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    INTEGRATED CIRCUIT ELEMENT AND ITS MANUFACTURING PROCESS
    1.
    发明专利
    INTEGRATED CIRCUIT ELEMENT AND ITS MANUFACTURING PROCESS 失效

    公开(公告)号：JPH10135199A

    公开(公告)日：1998-05-22

    申请号：JP25816397

    申请日：1997-09-24

    Applicant: IBM

    Inventor： JAMES LUPTON HEDRICK ,  ROBERT DENNIS MILLER ,  SATEIANARAYAN AYANGAA SURINIBA

    IPC: C08G73/10 ,  H01L21/312 ,  H01L21/768 ,  H01L23/522

    Abstract: PROBLEM TO BE SOLVED: To obtain an integrated circuit device having a low dielectric constant by forming a dielectric material containing hardened polyamic acid ester adjacently to metallic circuit wiring for interconnection on a substrate. SOLUTION: Metallic circuit wiring 4 and a dielectric material 6 are provided on the surface of a substrate 2 and vertical metallic studs 8 are provided in the substrate 2. The material 6 which is put on, around, and/or between the wiring 4 is constituted of imidized polyamic acid ester, containing (RO)m (R")n SiR' as an end group, where m, n, R and R', and R" respectively represent 1, 2, or 3, m+n=3, hydrocarbyl groups, and a hydride or hydrocarbyl group. This dielectric composition presents a low coefficient of thermal expansion of 1000×10 at a high temperature. Therefore, an integrated circuit element having a high mechanical characteristic, a high frictional characteristic, a highly uniform optical characteristics, and a high dielectric characteristic can be obtained, because the cracking of films can be avoided during succeeding heat treatment processes.

    Porous dielectric material and method for manufacturing therefor
    2.
    发明专利
    Porous dielectric material and method for manufacturing therefor 有权
    多孔电介质材料及其制造方法

    公开(公告)号：JP2009120843A

    公开(公告)日：2009-06-04

    申请号：JP2008329614

    申请日：2008-12-25

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： CRAIG JOHN HOKER ,  JAMES LUPTON HEDRICK ,  LEE VICTOR YEE-WAY ,  ROBERT DENNIS MILLER

    IPC: C08J3/12 ,  C08J9/26 ,  C08J3/24 ,  C08J3/28 ,  C08J9/04 ,  H01L21/312 ,  H01L21/316 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/14 ,  H01L23/522

    CPC classification number: H01L21/316 ,  C08J3/24 ,  H01L21/312

    Abstract: PROBLEM TO BE SOLVED: To provide a porous dielectric material used in electronic devices such as integrated circuits. SOLUTION: Crosslinked particles are manufactured by activating crosslinkable groups in synthetic polymer molecules. The crosslinkable groups are inert until activated and, when activated, undergo an irreversible intramolecular crosslinking reaction to form crosslinked particles. Further, the crosslinked particles are intermolecularly deactivated to the polymer molecules under the crosslinking condition. The crosslinked particles are also intermolecularly deactivated each other under the crosslinking condition. The resultant crosslinked particles having the decomposition temperature lower than that of the host-matrix material is mixed with the host-matrix material, heated up to the decomposition temperature of the crosslinked particle to irreversibly decompose the particles into the porous dielectric material. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供用于诸如集成电路的电子设备中的多孔电介质材料。 解决方案：通过在合成聚合物分子中活化可交联基团来制备交联颗粒。 可交联基团是惰性的，直到活化，并且当被活化时，经历不可逆的分子内交联反应以形成交联颗粒。 此外，交联颗粒在交联条件下与聚合物分子分子失活。 交联颗粒在交联条件下也分子内失活。 将得到的分解温度低于主体 - 基体材料的交联颗粒与主体 - 基体材料混合，加热到交联颗粒的分解温度，以将颗粒不可逆地分解成多孔电介质材料。 版权所有（C）2009，JPO＆INPIT

    PRODUCTION OF CELLULAR POLYMER
    3.
    发明专利
    PRODUCTION OF CELLULAR POLYMER 失效

    公开(公告)号：JPH1025359A

    公开(公告)日：1998-01-27

    申请号：JP8623697

    申请日：1997-04-04

    Applicant: IBM

    Inventor： JEFFREY CURTIS HEDRICK ,  JAMES LUPTON HEDRICK ,  YUN C RYAO ,  ROBERT DENIS MILLER ,  TAA YUAN SHII

    IPC: C08J9/00 ,  C08J9/26 ,  H05K1/03

    Abstract: PROBLEM TO BE SOLVED: To obtain a cellular polymer capable of having extremely small and uniformly dispersed fine pores and suitable for using as an electronic part by performing a reaction comprising three steps by using a precursor of a polysiloxane and heat decomposable particles. SOLUTION: This cellular polysiloxane polymer is obtained by (A) dispersing heat decomposable particles in a polysiloxane precursor, then (B) forming a hard polysiloxane by polymerizing (and preferably crosslinking) the polysiloxane precursor without decomposing the particles, and (C) heating the polysiloxane to decompose to particles without expanding the polysiloxane. Further, the above particles preferably contain a polymethyl methacrylate. The pore diameter of the obtain cellular material is preferably and approximately 1-10μm. Thus, the fine pores are uniformly dispersed in the bulk of the polymer, and the pore diameter can be adjusted by changing the size of the heat decomposable particles.

