3.
    发明专利
    未知

    公开(公告)号:DE3684504D1

    公开(公告)日:1992-04-30

    申请号:DE3684504

    申请日:1986-04-11

    Applicant: IBM

    Abstract: A film forming, radiation sensitive resist composition having improved thermal stability and a reduced dissolution rate in developer solutions, comprised of a sensitizer and a polyalkenyl phenol such as a polyvinyl phenol cross-linked, prior to irradiation, with a polyfunctional cross-linking agent such as dimethylol p-cresol or hexamethylene tetramine and a process for the production of a resist image using said composition is described.

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