ELECTRONIC-CIRCUIT PACKAGE AS WELL AS APPARATUS AND METHOD FOR MOLDING AND WORKING OF ITS CONDUCTOR

    公开(公告)号:JPH06104374A

    公开(公告)日:1994-04-15

    申请号:JP24732291

    申请日:1991-09-26

    Applicant: IBM

    Abstract: PURPOSE: To provide an electronic circuit packaging interface adaptable to high conductor density, which connects a plurality of conductors and a plurality of contact parts formed on the surface of a substrate, wherein the conductors are provided in rows on a conductor carrier at narrow intervals. CONSTITUTION: Conductors 6 and 7 extending from an edge 9 of a carrier 5 in a cantilever fashion are connected to contact parts 3 and 4. The conductors neighboring each other are connected to the contact parts, which are formed at positions having different distances 10 and 11 from the carrier. Each conductor is extended on a supporting surface to the vicinity of the contact part to which the conductor is connected, bent at the vicinity and extended towards a substrate 2 at a generally vertical angle. Further, the conductor is bent near the contact part, and the tip of the conductor is horizontally extended along the contact part.

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