    Reworkable thermoplastic encapsulating material
    5.
    发明专利
    Reworkable thermoplastic encapsulating material 有权
    可重复使用的热塑性防护材料

    公开(公告)号：JPH11274376A

    公开(公告)日：1999-10-08

    申请号：JP36146698

    申请日：1998-12-18

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレイション

    Inventor： KENETH RAYMOND CARTER ,  CRAIG JOHN HOKER ,  JAMES LUPTON HEDRICK ,  ROBERT DENNIS MILLER ,  GAYNES MICHAEL ANTHONY ,  BUCHWALTER STEPHEN LESLIE

    IPC: H01L21/56 ,  H01L23/29 ,  H01L23/31

    CPC classification number: H01L21/563 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2224/0401

    Abstract: PROBLEM TO BE SOLVED: To make an encapsulating material reworkable for permitting respective devices to be repaired and replaced under the environment of integrated circuit assembly, by making the encapsulating material contain a thermoplastic polymer, which is formed adjacent to solder bonding and composed of ring- opening polymerization of ring oligomer.
    SOLUTION: An ring oligomer in an encapsulating material forms a thermally stable polymer, which is properly formed upon application at a region applied by ring-opening polymerization. Therefore, the encapsulating material can be simply melted adjacent to a chip from a hotmelt and can be flowed into an assembly by capillary action. The encapsulating material can be reworked by simply concentrating heat on a specific device, heating the thermoplastic polymer to a temperature above its melting temperature Tg and by melting solder. Then, the chip can be removed from a board. The normal reworking temperature is within a range of approximately 250-400°C.
    COPYRIGHT: (C)1999,JPO

    Abstract translation: 要解决的问题：为了使封装材料可再加工以允许在集成电路组件的环境下修复和更换相应的器件，通过使封装材料包含邻近焊接接合形成的热塑性聚合物， 环低聚物的开环聚合。 解决方案：封装材料中的环状低聚物形成热稳定的聚合物，其在通过开环聚合应用的区域适当形成。 因此，封装材料可以从热熔体中简单地熔融到芯片附近，并且可以通过毛细管作用流入组件。 可以通过简单地将热量集中在特定装置上，将热塑性聚合物加热至高于其熔融温度Tg的温度并通过熔化焊料来重新加工封装材料。 然后，可以从电路板上取下芯片。 正常的返工温度在约250-400摄氏度的范围内。

    Porous dielectric material and method for producing the same
    7.
    发明专利
    Porous dielectric material and method for producing the same 有权
    多孔电介质材料及其制造方法

    公开(公告)号：JP2005330495A

    公开(公告)日：2005-12-02

    申请号：JP2005215082

    申请日：2005-07-25

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： CRAIG JOHN HOKER ,  JAMES LUPTON HEDRICK ,  LEE VICTOR YEE-WAY ,  ROBERT DENNIS MILLER

    IPC: C08J3/12 ,  C08J3/24 ,  C08J3/28 ,  C08J9/04 ,  H01L21/312 ,  H01L21/316 ,  H01L21/768 ,  H01L23/522

    CPC classification number: H01L21/316 ,  C08J3/24 ,  H01L21/312

    Abstract: PROBLEM TO BE SOLVED: To provide a porous dielectric material applicable to electronic devices such as integrated circuits. SOLUTION: Crosslinked particles are produced by activating the crosslinkable groups on synthetic polymer. The crosslinkable groups are inert until activated and, when activated, undergo an irreversible intramolecular crosslinking reaction to form crosslinked particles. And the crosslinked particles are inert to the polymer molecules in intermolecular crosslinking under crosslinking conditions, and are inert to each other in intermolecular crosslinking under crosslinking conditions. The thus obtained crosslinked particles having a lower decomposition temperature than that of the host matrix material are mixed with the host matrix material, and the compound is heated to the decomposition temperature of the crosslinked particles to decompose the crosslinked particles so as to produce the porous dielectric material. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供可应用于诸如集成电路的电子器件的多孔电介质材料。 解决方案：通过活化合成聚合物上的可交联基团来制备交联颗粒。 可交联基团是惰性的，直到活化，并且当被活化时，经历不可逆的分子内交联反应以形成交联颗粒。 并且交联颗粒在交联条件下在分子间交联中对聚合物分子是惰性的，并且在交联条件下在分子间交联中彼此是惰性的。 将如此获得的具有比主体基质材料低的分解温度的交联颗粒与主体基质材料混合，并将化合物加热至交联颗粒的分解温度以分解交联颗粒，从而产生多孔介电 材料。 版权所有（C）2006，JPO＆NCIPI

    INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE
    9.
    发明专利
    INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE 失效

    公开(公告)号：JPH10135200A

    公开(公告)日：1998-05-22

    申请号：JP25820497

    申请日：1997-09-24

    Applicant: IBM

    Inventor： KENETH RAYMOND CARTER ,  JAMES LUPTON HEDRICK ,  ROBERT DENNIS MILLER

    IPC: C08G77/452 ,  C08L83/10 ,  H01L21/312 ,  H01L21/314 ,  H01L21/768 ,  H01L23/522

    Abstract: PROBLEM TO BE SOLVED: To obtain an integrated circuit having a low dielectric constant by forming a dielectric material, composed of a resulted product of a reaction between organic polysilica and a precursor polymer selected out among uncylized polybenzooxazole, polybenzothiazole, and polybenzoimidazole adjacently to metallic circuit wiring for interconnection on a substrate. SOLUTION: The mechanical characteristic, polishability, anisotropy, optical characteristic, and dielectric characteristic of an integrated circuit device are improved and, at the same time, a mechanical characteristic that can withstand cracking is given to the device and the device is chemically and mechanically flattened by providing metallic circuit wiring 4 and a dielectric material 6 on a substrate 2 and vertical metallic studs 8 in the substrate 2 and constituting the material 6 which is put on or between the wiring 4 of the resultant product of a reaction between organic polysilica and a precursor polymer selected from among linear uncyclized polybenzooxazole, polybensothiazole, and polybenzoimidazole.

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