Abstract:
PROBLEM TO BE SOLVED: To obtain an integrated circuit device having a low dielectric constant by forming a dielectric material containing hardened polyamic acid ester adjacently to metallic circuit wiring for interconnection on a substrate. SOLUTION: Metallic circuit wiring 4 and a dielectric material 6 are provided on the surface of a substrate 2 and vertical metallic studs 8 are provided in the substrate 2. The material 6 which is put on, around, and/or between the wiring 4 is constituted of imidized polyamic acid ester, containing (RO)m (R")n SiR' as an end group, where m, n, R and R', and R" respectively represent 1, 2, or 3, m+n=3, hydrocarbyl groups, and a hydride or hydrocarbyl group. This dielectric composition presents a low coefficient of thermal expansion of 1000×10 at a high temperature. Therefore, an integrated circuit element having a high mechanical characteristic, a high frictional characteristic, a highly uniform optical characteristics, and a high dielectric characteristic can be obtained, because the cracking of films can be avoided during succeeding heat treatment processes.
Abstract:
PROBLEM TO BE SOLVED: To provide a porous dielectric material used in electronic devices such as integrated circuits. SOLUTION: Crosslinked particles are manufactured by activating crosslinkable groups in synthetic polymer molecules. The crosslinkable groups are inert until activated and, when activated, undergo an irreversible intramolecular crosslinking reaction to form crosslinked particles. Further, the crosslinked particles are intermolecularly deactivated to the polymer molecules under the crosslinking condition. The crosslinked particles are also intermolecularly deactivated each other under the crosslinking condition. The resultant crosslinked particles having the decomposition temperature lower than that of the host-matrix material is mixed with the host-matrix material, heated up to the decomposition temperature of the crosslinked particle to irreversibly decompose the particles into the porous dielectric material. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To obtain a cellular polymer capable of having extremely small and uniformly dispersed fine pores and suitable for using as an electronic part by performing a reaction comprising three steps by using a precursor of a polysiloxane and heat decomposable particles. SOLUTION: This cellular polysiloxane polymer is obtained by (A) dispersing heat decomposable particles in a polysiloxane precursor, then (B) forming a hard polysiloxane by polymerizing (and preferably crosslinking) the polysiloxane precursor without decomposing the particles, and (C) heating the polysiloxane to decompose to particles without expanding the polysiloxane. Further, the above particles preferably contain a polymethyl methacrylate. The pore diameter of the obtain cellular material is preferably and approximately 1-10μm. Thus, the fine pores are uniformly dispersed in the bulk of the polymer, and the pore diameter can be adjusted by changing the size of the heat decomposable particles.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing magnetic nanoparticles sufficiently dispersed in a polymer matrix. SOLUTION: Nanoparticles are non-ferromagnetic or weakly ferromagnetic. A dispersion liquid is annealed at the temperature T FM in which non-ferromagnetic nanoparticles are transformed into ferromagnetic nanoparticles and the ferromagnetism in weakly ferromagnetic nanoparticles is increased. A magnetic field is applied to the dispersion liquid, and the nanoparticles are aligned while the dispersion liquid is heated to the temperature T A . COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To make an encapsulating material reworkable for permitting respective devices to be repaired and replaced under the environment of integrated circuit assembly, by making the encapsulating material contain a thermoplastic polymer, which is formed adjacent to solder bonding and composed of ring- opening polymerization of ring oligomer. SOLUTION: An ring oligomer in an encapsulating material forms a thermally stable polymer, which is properly formed upon application at a region applied by ring-opening polymerization. Therefore, the encapsulating material can be simply melted adjacent to a chip from a hotmelt and can be flowed into an assembly by capillary action. The encapsulating material can be reworked by simply concentrating heat on a specific device, heating the thermoplastic polymer to a temperature above its melting temperature Tg and by melting solder. Then, the chip can be removed from a board. The normal reworking temperature is within a range of approximately 250-400°C. COPYRIGHT: (C)1999,JPO
Abstract:
PROBLEM TO BE SOLVED: To reduce required drive current and power consumption for the device, by laying interconnecting metal circuit lines on a substrate and disposing a specified dielectric material adjacent to the circuit lines. SOLUTION: The device comprises a substrate 2, meal circuit lines 4' and a dielectric material 6. The substrate 2 has vertical studs 8 formed therein. The dielectric material 6 in an org. polysilica, pref. a reaction product with polyaminate, having a terminal group (RO)m (R'')n SiR'-; m=1, 2 or 3, m+n=3, R and R' are hydrocarbyl group, R'' is hydride or hydrocarbyl group. The terminal group is a mono-, di- or tri-C1-C10 alkoxysilyl C1-10 alkyl or aryl group. This lowers the dielectric const. of the inserted dielectric material to allow the circuit line spacing to be reduced, without increasing the crosstalk or capacitive coupling, and also reduces the drive current and power consumption.
Abstract:
PROBLEM TO BE SOLVED: To provide a porous dielectric material applicable to electronic devices such as integrated circuits. SOLUTION: Crosslinked particles are produced by activating the crosslinkable groups on synthetic polymer. The crosslinkable groups are inert until activated and, when activated, undergo an irreversible intramolecular crosslinking reaction to form crosslinked particles. And the crosslinked particles are inert to the polymer molecules in intermolecular crosslinking under crosslinking conditions, and are inert to each other in intermolecular crosslinking under crosslinking conditions. The thus obtained crosslinked particles having a lower decomposition temperature than that of the host matrix material are mixed with the host matrix material, and the compound is heated to the decomposition temperature of the crosslinked particles to decompose the crosslinked particles so as to produce the porous dielectric material. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To obtain a crosslinked particle useful for manufacturing a dielectric material used for an electronic device such as an integrated circuit. SOLUTION: The crosslinked particle is manufactured by activating a crosslinkable group in a synthetic polymer. The crosslinkable group remains inactive until it is activated and, when activated, an intramolecular crosslinking reaction occurs irreversibly and the crosslinked particle is formed. In terms of intermolecular crosslinking, the crosslinked particle is kept inactive with each other and against the polymer molecule under the crosslinking condition. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To obtain an integrated circuit having a low dielectric constant by forming a dielectric material, composed of a resulted product of a reaction between organic polysilica and a precursor polymer selected out among uncylized polybenzooxazole, polybenzothiazole, and polybenzoimidazole adjacently to metallic circuit wiring for interconnection on a substrate. SOLUTION: The mechanical characteristic, polishability, anisotropy, optical characteristic, and dielectric characteristic of an integrated circuit device are improved and, at the same time, a mechanical characteristic that can withstand cracking is given to the device and the device is chemically and mechanically flattened by providing metallic circuit wiring 4 and a dielectric material 6 on a substrate 2 and vertical metallic studs 8 in the substrate 2 and constituting the material 6 which is put on or between the wiring 4 of the resultant product of a reaction between organic polysilica and a precursor polymer selected from among linear uncyclized polybenzooxazole, polybensothiazole, and polybenzoimidazole.
Abstract:
PROBLEM TO BE SOLVED: To provide a composite membrane with a performance enhancing layer, in which resistance to fouling is greatly enhanced in comparison with that of an non-coated membrane. SOLUTION: The composite membrane includes a filtration membrane with a surface and a layer on the surface of the filtration membrane. The layer includes a polymer including a poly(ethylene glycol) moiety cross-linked with ammonium salt or a precursor of the ammonium salt. COPYRIGHT: (C)2011,JPO&INPIT