Abstract:
PROBLEM TO BE SOLVED: To provide a condensed aromatic structure and a method for photolithographic application. SOLUTION: A resist composition and a method for forming a patterned feature on a substrate are provided. The composition comprises a molecular glass having at least one condensed polycyclic moiety and at least one base soluble functional group protected with an acid labile protecting group, and a photosensitive acid generator. The method includes providing a composition including a photosensitive acid generator and a molecular glass having at least one condensed polycyclic moiety and at least one base soluble functional group protected with an acid labile protecting group, forming a film of the composition on the substrate, patternwise imaging the film, wherein at least one region of the film is exposed to radiation or a beam of particles, resulting in production of an acid catalyst in the exposed region, baking the film, developing the film, resulting in removal of base-soluble exposed regions, wherein a patterned feature from the film remains following the removal. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive photoresist composition that exhibits excellent solubility in an aqueous base developer, and its usage. SOLUTION: The positive photoresist composition contains a radiation sensitive acid generator and a polymer, wherein this polymer can contain a first repeating unit derived from a sulfonamide monomer containing a fluorosulfonamido functional group and a second repeating unit that can contain an acid-labile pendant moiety. This positive photoresist composition can further contain at least one selected from a solvent, a quenching agent and a surfactant. A pattern formed photoresist layer produced from this positive photoresist composition is formed on a substrate, this positive photoresist layer is exposed with an irradiation pattern for imaging, and parts exposed with the irradiation pattern for imaging in the positive photoresist layer are removed, whereby the corresponding pattern formed substrate can be exposed and is prepared for subsequent processing of semiconductor device production. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
A curable liquid formulation containing at least (i) one or more near-infrared absorbing triphenylamine -based dyes, and (ii) one or more casting solvents. The invention is also directed to solid near- infrared absorbing films composed of crosslinked forms of the curable liquid formulation. The invention is also directed to a microelectronic substrate containing a coating of the solid near-infrared absorbing film as well as a method for patterning a photoresist layer coated on a microelectronic substrate in the case where the near-infrared absorbing film is between the microelectronic substrate and a photoresist film.
Abstract:
The present invention discloses an antireflective coating composition for applying between a substrate surface and a positive photoresist composition. The antireflective coating composition is developable in an aqueous alkaline developer. The antireflective coating composition comprises a polymer, which comprises at least one monomer unit containing one or more moieties selected from the group consisting of a lactone, maleimide, and an N-alkyl maleimide; and at least one monomer unit containing one or more absorbing moieties. The polymer does not comprise an acid labile group. The present invention also discloses a method of forming and transferring a relief image by using the inventive antireflective coating composition in photolithography.
Abstract:
Fluorine-free photoacid generators and photoresist compositions containing fluorine-free photoacid generators are enabled as alternatives to PFOS/PFAS photoacid generator-containing photoresists. The photoacid generators are characterized by the presence of a fluorine-free aromatic sulfonate anionic component having one or more electron withdrawing groups. The photoacid generators preferably contain a fluorine-free onium cationic component, more preferably a sulfonium cationic component. The photoresist compositions preferably contain an acid sensitive imaging polymer having a lactone functionality. The compositions are especially useful for forming material patterns using 193nm (ArF) imaging radiation.
Abstract:
PROBLEM TO BE SOLVED: To provide a composition suitable for use as a top surface antireflection coating and barrier layer for 193 nm dry lithography. SOLUTION: The composition suitable for use as a top surface antireflection coating and barrier layer for 193 nm lithography is soluble in an aqueous base solution and has a low refractive index at 193 nm. The composition contains a polymer comprising a main chain and a fluorinated half ester moiety and soluble in an aqueous base solution. The fluorinated half ester moiety is a pendant group from the main chain. The present invention also discloses a method for forming a patterned layer on a substrate by using the composition in lithography. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an underlayer composition compatible with a typical photoresist and having optical properties to be used as an ARC (antireflection coating). SOLUTION: The composition suitable for use as a planarizing underlayer in a multilayer lithographic process is disclosed. The composition comprises a polymer containing a heterocyclic aromatic moiety. In another aspect, the composition further comprises an acid generator. In yet another aspect, the composition further comprises a crosslinker. The composition provides a planarizing underlayer having outstanding optical properties, mechanical properties, and etching selectivity properties. The present invention also encompasses a lithographic structure containing the underlayer prepared from the above composition, a method of making the lithographic structure, and a method of using the lithographic structure to pattern an underlying material layer on a substrate. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a negative photoresist, an exposed photoresist of which is free of swelling and/or micro-bridging when dissolved in a developer solution, in order to avoid limit of spatial resolution in photolithography use. SOLUTION: A negative photoresist composition is provided which includes: a radiation sensitive acid generator; an additive; and a resist polymer derived from at least a first monomer including a hydroxyl group. The first monomer may be acidic or approximately pH neutral. The resist polymer may be further derived from a second monomer having an aqueous base soluble moiety. The additive has a moiety typified by an N-alkoxymethyl group and may include one or more alicyclic structures. The acid generator is adapted to generate an acid upon exposure to radiation. The resist polymer is adapted to chemically react with the additive in the presence of the acid to generate a non-crosslinking reaction product that is insoluble in an aqueous alkaline developer solution. COPYRIGHT: (C)2005,JPO&NCIPI