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    3.
    发明专利
    未知

    公开(公告)号：DE3781370T2

    公开(公告)日：1993-04-01

    申请号：DE3781370

    申请日：1987-05-05

    Applicant: IBM

    Inventor： JACOBS SCOTT LAURENCE ,  NIHAL PERWAIZ ,  OZMAT BURHAN ,  SCHNURMANN HENRI DANIEL

    IPC: H01L23/52 ,  H01L23/538 ,  H01L27/00

    Abstract: A high speed, high performance integrated circuit packaging structure that may be used for emulating wafer scale integration structures. The preferred embodiment comprises an interposer (9) having a base substrate having alternating insulation and conductive layers thereon, wherein a plurality of the conductive layers are wiring means which are adapted for maintaining an extremely low noise level in the package. The low noise level and low resistance and capacitance of the wiring means allows a plurality of discrete semiconductor segments (32) to be mounted on and interconnected by the integrated circuit package with a significantly reduced number of drivers and receivers than required by Rent's Rule. Each integrated circuit structure (9) of the present invention emulates a large chip or wafer scale integration structure in performance without having to yield the large chip or wafer, and without redundancy schemes. A plurality of these integrated circuit packaging structures (9) are combined by decals (29, 31) to form a central processing unit (1) of a computer or a portion thereof. In an alternate preferred embodiment, the base substrate of the interposer is made of silicon and any required drivers are formed therein, thus substantially eliminating the need for any drivers on each of the discrete semiconductor segments (32).

    5.
    发明专利
    未知

    公开(公告)号：DE3781370D1

    公开(公告)日：1992-10-01

    申请号：DE3781370

    申请日：1987-05-05

    Applicant: IBM

    Inventor： JACOBS SCOTT LAURENCE ,  NIHAL PERWAIZ ,  OZMAT BURHAN ,  SCHNURMANN HENRI DANIEL

    IPC: H01L23/52 ,  H01L23/538 ,  H01L27/00

    Abstract: A high speed, high performance integrated circuit packaging structure that may be used for emulating wafer scale integration structures. The preferred embodiment comprises an interposer (9) having a base substrate having alternating insulation and conductive layers thereon, wherein a plurality of the conductive layers are wiring means which are adapted for maintaining an extremely low noise level in the package. The low noise level and low resistance and capacitance of the wiring means allows a plurality of discrete semiconductor segments (32) to be mounted on and interconnected by the integrated circuit package with a significantly reduced number of drivers and receivers than required by Rent's Rule. Each integrated circuit structure (9) of the present invention emulates a large chip or wafer scale integration structure in performance without having to yield the large chip or wafer, and without redundancy schemes. A plurality of these integrated circuit packaging structures (9) are combined by decals (29, 31) to form a central processing unit (1) of a computer or a portion thereof. In an alternate preferred embodiment, the base substrate of the interposer is made of silicon and any required drivers are formed therein, thus substantially eliminating the need for any drivers on each of the discrete semiconductor segments (32).

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