ranges from approximately 1 to approximately 2. Exemplary non-polymeric silsesquioxane materials include polyhedral oligomeric silsesquioxanes having acid labile side groups linked to hydrophilic groups Exemplary acid labile side groups may include tertiary alkyl carbonates, tertiary alkyl esters, tertiary alkyl ethers, acetals and ketals, Exemplary hydrophilic groups may include phenols, alcohols, carboxylic acids, amides, and sulfonamides. Embodiments further include lithographic structures including an organic anti-reflective layer, the above-described silicon-containing anti-reflective layer above the organic anti-reflective layer, and a photoresist layer above the above-described silicon-containing anti-reflective layer. Embodiments further include a method of forming a lithographic structure utilizing the above-described silicon-containing anti- reflective layer.
Abstract:
The present invention relates to a near-infrared (NIR) film composition for use in vertical alignment and correction in the patterning of integrated semiconductor wafers and a pattern forming method using the composition. The NIR absorbing film composition includes a NIR absorbing dye having a polymethine cation and a crosslinkable anion, a crosslinkable polymer and a crosslinking agent. The patterning forming method includes aligning and focusing a focal plane position of a photoresist layer by sensing near- infrared emissions reflected from a substrate containing the photoresist layer and a NIR absorbing layer formed from the NIR absorbing film composition under the photoresist layer. The NIR absorbing film composition and the pattern forming method are especially useful for forming material patterns on a semiconductor substrate having complex buried topography.
Abstract:
A curable liquid formulation comprising: (i) one or more near-infrared absorbing polymethine dyes; (ii) one or more crosslinkable polymers; and (iii) one or more casting solvents. The invention is also directed to solid near-infrared absorbing films composed of crosslinked forms of the curable liquid formulation. The invention is also directed to a microelectronic substrate containing a coating of the solid near-infrared absorbing film as well as a method for patterning a photoresist layer coated on a microelectronic substrate in the case where the near-infrared absorbing film is between the microelectronic substrate and a photoresist film.
Abstract:
Härtbare flüssige Formulierung, umfassend wenigstens (i) einen oder mehrere Nahinfrarot-absorbierende Farbstoffe auf Triphenylaminbasis, und (ii) ein oder mehrere Gießlösungsmittel. Die Erfindung betrifft auch Nahinfrarotabsorbierende Dünnschichten, die aus vernetzten Formen der härtbaren flüssigen Formulierung zusammengesetzt sind. Die Erfindung betrifft auch ein mikroelektronisches Substrat, das eine Schicht der festen, Nahinfrarot-absorbierenden Dünnschicht umfasst, und ein Verfahren zum Strukturieren einer Fotolackschicht, die auf ein mikroelektronisches Substrat geschichtet ist, falls die nahinfrarot-absorbierende Dünnschicht zwischen dem mikroelektronischen Substrat und einer Fotolack-Dünnschicht angeordnet ist.
Abstract:
A curable liquid formulation containing at least (i) one or more near-infrared absorbing triphenylamine -based dyes, and (ii) one or more casting solvents. The invention is also directed to solid near- infrared absorbing films composed of crosslinked forms of the curable liquid formulation. The invention is also directed to a microelectronic substrate containing a coating of the solid near-infrared absorbing film as well as a method for patterning a photoresist layer coated on a microelectronic substrate in the case where the near-infrared absorbing film is between the microelectronic substrate and a photoresist film.